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TE Connectivity Free Height Series 1mm Pitch 64 Way 2 Row Straight SMT Male PCB Header

TE Connectivity Straight Cable Mount SHV Connector, Plug, Crimp Termination RG58 A/U, RG58 C/U

TE Connectivity Z-PACK HS3 Series 2.5mm Pitch High Speed Backplane Connector, Female, Right Angle, 10 Column, 10 Row

Body Features: Sleeve Material Copper | Sleeve Plating Material Tin | Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 4 AMP | Contact Base Material Beryllium Copper | Contact Spring Plating Material Tin | Contact Spring Plating Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Spring Plating Thickness 2.54 MICM | Dimensions: Socket Length 4.52 MM | Wire Size 28 – 22 AWG | PCB Hole Diameter .052 I

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 26 | Number of Rows 2 | Contact Features: Contact Shape & Form Square | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Pin | Mating Square Post Dimension .025 INCH | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact T

TE Connectivity Z-PACK HS3 Series 2.5mm Pitch High Speed Backplane Connector, Male, Straight, 5 Column, 6 Row, 30 Way

TE Connectivity Z-PACK HS3 Series 3 Way Straight PCB Socket Through Hole Board to Board

Body Features: Connector Profile Low | Primary Product Color Black | Daisy Chain With | Configuration Features: Number of Positions 16 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Underplating Material Nickel | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 15 MICIN | PCB

TE Connectivity Z-PACK HS3 Series 2.5mm Pitch High Speed Backplane Connector, Male, Straight, 5 Column, 6 Row, 30 Way

TE Connectivity AMPMODU Series 2.54mm 50 Way 2 Row Straight PCB Socket Through Hole Board to Board

TE Connectivity Z-PACK HM Series 2mm Pitch Hard Metric Type B Backplane Connector, Female, Right Angle, 12 Column

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 30 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 100 MICIN | Mating Square Post Dimension .64 MM | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Type Pin | Co

Body Features: Shell Plating Material Tin | Connector Profile Standard | Assembly Process Feature Material Phosphor Bronze | Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Positions 9 | PCB Mount Orientation Vertical | Contact Features: Contact Current Rating (Max) 6 AMP | Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Matin

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 26 | Contact Features: Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Current Rating (Max) 1 AMP | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Contact Shape & Form Squ

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TE Connectivity Z-PACK HS3 Series 2.5mm Pitch High Speed Backplane Connector, Male, Straight, 10 Column, 10 Row

Body Features: Primary Product Color Black | Guide Pin Style ESD/HDI | Shield Material Phosphor Bronze | Configuration Features: Number of Rows 6 | Stackable No | Number of Columns 5 | Backplane Architecture Traditional Backplane | Number of Positions 30 | PCB Mount Orientation Right Angle | Contact Features: Contact Current Rating (Max) 1.15 AMP | Contact Mating Area Plating Material Thickness 19.68 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Tin | PCB Contact Terminat

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Right Angle | Number of Positions 40 | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Mating Square Post Dimension .64 MM | Contact Current Rating (Max) 1 AMP | Contact Mating Area Plating Material Gold | Contact Type Pin | PCB Contact Termination Area Plating M

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 26 | Contact Features: PCB Contact Termination Area Plating Material Thickness 100 MICIN | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 1 AMP | Contact Type Pin | Contact Underplating Material Nickel | Mating Square Post Dimension .64 MM | Mating Square

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 20 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Thickness 2.54 MICM | Mating Square Post Dimension .64 MM | Contact Mating Area Plating Material Gold | Contact Shape & Form Square |