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MMUN2132LT1GTransistor BJT PNPIn Stock
ON Semiconductor
Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant
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MMUN2133LT1GTransistor BJT PNPIn Stock
ON Semiconductor
Use the download button to access the MMUN2133LT1G schematic symbol and PCB footprint.
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MMSZ5268BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
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MSQA6V1W5T2GDiodeIn Stock
ON Semiconductor
Package Designed for Optimal Automated Board Assembly; Corrosion Resistant Finish, Easily Solderable; Low Capacitance (90 pF typical); Small Package Size for High Density Applications; SC88A Package Allows Four Separate Unidirectional Configurations; Void Free, Transfer-Molded, Thermosetting Plastic Case; Low Leakage < 1 mA @ 3 Volt; Breakdown Voltage: 6.1 Volt - 7.2 Volt @ 1 mA; ESD Protection Meeting IEC1000-4-2 Mechanical Characteristics; Pb-Free Package is Available; AEC-Q101 Qualified and PPAP Capable;
From $0.04
MMSZ5264BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
From $0.02
MMUN2115LT1GTransistor BJT PNPIn Stock
ON Semiconductor
Use the download button to access the MMUN2115LT1G schematic symbol, PCB footprint, and 3D model.
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MMSZ9V1T1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
From $0.02
MMUN2232LT1GTransistor RET NPNIn Stock
ON Semiconductor
Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant
From $0.01
MMSZ6V2T1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
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MMSZ5V6T3GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
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MMUN2116LT1GTransistor BJT PNPIn Stock
ON Semiconductor
Use the download button to access the MMUN2116LT1G schematic symbol and PCB footprint.
From $0.01
MMSZ56T1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; Wide Zener Reverse Voltage Range - 2.4 V to 56 V; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds; POLARITY: Cathode indicated by polarit
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MRS1504T3GDiodeIn Stock
ON Semiconductor
Weight: 95 mg (approximately); Compact Package with J-Bend Leads Ideal for Automated Handling; Stable, High Temperature, Glass Passivated Junction Mechanical Characteristics:; Polarity: Notch and/or band in Plastic Body Indicates Cathode Lead; Marking: RGG; Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable; Epoxy Meets UL94, VO at 1/8"; Maximum Temperature of 260 C / 10 Seconds for Soldering; Available in 12 mm Tape, 2500 Units per 13 inch Reel, Add "T3" Suffix to P
From $0.09
MMSZ5263BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
From $0.02
MMSZ5262BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
From $0.02
MMSZ5258BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
From $0.01
MMSZ5257BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
From $0.01
MMSZ5252BT1GZener DiodeIn Stock
ON Semiconductor
500 mW Rating on FR-4 or FR-5 Board; ESD Rating of Class 3 (exceeding 16 kV) per the Human Body Model Mechanical Characteristics:; Package Designed for Optimal Automated Board Assembly; Small Package Size for High Density Applications; Wide Zener Reverse Voltage Range - 2.4 V to 110 V; General Purpose, Medium Current; CASE: Void-free, transfer-molded, thermosetting plastic case; FINISH: Corrosion resistant finish, easily solderable; MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260?C for 10 Seconds; POLA
From $0.01