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CHIP

SMD, MnO2, Molded

CHIP

Multilayer Ceramic Capacitors MLCC - SMD/SMT 0402 10uF 6.3volts *Derate Voltage/Temp

MULTILAYER CERAMIC CHIP CAPACITORS, 1608, Commercial grade, general (Up to 75V)

Multilayer Ceramic Capacitors MLCC - SMD/SMT 10uF 100 Volt

KEMET 10μF Polypropylene Capacitor PP 1.1kV dc ±5% Tolerance Through Hole C4AE Series

Multilayer Ceramic Capacitors MLCC - SMD/SMT 0201 0.47uF 4volts *Derate Voltage/Temp

0.64III RCPT NON SEALED (TYPE1)

Contact Features: Contact Type Socket | Mating Square Post Dimension .64 MM | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Base Material Brass | Contact Current Rating (Max) 2 AMP | Mating Square Post Dimension .025 INCH | Dimensions: Wire Size .05 – .15 MMSQ | Wire Size 30 – 26 AWG | Compatible Insulation Diameter Range .039 – .055 INCH | Compatible Insulation Diameter Range 1 – 1.4 MM | Electrical Characteristics: Dielectric Withstanding V

Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.032 – 5.08 MICM | Contact Base Material Brass | PCB Contact Termination Area Plating Material Thickness 2.032 – 5.08 MICM | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 80 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 6 AMP | Contact Type Hermaphroditic | Contact Orientation Straight | Contact Ma

2.00mm Pitch, iGrid Female Crimp Terminal, Tin (Sn) Plating, 26-22 AWG, Reel

Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Precious Metal | Contact Orientation Straight | Contact Mating Area Plating Material Thickness .76 MICM | Contact Size Size 16 | Contact Underplating Material Nickel | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Type Pin | Contact Base Material Brass | Contact Retention Within Housing With | Contact Underplati

Contact Features: Wire Contact Termination Area Plating Thickness 31.49 MICIN | Contact Base Material Brass | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness .8 MICM | Mating Pin Diameter 1 MM | Contact Type Socket | Mating Pin Diameter .039 INCH | Contact Orientation Straight | Contact Current Rating (Max) 7 AMP | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 31.49 MIC

M20: Receptacle 22-30 AWG Straight Crimp Contact reeled Gold

CLIK-Mate and IllumiMate 1.25mm Pitch Crimp Terminal, Male, Tin Plating, 28-26 AWG, Reel

R46 310 VAC, Film, Metallized Polypropylene, Safety, 0.33 uF, 20%, 310 VAC, 310 VAC (X2), 310 VAC, 630 VDC, 110°C, -40°C, 110°C, 0.1 % , 100 GOhms, 400 V/us, 2, 1 g, 18mm, 14.5mm, 8.5mm, Lead Spacing = 15mm, 1000

R46 310 VAC, Film, Metallized Polypropylene, Safety, 3.3 uF, 20%, 310 VAC, 310 VAC (X2), 310 VAC, 630 VDC, 110°C, -40°C, 110°C, 0.1 % , 9.0909 GOhms, 150 V/us, 2, 20.27 g, 32mm, 33mm, 18mm, Lead Spacing = 27.5mm, 256

R46 310 VAC, Film, Metallized Polypropylene, Safety, 0.022 uF, 10%, 310 VAC, 310 VAC (X2), 310 VAC, 630 VDC, 110°C, -40°C, 110°C, 0.1 % , 100 GOhms, 500 V/us, 2, 0.637 g, 13mm, 9mm, 4mm, Lead Spacing = 10mm, 1800

R46 310 VAC, Film, Metallized Polypropylene, Safety, 0.47 uF, 10%, 310 VAC, 310 VAC (X2), 310 VAC, 630 VDC, 110°C, -40°C, 110°C, 0.1 % , 63.8298 GOhms, 200 V/us, 2, 2.5 g, 26.5mm, 16mm, 7mm, Lead Spacing = 22.5mm, 700