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Body Features: Header Mating Direction Horizontal | Primary Product Color White | Configuration Features: Number of Positions 2 | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICM | Contact Mating Area Plating Material Finish Matte | PCB Contact Termination Area Plating Material Thickness 3 MICM | PCB Contact Termination Area Plating Material Thickness 118.11 MICIN | Contact Layout Inline | Contact Current Rating (Max) 4 AMP | Contact Fabricat

Body Features: Heat Sink Height Class Networking Short | Heat Sink Height 4.2 MM | Heat Sink Style Pin | Heat Sink Height .165 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP

Body Features: Heat Sink Style Pin | Heat Sink Height .531 INCH | Heat Sink Height Class Networking Tall | Heat Sink Height 13.5 MM | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Circuit Application Signal | Heat Sink Compatible Yes | Pluggable I/O Applications SFP

Configuration Features: Port Matrix Configuration 2 x 6 | Number of Positions 240 | Number of Ports 12 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .8 MM | Cage Material Nickel Silver | Center

Configuration Features: Port Matrix Configuration 2 x 1 | Number of Ports 2 | Number of Positions 40 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage Ma

Configuration Features: Number of Ports 4 | Port Matrix Configuration 2 x 2 | Number of Positions 80 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent

Configuration Features: Number of Ports 2 | Port Matrix Configuration 1 x 2 | Dimensions: PCB Thickness (Recommended) 2.25 MM | PCB Thickness (Recommended) .089 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External EMI Springs | Packaging Features: Packaging Method Box | Product Type Features: Se

Configuration Features: Port Matrix Configuration 2 x 2 | Number of Positions 80 | Number of Ports 4 | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Tail Plating Material Tin | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Centerline (Pitch) .032 INCH | Cent

Configuration Features: Number of Power Positions 34 | Number of Signal Positions 34 | Number of Rows 4 | Number of Positions 34 | Contact Features: Contact Retention Within Housing With | Contact Type Socket | Contact Current Rating (Max) 13 AMP | Dimensions: Connector Height 50.8 MM | Row-to-Row Spacing .18 INCH | Product Length 23.24 MM | Connector Height 1.999 INCH | Product Width 19.05 MM | Product Length .915 INCH | Wire Size .05 – 2 MMSQ | Wire Size 30 – 14 AWG | Product Width .75 INCH | Row-to-R

Configuration Features: Number of Positions 75 | Number of Power Positions 75 | Number of Signal Positions 75 | Number of Rows 6 | Contact Features: Contact Type Pin | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Dimensions: Wire Size 30 – 14 AWG | Row-to-Row Spacing 4.57 MM | Product Width 1.11 INCH | Wire Size .05 – 2 MMSQ | Product Length .915 INCH | Connector Height 65.91 MM | Product Length 23.24 MM | Product Width 28.19 MM | Row-to-Row Spacing .18 INCH | Connector

Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Contact Features: Tail Plating Material Tin | Dimensions: PCB Thickness (Recommended) .059 INCH | PCB Thickness (Recommended) 1.5 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible No | Pluggable I/O Applications SFP+ | Other: EMI Containment Feature Type Internal/External EMI Springs | Included Lightpipe No | Packaging Features: Pac

Body Features: Heat Sink Style Pin | Heat Sink Height Class Networking Tall | Heat Sink Height 6.5 MM | Heat Sink Height .256 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ | Circuit Application Signal

Configuration Features: Number of Ports 1 | Port Matrix Configuration 1 x 1 | Dimensions: PCB Thickness (Recommended) .089 INCH | PCB Thickness (Recommended) 2.25 MM | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Pluggable I/O Applications SFP+ | Heat Sink Compatible No | Other: Included Lightpipe No | EMI Containment Feature Type Internal/External EMI Springs | Packaging Features: Packaging Method Tray | Product Type Features: S

Configuration Features: Number of Positions 75 | Number of Signal Positions 75 | Number of Power Positions 75 | Number of Rows 6 | Contact Features: Contact Type Socket | Contact Current Rating (Max) 13 AMP | Contact Retention Within Housing With | Dimensions: Connector Height 65.91 MM | Product Width 28.19 MM | Row-to-Row Spacing .18 INCH | Connector Height 2.595 INCH | Product Length 23.24 MM | Row-to-Row Spacing 4.57 MM | Wire Size 30 – 14 AWG | Product Width 1.11 INCH | Product Length .915 INCH | Wire

Configuration Features: Number of Ports 12 | Number of Positions 240 | Port Matrix Configuration 2 x 6 | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Tail Plating Material Tin | Contact Mating Area Plating Material Thickness .76 MICM | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Centerline (Pitch) .032 INCH | Centerline (Pitch) .8 MM | Cage

Body Features: Heat Sink Height 4.2 MM | Heat Sink Style Pin | Heat Sink Height Class PCI | Heat Sink Height .165 INCH | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Ports 1 | Dimensions: PCB Thickness (Recommended) 1.5 MM | PCB Thickness (Recommended) .059 INCH | Electrical Characteristics: Data Rate (Max) 16 GBS | Housing Features: Cage Material Nickel Silver | Operation/Application: Heat Sink Compatible Yes | Pluggable I/O Applications SFP+ | Circuit Application Signal | Other: Inc

TE Connectivity 2007042-1 is a connector for electronic assemblies. It is specified around 64 pins for matching footprints and electrical requirements. From inquiry pricing with worldwide shipping support.

Configuration Features: Number of Signal Positions 26 | Number of Rows 4 | Number of Positions 26 | Number of Power Positions 26 | Contact Features: Contact Type Socket | Contact Retention Within Housing With | Contact Current Rating (Max) 13 AMP | Dimensions: Wire Size .05 – 2 MMSQ | Product Width 14.22 MM | Wire Size 30 – 14 AWG | Product Width .56 INCH | Connector Height 1.63 INCH | Row-to-Row Spacing .13 INCH | Product Length .915 INCH | Row-to-Row Spacing 3.3 MM | Product Length 23.24 MM | Connecto

Configuration Features: Number of Rows 3 | Number of Positions 20 | Number of Power Positions 20 | Number of Signal Positions 20 | Contact Features: Contact Type Socket | Contact Retention Within Housing With | Contact Current Rating (Max) 13 AMP | Dimensions: Product Width .44 INCH | Wire Size 30 – 14 AWG | Row-to-Row Spacing 3.3 MM | Product Length .915 INCH | Product Width 11.18 MM | Product Length 23.24 MM | Row-to-Row Spacing .13 INCH | Connector Height 39.62 MM | Wire Size .05 – 2 MMSQ | Connector

Contact Features: Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Gold | Wire Contact Termination Area Plating Thickness .8 – 1.4 MICM | Contact Type Socket | Wire Contact Termination Area Plating Thickness 30 MICIN | Contact Size Size 16 | Contact Base Material Brass | Contact Mating Area Plating Material Thickness .8 – 1.4 MICM | Contact Orientation Straight | Mating Pin Diameter .062 INCH | Contact Underplating Material Thickness 1.27 MICM | Contact U