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BC Components 49.9Ω, 0603 (1608M) Thin Film SMD Resistor ±0.1% 0.1W - MCT06030D4999BP500

CHIP

CHIP

Thick Film Resistors - SMD 1206 10Kohm 1% High VoltageAEC-Q200

MAXIM INTEGRATED PRODUCTS - MAX3646ETG+T - Laser Diode Driver, SFP/SFF Optical Modules, 3.3V Supply, TQFN-24

MAXIM INTEGRATED PRODUCTS - MAX3949ETE+T - Laser Diode Driver, SFP/SFF Optical Modules, 11.3Gbps, 2.95V to 3.63V, TQFN-16

Configuration Features: Number of Rear EONs per Port Column 2 | Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.45 MM | PCB Thickness (Recommended) .057 INCH | Housing Features: Cage Material Nickel Silver | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ Stacked Belly-to-Bell

UCR18EVHFSR020 from ROHM Semiconductor is a precision chip resistor for precision sensing, feedback dividers, current measurement, and signal conditioning. Key specifications include 13W, 2 pins, -55°C to 155°C, Resistor Chip package/footprint, supporting reliable selection for OEM maintenance, prototyping, and production BOMs. The Resistor Chip format supports standard assembly and sourcing workflows.

Body Features: Heat Sink Style Pin | Heat Sink Finish Anodized Black | Heat Sink Height 4.2 MM | Heat Sink Height Class PCI | Heat Sink Height .165 INCH | Configuration Features: Number of Rear EONs per Port Column 2 | Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.45 MM | PCB Thickness (Recommended) .057 INCH | Electrical Characteristics: Data Rate (Max) 14 GBS | Housing Features: Cage Mat

Use the download button to access the 75800-0001 schematic symbol, PCB footprint, and 3D model.

Configuration Features: Port Matrix Configuration 1 x 3 | Number of Ports 3 | Number of Rear EONs per Port Column 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) .057 INCH | PCB Thickness (Recommended) 1.45 MM | Housing Features: Cage Material Nickel Silver | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Circuit Application Signal | Pluggable I/O Applications SFP+ Stacked Belly-to-Belly | Heat Sink Compatible Ye

Configuration Features: Number of Positions 30 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Base Material Phosphor Bronze | Electrical Characteristics: Data Rate (Max) 10 GBS | Housing Features: Housing Material LCP (Liquid Crystal Polymer) | Centerline (Pitch) .03 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flamm

Configuration Features: Number of Rear EONs per Port Column 2 | Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.45 MM | PCB Thickness (Recommended) .057 INCH | Housing Features: Cage Material Nickel Silver | Industry Standards: UL Flammability Rating UL 94V-0 | Operation/Application: Pluggable I/O Applications SFP+ Stacked Belly-to-Belly | Heat Sink Compatible Yes | Circuit Application Signa

Body Features: Heat Sink Height Class PCI | Heat Sink Height 4.2 MM | Heat Sink Finish Anodized Black | Heat Sink Height .165 INCH | Heat Sink Style Pin | Configuration Features: Number of Rear EONs per Port Column 1 | Number of Ports 4 | Port Matrix Configuration 1 x 4 | Contact Features: PCB Contact Termination Area Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.45 MM | PCB Thickness (Recommended) .057 INCH | Housing Features: Cage Material Nickel Silver | Industry Standards: UL Flammabi

Configuration Features: Number of Positions 30 | Contact Features: Contact Current Rating (Max) .5 AMP | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 29.92 MICIN | Contact Mating Area Plating Material Thickness .76 MICM | Contact Base Material Phosphor Bronze | Electrical Characteristics: Data Rate (Max) 10 GBS | Housing Features: Housing Material LCP (Liquid Crystal Polymer) | Centerline (Pitch) .03 INCH | Centerline (Pitch) .8 MM | Industry Standards: UL Flamm

Body Features: Cage Plating Material Tin | Primary Product Material Aluminum | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: Contact Mating Area Plating Material Gold | Dimensions: Product Width 21.7 MM | Product Length 65.53 MM | Electrical Characteristics: Data Rate (Max) 10 GBS | Housing Features: Cage Material Copper Alloy | Housing Material LCP (Liquid Crystal Polymer) | Industry Standards: UL Flammability Rating UL 94V-0 | Mechanical Attachment: PCB Mo

Body Features: Connector Profile Standard | Cable Exit Angle 90° | Configuration Features: Number of Power Positions 5 | Number of Positions 5 | Number of Signal Positions 0 | Number of Rows 1 | Contact Features: Wire Contact Termination Area Plating Thickness 80 – 200 MICIN | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Receptacle | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Finish Matte | Wire Contact Termi

ROHS COMPLIANT

Body Features: Primary Product Material Zinc Alloy | Housing Features: Compatible With Connector Shape Rectangular | Packaging Features: Packaging Method Carton | Product Type Features: Connector Cover Type EMI Dust Cover |