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BCX19LT1GTransistor BJT NPNIn Stock
ON Semiconductor
Use the download button to access the BCX19LT1G schematic symbol, PCB footprint, and 3D model.
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BCW68GLT3GTransistor BJT PNPIn Stock
ON Semiconductor
Use the download button to access the BCW68GLT3G schematic symbol, PCB footprint, and 3D model.
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BZX84B12LT1GZener DiodeIn Stock
ON Semiconductor
250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
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BZG03C15GZener DiodeIn Stock
ON Semiconductor
Standard Zener Breakdown Voltage − 15 V to 150 V; Peak Power 600 Watts @ 100 ms; ESD Rating of Class 3 (> 16 KV) per Human Body Model; Response Time is Typically < 1.0 ns; Flat Handling Surface for Accurate Placement; Package Design for Top Slide or Bottom Circuit Board Mounting
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BCW70LT1GTransistor BJT PNPIn Stock
ON Semiconductor
HALOGEN FREE AND ROHS COMPLIANT, CASE 318-08, 3 PIN
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BZX84C12LT1GZener DiodeIn Stock
ON Semiconductor
250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
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BCW65CLT1GTransistor BJT NPNIn Stock
ON Semiconductor
High Current: IC = -1.0 Amp; The SOT-23 Package can be soldered using wave or reflow.; NPN Complement is BCP68; SOT-23 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.; Available in 12 mm Tape and Reel Use BCP69T1 to order the 7 inch/1000 unit reel. Use BCP69T3 to order the 13 inch/4000 unit reel.; Pb-Free Packages are Available
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BZX84C10LT1GZener DiodeIn Stock
ON Semiconductor
250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
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1SMB5913BT3GZener DiodeIn Stock
ON Semiconductor
Zener Voltage Range - 3.3 V to 200 V; ESD Rating of Class 3 (>16 KV) per Human Body Model; Flat Handling Surface for Accurate Placement; Package Design for Top Side or Bottom Circuit Board Mounting Mechanical Characteristics:; CASE: Void-free, transfer-molded plastic; FINISH: All external surfaces are corrosion resistant with readily solderable leads; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 seconds; LEADS: Modified L-Bend providing more contact area to bond pads; POLARITY: Cathode indi
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BZX84B6V8LT1GZener DiodeIn Stock
ON Semiconductor
250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
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BZX84B7V5LT1GZener DiodeIn Stock
ON Semiconductor
250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
From $0.03
BZX84B15LT1GZener DiodeIn Stock
ON Semiconductor
250 mW Rating on FR-4 or FR-5 Board; Zener Breakdown Voltage Range - 2.4 V to 75 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (>16 KV) per Human Body Model; Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarity band; FLAMMAB
From $0.03
BCW68GLT1GTransistor BJT PNPIn Stock
ON Semiconductor
Use the download button to access the BCW68GLT1G schematic symbol, PCB footprint, and 3D model.
From $0.02
BCW33LT1GTransistor BJT NPNIn Stock
ON Semiconductor
Available in 12 mm Tape and Reel Use BCP69T1 to order the 7 inch/1000 unit reel. Use BCP69T3 to order the 13 inch/4000 unit reel.; NPN Complement is BCP68; High Current: IC = -1.0 Amp; SOT-23 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.; The SOT-23 Package can be soldered using wave or reflow.; Pb-Free Packages are Available;
From $0.01