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Plastic Film Capacitor, Stacked metallized PPS film as dielectric with simple mold-less construction

7 X 7 MM, 0.50 MM PITCH, LEAD FREE, QFN-48

CoolRunner II 32 macrocells VQFP XC2C32A-6VQG44C, CPLD CoolRunner II 32 Cells, 33 I/O, 2 Labs, ISP, 1.7 → 1.9 V 44-Pin VTQFP

Use the download button to access the M20-8770342R schematic symbol, PCB footprint, and 3D model.

SparkFun Accessories PICAXE 08M2 Microcontroller (8 pin)

Thick Film Resistors - SMD 1/8watt 120ohms 5% 200ppm

Pulse Proof, High Power Thick Film Chip Resistors, 0805

VISHAY - CRCW0805120RJNEA - RES, THICK FILM, 120R, 5%, 0.125W, 0805, REEL

Crystals 32.768KHz 12.5pF 20ppm -40C +85C

Configuration Features: Number of Power Positions 0 | Number of Signal Positions 0 | Number of Positions 1 | Contact Features: Contact Type Blade | Contact Retention Within Housing Without | Dimensions: Product Length .96 INCH | Product Length 22.4 MM | Wire Size 2 AWG | Wire Size 67100 – 69073 CMA | Product Width 22.4 MM | Compatible Insulation Diameter Range 15 MM | Connector Height 2.74 INCH | Wire Size 34 – 35 MMSQ | Product Width .96 INCH | Connector Height 69.6 MM | Compatible Insulation Diameter

Thick Film Resistors - SMD 470K OHM 1%

PANASONIC ELECTRONIC COMPONENTS - ERJ3EKF78R7V - RES, THICK FILM, 78R7, 1%, 0.1W, 0603

XC7VX690T-1FFG1761C is a XILINX integrated circuit for industrial electronics, maintenance builds, prototypes, and OEM production assemblies. Key details include 16 W, 1818 MHz, BGA package. From RFQ pricing with in-stock sourcing checks and worldwide shipping support through FindMyChip.

Contact Features: Contact Base Material Copper Alloy | Contact Underplating Material Thickness 50 MICM | Contact Mating Area Plating Material Silver | Contact Underplating Material Thickness 1.27 MICIN | Contact Retention Within Housing With | Mating Tab Thickness .236 INCH | Mating Tab Width .5 INCH | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Finish Bright | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Thickness

Contact Features: Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Tab Width .81 INCH | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Thickness 40 – 60 MICIN | Contact Retention Within Housing With | Mating Tab Thickness 8.23 MM | Contact Orientation Straight | Mating Tab Width 20.6 MM | Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Underplating Material Nickel | Contact Current Rating (Max) 350 AMP | Contact Mating Area Pla

UMNL BULKHEAD CONN,9 POS

Xilinx XC3S50AN-4TQG144C, FPGA Field Programmable Gate Array Spartan-3AN 1584 Cells, 50000 Gates, 11264bit, 1584 Blocks,

Configuration Features: Number of Positions 1 | Number of Power Positions 0 | Number of Signal Positions 0 | Contact Features: Contact Retention Within Housing Without | Contact Type Blade | Dimensions: Wire Size 34 – 35 MMSQ | Connector Height 69.6 MM | Connector Height 2.74 INCH | Compatible Insulation Diameter Range 15 MM | Product Length .96 INCH | Product Width 22.4 MM | Wire Size 67100 – 69073 CMA | Wire Size 2 AWG | Product Width .96 INCH | Compatible Insulation Diameter Range .591 INCH | Product

Configuration Features: Connection Capacity Single | Compatible With Wire & Cable Type Discrete Wire | Contact Features: Terminal Plating Material Tin | Mating Tab Width .11 INCH | Crimp Type F-Crimp | Contact Base Material Brass | Mating Tab Width 2.8 MM | Mating Tab Thickness .02 INCH | Barrel Type Open | Quick Disconnect Terminal Type Receptacle | Terminal Orientation Straight | Mating Tab Thickness .51 MM | Dimensions: Product Length 14 MM | Compatible Insulation Diameter Range 2.03 – 3 MM | Wire Size