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Body Features: Shield Material Copper Alloy | Shield Plating Material Tin over Copper | Modular Jack Latch Orientation Standard - Latch Down | Grounding Tab Plating Material Tin over Copper | Connector Profile Low | Configuration Features: Status Light Type Not Illuminated | Port Configuration Multiple Ports | Multiple Port Configuration Stacked | Number of Positions 8 | Connector Contact Density Standard | Number of PCB Ground Tabs 13 | Number of Loaded Positions 8 | PCB Mount Orientation Right Angle | Por

Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Shield Material Copper Alloy | Grounding Tab Plating Material Tin over Copper | Shield Plating Material Tin over Copper | Configuration Features: Number of PCB Ground Tabs 9 | PCB Mount Orientation Right Angle | Port Matrix Configuration 2 x 4 | Multiple Port Configuration Stacked | Number of Loaded Positions 8 | Status Light Type Not Illuminated | Number of Positions 8 | Port Configuration Multiple Ports | Connect

Body Features: Shield Material Copper Zinc Alloy | PCB Ground Tab Location 4.57 MM | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location .18 INCH | Shield Plating Material Tin over Copper | Connector Profile Standard | Configuration Features: Connector Contact Density Standard | PCB Mount Orientation Right Angle | Port Matrix Configuration 1 x 6 | Status Light Type Not Illuminated | Number of Panel Ground Tabs 6 | Number of Positions 8 | Number of Loaded Positions 8 | Number of PC

Body Features: Shield Plating Material Nickel | Connector Profile Standard | Shield Material Copper Alloy | Modular Jack Latch Orientation Standard - Latch Down | PCB Ground Tab Location 4.57 MM | PCB Ground Tab Location .18 INCH | Configuration Features: Number of Loaded Positions 8 | Connector Contact Density Standard | Status Light Type Not Illuminated | Multiple Port Configuration Ganged | Port Configuration Multiple Ports | Port Matrix Configuration 1 x 4 | Number of Panel Ground Tabs 6 | Number of PCB

Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Standard | Configuration Features: Connector Contact Density Standard | Port Configuration Multiple Ports | Number of Positions 8 | Port Matrix Configuration 1 x 5 | Number of Loaded Positions 8 | Status Light Type Not Illuminated | PCB Mount Orientation Right Angle | Multiple Port Configuration Ganged | Contact Features: Contact Mating Area Plating Material Thickness 1.27 MICM | Contact Base Material Phosphor Bronze | C

Body Features: Modular Jack Latch Orientation Standard - Latch Down | Connector Profile Low | Configuration Features: Port Matrix Configuration 1 x 1 | PCB Mount Orientation Right Angle | Port Configuration Single Port | Number of Positions 8 | Status Light Type Not Illuminated | Connector Contact Density Standard | Number of Loaded Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) .2 AMP | Contact Mating Area Plating Material Thickness 50 MICIN

Body Features: Shield Plating Material Nickel over Copper | Primary Product Color Black | Shield Plating Finish Bright | Connector Profile Low | Shield Material Zinc | Configuration Features: Number of Positions 50 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material

TE Connectivity Female RJ45 Connector, Panel Mount Mount,

Body Features: Primary Product Color Black | Shield Material Die Cast Metal | Connector Profile Standard | Shield Plating Finish Bright | Shield Plating Material Nickel over Copper | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 24 | Contact Features: Contact Current Rating (Max) 3.5 AMP | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base M

Body Features: Connector Profile Standard | Configuration Features: Compatible With Wire & Cable Type Round Jacketed Cable | Compatible With Wire & Cable Type Discrete Wire | Number of Positions 64 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 3.5 AMP | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Underplating Material Palladium Nickel | Dimensions:

Body Features: Primary Product Color Black | Strain Relief Material Thermoplastic | Shield Material Die Cast Metal | Ribbon Cable Centerline Spacing .05 INCH | Connector Profile Standard | Ribbon Cable Centerline Spacing 1.27 MM | Shield Plating Material Nickel | Cover Material Polyphenylene Oxide | Configuration Features: Number of Rows 2 | Number of Positions 24 | Compatible With Wire & Cable Type Ribbon Cable | Contact Features: Contact Underplating Material Nickel | Wire Contact Termination Area Plating

Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Positions 50 | Compatible With Wire & Cable Type Round Jacketed Cable | Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Base Material Phosphor Bronze | Contact Current Ra

Body Features: Shield Plating Material Nickel | Shield Material Die Cast Metal | Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 24 | Number of Rows 2 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Base Material Copper Alloy | Dimensions: Row-to-Row Spacing 4.3 MM | Row-to-Row Spacing

Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Rows 2 | Number of Positions 36 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Underplating Material Palladium Nickel | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3.5 AMP | D

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Positions 50 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | Contact Base Material Copper Alloy | Contact Underplating Material Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICIN | D

Body Features: Primary Product Color Black | Insert Material Zinc Plated Brass | Connector Profile Standard | Configuration Features: Number of Positions 50 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Dime

Body Features: Primary Product Color Black | Insert Material Zinc Plated Brass | Connector Profile Standard | Configuration Features: Number of Positions 50 | PCB Mount Orientation Right Angle | Number of Rows 2 | Contact Features: Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Gold or Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Dime

Body Features: Connector Profile Standard | Primary Product Color Black | Configuration Features: Number of Positions 24 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Dime

Body Features: Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | Number of Positions 50 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Dime

Body Features: Shield Plating Material Nickel | Primary Product Color Black | Shield Material Carbon Steel | Cable Exit Angle 180° | Connector Profile Standard | Configuration Features: Number of Rows 2 | Number of Positions 50 | Compatible With Wire & Cable Type Round Jacketed Cable | Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Current Rating (Max) 3.5 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Underpl