Search Electronic Components
IHLP2525EZER1R0M01InductorIn Stock
Vishay
Shielded construction • Frequency range below 1.0 MHz • Lowest DCR/μH, in this package size • Powdered iron composition provides soft saturation • Handles high transient current spikes without saturation • Saturation and inductance extremely stable over temperature • Ultra low buzz noise, due to composite construction • IHLP design; PATENT(S): www.vishay.com/patents • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912
From $0.63
TNPW04021K00BEEDResistorIn Stock
Vishay
TNPW04021K00BEED from Vishay is a precision chip resistor for precision sensing, feedback dividers, current measurement, and signal conditioning. Key specifications include 15A, 2 pins, -55°C to 125°C, supporting reliable selection for OEM maintenance, prototyping, and production BOMs.
From $0.03
TNPW040230K1BEEDResistorIn Stock
Vishay
TNPW040230K1BEED from Vishay is a precision chip resistor for precision sensing, feedback dividers, current measurement, and signal conditioning. Key specifications include 15A, 2 pins, -55°C to 125°C, supporting reliable selection for OEM maintenance, prototyping, and production BOMs.
From $0.03
IHLP2525EZER2R2M01InductorIn Stock
Vishay
VISHAY - IHLP2525EZER2R2M01 - INDUCTOR, 2.2UH, 10A, 20%, SMD
From $0.56
2-640445-3In Stock
TE Connectivity
Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Power Positions 23 | Number of Positions 23 | Contact Features: Mating Post Length .4 INCH | PCB Contact Termination Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Current Rating (Max) 7 AMP | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Underplating
From $0.51
1-640445-3In Stock
TE Connectivity
Configuration Features: PCB Mount Orientation Vertical | Number of Rows 1 | Number of Power Positions 13 | Number of Positions 13 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Mating Post Length 10.16 MM | Contact Current Rating (Max) 7 AMP | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Layout Inline | Contact Underplating Material Thickness 1.27 MICIN |
From $0.11
MRA4005T3GDiodeIn Stock
ON Semiconductor
Finish: All External Surfaces are Corrosion Resistant and Terminal Leads are Readily Solderable; Weight: 70 mg (Approximately); Compact Package with J-Bend Leads Ideal for Automated Handling; Available in 12 mm Tape, 5000 Units per 13 inch Reel, Add "T3" Suffix to Part Number; Polarity: Notch and Band in Plastic Body Indicates Cathode Lead; Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 seconds in Solder Bath; Case: Molded Epoxy Epoxy meets UL94, VO at 1/8"; Marking: MRA4003
From $0.03
CGA8N4X7T2W474K230KACapacitorIn Stock
TDK
TDK - CGA8N4X7T2W474K230KA - SMD Multilayer Ceramic Capacitor, 0.47 ?F, 450 V, 1812 [4532 Metric], ? 10%, X7T, CGA Series
From $0.17
DTSM31NVSwitchIn Stock
Apem
DTSM31NV from Apem is a Switch for industrial controls, embedded electronics, maintenance sourcing, and production assemblies. Key specifications include 50mA, 12V, 2 pins, supporting reliable selection for OEM maintenance, prototyping, and production BOMs.