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Configuration Features: Number of Positions 12 | Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Signal Positions 0 | Number of Power Positions 12 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Type Pin | Contact Retention Within Housing Without | PCB Contact Termination Area Plating Material

Configuration Features: Number of Positions 10 | PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 10 | Number of Signal Positions 0 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.03 MICM | PCB Contact Termination Area Plating Material

Configuration Features: PCB Mount Orientation Right Angle | Contacts Preloaded Yes | Number of Rows 2 | Number of Positions 18 | Contact Features: Contact Mating Area Plating Material Tin | Contact Layout Inline | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing With | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Dimensions: Wire Size .12 – 1.4 MMSQ | Wire Size 26 – 16 AWG | Product Width .512 INCH | PCB Thickness (Recommended) 1.6 MM | Product Length 39 MM

Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Contacts Preloaded Yes | Number of Positions 16 | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Type Pin | Contact Layout Inline | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Dimensions: Row-to-Row Spacing 4.2 MM | Wire Size .12 – 1.4 MMSQ | Product Width .512 INCH | Product Width 13 MM | Connector Height .384 INCH | Row-

Configuration Features: Number of Positions 14 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contacts Preloaded Yes | Contact Features: Contact Retention Within Housing With | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Type Pin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Dimensions: Product Width 13 MM | Compatible Insulation Diameter Range 1.2 – 3.2 MM | PCB Thickness (Recommended) 1.6 MM | Row-to-Row Spacing 4.2 MM

Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 12 | Number of Power Positions 12 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Type Pin | Dimensions: Product Widt

Configuration Features: PCB Mount Orientation Right Angle | Number of Power Positions 10 | Number of Positions 10 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Dimensions: Product Leng

Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Power Positions 18 | Number of Positions 18 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Matrix | Contact Layout Inline |

Configuration Features: Number of Rows 2 | Number of Signal Positions 16 | Number of Positions 16 | PCB Mount Orientation Right Angle | Contacts Preloaded Yes | Contact Features: Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Contact Layout Matrix | PCB Contact Termination Area Plating Material Tin | Dimensions: Wire Size .12 – 1.4 MMSQ | PCB Thickness (Recommended) .063 INCH | Wire Size 16 – 26 AWG | Connector H

Use the download button to access the 1-1586042-4 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 1-1586042-2 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 1-1586042-0 schematic symbol, PCB footprint, and 3D model.

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 18 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A

Use the download button to access the 1-1586041-6 schematic symbol, PCB footprint, and 3D model.

TE Connectivity VAL-U-LOK Series, 4.2mm Pitch 10 Way 2 Row Right Angle PCB Header, Solder, Through Hole Termination, 9A

Configuration Features: Number of Positions 18 | Number of Rows 2 | Contacts Preloaded Yes | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 9 AMP | Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing With | Contact Mating Area Plating Material Tin | Contact Layout Inline | Dimensions: Connector Height .504 INCH | Connector Height 12.8 MM | Product Length 1.535 INCH | Product Width 9.8 MM | PCB Thickness (Recommended) .063 I

Configuration Features: Number of Positions 16 | Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 16 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Type Pin | Dimensions: Product Length

Configuration Features: PCB Mount Orientation Vertical | Number of Power Positions 14 | Number of Rows 2 | Number of Positions 14 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | Contact Retention Within Housing Without | Contact Current Rating (Max) 9 AMP | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Dimensions: PCB Thickness (

Configuration Features: Number of Power Positions 12 | Number of Positions 12 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inline | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Current Rating (Max) 9 AMP | Dimensions: Compatible Insu

Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Power Positions 10 | Number of Positions 10 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 9 AMP | Contact Retention Within Housing Without | Contact Type Pin | Contact Mating Area Plating Material Thickness 2.03 MICM | PCB Contact Termination Area Plating Material Tin | Dimensions: Product Length