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PBHV8560Z is a 600V 3-Pin capacitor by Nexperia. Key specs: 600V, 3-Pin, 0.5A. From quote-based pricing, in stock with worldwide shipping for production sourcing for production BOM sourcing.

SILICON LABS - SI8273DB-IS1 - HIGH CMTI DRIVER, 2IN,4A, 2.5KV, SOIC-16

Use the download button to access the 91A1A-B28-B13L schematic symbol, PCB footprint, and 3D model.

Use the download button to access the IRF1310NPBF schematic symbol, PCB footprint, and 3D model.

SMD Comm X7R SnPb, Ceramic, 0.1 uF, 10%, 50 VDC, 125 VDC, 125°C, -55°C, X7R, SMD, MLCC, Temperature Stable, SnPb Termination, 2.5 % , 5 GOhms, 4.8 mg, 0603, 1.6mm, 0.8mm, 0.8mm, 0.7mm, 0.35mm, 4000, 78 Weeks, 80

Use the download button to access the SFH600-1 schematic symbol, PCB footprint, and 3D model.

Gate Drivers High CMTI 2.5 kV 12 V UVLO HS/LS isolated driver with deglitch

REC002004AYPP5N00000 is a Microtips Technology Display for industrial electronics, repair sourcing, prototype builds, and production BOM support. It combines 0°C to 0°C with Other with 20 pins. FindMyChip supports technical sourcing, stock checks, and worldwide shipping for this part.

SILICON LABS - SI8273GB-IS1 - Digital Isolator, 2 Channel, 60 ns, 2.5 V, 5.5 V, SOIC, 16 Pins

SILICON LABS - SI8273GBD-IS1 - HIGH CMTI DRIVER, 2IN,4A, 2.5KV, SOIC-16

CHIP

SILICON LABS - SI8273AB-IS1 - Digital Isolator, 2 Channel, 60 ns, 2.5 V, 5.5 V, SOIC, 16 Pins

Thick Film Resistors - SMD 1206 2MOhm 1% High VoltageAEC-Q200

SILICON LABS - SI8273ABD-IS1 - Digital Isolator, 2 Channel, 60 ns, 2.5 V, 5.5 V, SOIC, 16 Pins

ROHS COMPLIANT

RF Connectors / Coaxial Connectors BNC JACK R/A 75OHM PCB BK

RF Connectors / Coaxial Connectors BNC RA Double ISOL Black 50 OHM Valox

Use the download button to access the 73137-5003 schematic symbol, PCB footprint, and 3D model.

Body Features: Body Material Zinc | Cable Connector Orientation Straight | Body Plating Material Nickel | Configuration Features: Number of Positions 1 | Number of Coaxial Contacts 1 | Contact Features: RF Connector Center Contact Plating Material Gold | RF Connector Center Contact Plating Thickness 1080 MICIN | Crimp Type Dual | RF Connector Center Contact Underplating Material Nickel | RF Connector Center Contact Material Beryllium Copper | Dimensions: RF Connector Mated Outer Diameter (Approximate) 14.53

Use the download button to access the 73100-0105 schematic symbol, PCB footprint, and 3D model.