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Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Special Purpose Terminal Type Brush | Terminal Orientation Flag | Terminal Plating Material Unplated | Barrel Type Open | Dimensions: Wire Size 18 – 14 AWG | Wire Size .8 – 2 MMSQ | Terminal Material Thickness .51 MM | Terminal Material Thickness .02 INCH | Product Length 11.05 MM | Product Length .435 INCH | Mechanical Attachment: Wire Insulation Support Without | Packaging Features: Packaging Quantity 3600 | Pa

4PDT PCB Mount Non-Latching Relay Solder, 2 A, 20V dc

Configuration Features: Number of Positions 6 | Number of Rows 1 | Number of Power Positions 6 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Current Rating (Max) 19 AMP | Contact Layout Inline | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Retention Wi

Contact Features: Contact Mating Area Plating Material Thickness 15.75 MICIN | Wire Contact Termination Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness .38 MICM | Contact Orientation Straight | Mating Pin Diameter 1.45 MM | Contact Mating Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Fabrication Stamped & Formed | Wire Contact Termination Area Plating Thickness .8 – 2 MICM | Contact Type Pin | Mating Pin Diameter .057 INCH | Contact Current

Contact Features: Contact Orientation Straight | Mating Pin Diameter 1.45 MM | Contact Fabrication Stamped & Formed | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 15.75 MICIN | Wire Contact Termination Area Plating Thickness 31.49 – 78.74 MICIN | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness .4 MICM | Mating Pin Diameter .057 INCH | Contact Type Pin | Contact Current Rati

Configuration Features: Number of Power Positions 0 | Number of Signal Positions 9 | PCB Mount Orientation Vertical | Number of Positions 9 | Number of Columns 3 | Number of Rows 3 | Contact Features: Contact Type Pin | PCB Contact Termination Area Plating Material Tin | Contact Layout Inline | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 79 MICIN | Contact Current Rating (Max) 6 AMP | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material T

TE Connectivity MTA Series, 2.54mm Pitch 4 Way 1 Row Right Angle PCB Header, Through Hole Termination, 5A

TE Connectivity MTA Series, 2.54mm Pitch 3 Way 1 Row Right Angle PCB Header, Through Hole Termination, 5A

Use the download button to access the 640453-2 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 640452-6 schematic symbol, PCB footprint, and 3D model.

Use the download button to access the 640388-8 schematic symbol, PCB footprint, and 3D model.

Configuration Features: Number of Power Positions 6 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 6 | Contact Features: Mating Post Length 10.16 MM | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Type Pin | Contact Layout Inline | Contact Current Rating (Max) 7 AMP | Mating Post Length .4 INCH | PCB Contact Termination Area Plating Material Thickness 150 – 250 MICIN | Contact Mating Area Plating Material Thickness 100

Configuration Features: Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | PCB Mount Orientation Right Angle | Contact Features: Contact Mating Area Plating Material Thickness 100 MICIN | Mating Post Length 9.91 MM | Contact Base Material Copper Alloy | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Retention Within Housing Without | Mating Post Length .39 INCH | Contact Layout Inline | Contact Current Rating (Max) 7 AMP | PCB Contact

Configuration Features: Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Tin | PCB Contact Termination Area Plating Material Thickness 150 – 350 MICIN | Mating Post Length 10.16 MM | Contact Base Material Copper Alloy | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Layout Inline | Contact Mating Area Plating Material Thickness 2.54 MICM | PCB Contact Termination Area Plating

Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Retention Within Housing Without | Mating Post Length 10.16 MM | PCB Contact Termination Area Plating Material Thickness 3.81 – 8.89 MICM | Contact Current Rating (Max) 7 AMP | Contact Type Pin | M

Contact Features: Wire Contact Termination Area Plating Material Nickel | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Contact Mating Area Plating Material Gold | Contact Type Socket | Mating Pin Diameter .084 INCH | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Material Finish Matte | Wire Contact Termination Area Plating T

Contact Features: Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Material Nickel | Contact Type Socket | Mating Pin Diameter 2.13 MM | Mating Pin Diameter .084 INCH | Contact Current Rating (Max) 19 AMP | Contact Orientation Straight | Contact Base Material Phosphor Bronze | Contact Underplating Material Nickel | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 50 MICI

Contact Features: Contact Current Rating (Max) 19 AMP | Contact Mating Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Orientation Straight | Mating Pin Diameter .084 INCH | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness .8 – 2 MICM | Wire Contact Termination Area Plating Material Finish Matte | Contact Type Socket | Wire Contact Termination Area Plating Material Pre-Tin | Wire Contact Termination Area Plating Thickness 31.49 – 78.74 M

Contact Features: Contact Underplating Material Thickness 50 MICIN | Contact Type Pin | Mating Pin Diameter 2.13 MM | Contact Base Material Phosphor Bronze | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Nickel | Contact Mating Area Plating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter .084 INCH | Contact Underplating Material Thickness 1.27 MICM |