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TE Connectivity HM Series 2mm 200 Way 8 Row Right Angle PCB Socket Through Hole Free Board

TE Connectivity HM Series, 2mm Pitch 176 Way 8 Row Straight PCB Header, Through Hole Termination

Configuration Features: Number of Power Positions 2 | Number of Signal Positions 24 | PCB Mount Orientation Right Angle | Number of Rows 4 | Number of Positions 26 | Contact Features: Contact Retention Within Housing Without | Contact Underplating Material Nickel | Contact Current Rating (Max) 42 AMP | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 3 MICIN | Contact Underplating Materi

Configuration Features: Number of Positions 6 | Number of Power Positions 6 | Number of Rows 1 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 100 MICIN | Mating Post Length 10.16 MM | PCB Contact Termination Area Plating Material Tin | Contact Type Pin | Contact Current Rating (Max) 7 AMP | Contact Base Material Copper Alloy | Contact Layout Inline | Contact

Configuration Features: Number of Power Positions 4 | Number of Rows 1 | Number of Positions 4 | PCB Mount Orientation Vertical | Contact Features: Contact Base Material Copper Alloy | Contact Layout Inline | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 2.54 MICM | Contact Type Pin | Mating Post Length 10.16 MM | Contact Current Rating (Max) 7 AMP | Mating Post Length .4 IN

Configuration Features: Number of Positions 4 | PCB Mount Orientation Vertical | Number of Power Positions 4 | Number of Rows 1 | Contact Features: Contact Current Rating (Max) 12 AMP | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Pre-Tin | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Type Socket | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material

Configuration Features: Number of Rows 1 | Number of Power Positions 2 | Number of Positions 2 | PCB Mount Orientation Right Angle | Contact Features: Multiple Contact Types Without | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Contact Layout Inline | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Current Rating (Max) 12 AMP | PCB Contact Termination Area Plating Material

Configuration Features: PCB Mount Orientation Vertical | Number of Positions 15 | Number of Power Positions 15 | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | PCB Contact Termination Area Plating Material Pre-Tin | Contact Layout Matrix | Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Type Pin | Contact Mating Area Plating Material Tin | Mult

Configuration Features: Number of Rows 3 | Number of Signal Positions 0 | Number of Power Positions 9 | PCB Mount Orientation Vertical | Number of Positions 9 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Retention Within Housing Without | Contact Layout Matrix | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Tin | Contact Type Pin | Multiple Contact Types Without | Contact Mating

Configuration Features: Number of Power Positions 6 | Number of Positions 6 | Number of Signal Positions 0 | PCB Mount Orientation Vertical | Number of Rows 2 | Contact Features: Multiple Contact Types Without | Contact Type Pin | Contact Current Rating (Max) 12 AMP | Contact Retention Within Housing Without | Contact Layout Matrix | Contact Mating Area Plating Material Gold | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 30 MICM | Contact Mating Area Pla

Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Multiple Contact Types Without | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Retention Within Housing Without | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Mating Area Plating Material Thickness 3.81 – 5.08

Configuration Features: Number of Rows 1 | PCB Mount Orientation Vertical | Number of Positions 2 | Number of Signal Positions 0 | Number of Power Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Pre-Tin | Contact Mating Area Plating Material Thickness 150 â

Configuration Features: Number of Rows 1 | Number of Power Positions 8 | PCB Mount Orientation Vertical | Number of Positions 8 | Contact Features: PCB Contact Termination Area Plating Material Pre-Tin | Contact Current Rating (Max) 12 AMP | Contact Type Pin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Contact Mating Area Plating Material Tin | Multiple Contact Types Without | Contact Mating Area Plating Material Thic

TE Connectivity MTA Series, 2.54mm Pitch 6 Way 1 Row Straight PCB Header, Through Hole Termination, 5A

Body Features: PCB Ground Tab Location .153 INCH | Modular Jack Latch Orientation Inverted - Latch Up | Shield Plating Material Tin | Shield Material Copper Zinc Alloy | PCB Ground Tab Location 3.89 MM | Connector Profile Standard | Configuration Features: Port Matrix Configuration 1 x 1 | Number of Positions 8 | Number of Loaded Positions 8 | Connector Contact Density Standard | Number of PCB Ground Tabs 2 | PCB Mount Orientation Vertical | Status Light Type Not Illuminated | Port Configuration Single Port

Configuration Features: Compatible With Wire & Cable Type Discrete Wire | Contact Features: Contact Mating Area Plating Material Tin | Contact Type Socket | Mating Square Post Dimension 1.14 MM | Mating Square Post Dimension .045 INCH | Contact Current Rating (Max) 6.5 AMP | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Pre-Tin | Contact Base Material Brass | Dimensions: Wire Size .2 – .9 MMSQ | Wire Size 24 – 18 AWG | Electrical Characteristics: Operating Voltag

Configuration Features: Number of Power Positions 8 | Number of Rows 1 | PCB Mount Orientation Right Angle | Number of Positions 8 | Contact Features: Contact Retention Within Housing Without | Contact Mating Area Plating Material Thickness 3.81 – 5.08 MICM | Multiple Contact Types Without | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Thickness 150 – 200 MICIN | Contact Layout Inline | Contact Current Rating (Max) 12 AMP | Contact Mating Area Plating Material

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TE Connectivity MTA Series, 2.54mm Pitch 3 Way 1 Row Straight PCB Header, Through Hole Termination, 5A