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CHIP

Battery Management 1.5A Dual-Input, USB/AC Adapter Charger and Smart Power Selector

Use the download button to access the 1-2834021-3 schematic symbol, PCB footprint, and 3D model.

High-Voltage HB LED Drivers with Integrated High-Side Current Sense

Analog Comparators Dual Single Supply

Analog Comparators Dual Single Supply

HALOGEN FREE

SAMTEC - TSW-130-16-G-T-LL - HEADER, 2.54MM, THT VERT, 90WAY

IPI041N12N3 G is a Infineon mosfet (n-channel) for industrial electronics, maintenance builds, prototypes, and OEM production assemblies. Key details include 120 V, 120 A, Transistor Outline, Vertical package. From RFQ pricing with in-stock sourcing checks and worldwide shipping support through FindMyChip.

Body Features: Product Weight 14.452 G | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Base Material Copper | Terminal Plating Material Tin | Terminal Plating Thickness 30 MICIN | Barrel Type Open | Dimensions: Compatible Insulation Diameter Range .401 INCH | Product Length .781 INCH | Terminal Material Thickness 1.85 MM | Terminal Material Thickness .073 INCH | Operation/Application: Compatible With Wire Base Material Aluminum | Packaging Features: Pack

HALOGEN FREE AND ROHS COMPLIANT

Use the download button to access the FH12A-10S-0.5SH(55) schematic symbol, PCB footprint, and 3D model.

HIROSE(HRS) - FH12-8S-1SH(55) - CONNECTOR, FPC/FFC, SMT, 1MM, 8WAY

Use the download button to access the FH12-6S-1SH(55) schematic symbol, PCB footprint, and 3D model.

Use the download button to access the SS22SDP2LC schematic symbol, PCB footprint, and 3D model.

C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.38µm Gold (Au) Selective Plating

Use the download button to access the 0297002.WXNV schematic symbol, PCB footprint, and 3D model.