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Contact Features: Wire Contact Termination Area Plating Thickness 50 MICIN | Mating Pin Diameter 1.57 MM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 15 MICIN | Contact Underplating Material Thickness 1.27 MICM | Contact Size Size 16 | Contact Underplating Material Thickness 50 MICIN | Wire Contact Termination Area Plating Thickness 1.27 MICM | Mating Pin Diameter .062 INCH | Contact Orientation Straight | Contact Retention Within Housing With | Contact Base Materi

Contact Features: Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Underplating Material Nickel | Contact Orientation Straight | Contact Size Size 16 | Contact Underplating Material Thickness 30 MICIN | Contact Type Socket | Contact Mating Area Plating Material Gold | Contact Retention Within Housing With | C

Contact Features: Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Base Material Brass | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Material Finish Bright | Mating Pin Diameter 1.57 MM | Contact Underplating Material Nickel | Contact Mating Area Plating Material Finish Bright | Contact Underplating Material Thickness 30 MICIN | Contact Size Size 16 | Contact Retention W

Contact Features: Contact Mating Area Plating Material Gold | Contact Underplating Material Thickness .76 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Nickel | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Material Finish Matte | Contact Orientation Straight | Mating Pin Dia

Contact Features: Contact Size Size 16 | Wire Contact Termination Area Plating Material Gold | Contact Type Socket | Contact Mating Area Plating Material Gold | Contact Orientation Straight | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Underplating Material Thickness .76 MICM | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Thickness .25 M

Contact Features: Wire Contact Termination Area Plating Material Gold | Wire Contact Termination Area Plating Material Finish Bright | Contact Type Pin | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Current Rating (Max) 13 AMP | Contact Orientation Straight | Contact Underplating Material Nickel | Contact Retention Within Housing With | Contact Underplating Material Thickness 50 MICIN | Contact Size Size 16 | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Mating Are

Contact Features: Contact Underplating Material Nickel | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Retention Within Housing With | Contact Orientation Straight | Contact Base Material Brass | Contact Current Rating (Max) 13 AMP | Contact Size Size 16 | Contact Mating Area Plating Material Precious Metal | Conta

Contact Features: Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Base Material Brass | Contact Type Pin | Contact Retention Within Housing With | Wire Contact Termination Area Plating Material Gold | Contact Underplating Material Nickel | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Underplating Material Thickness 50 MICIN | Contact Size Size 16 |

TE Connectivity 650946 Series 32 Way 2.54mm Pitch, Type C Class C2, 2 Row a, c, Right Angle DIN 41612 Connector, Plug

Configuration Features: Number of Columns 32 | Number of Rows 3 | Number of Power or Coaxial Positions 64 | Number of Signal Positions 64 | Rows Loaded C | PCB Mount Orientation Right Angle | Number of Positions 64 | Rows Loaded A | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Type Pin | Contact Base Material Brass | Contact Mating Area Plating Material Thickness .76 MICM |

Body Features: Primary Product Color Gray | Configuration Features: Connector Contact Load Condition Fully Loaded | Number of Positions 96 | PCB Mount Orientation Right Angle | Number of Rows 3 | Contact Features: Contact Current Rating (Max) 3 AMP | Dimensions: Row-to-Row Spacing .1 INCH | Row-to-Row Spacing 2.54 MM | Housing Features: Centerline (Pitch) .1 INCH | Housing Material Glass Filled Polyester | Centerline (Pitch) 2.54 MM | Mechanical Attachment: Connector Mounting Type Board Mount | Operation/Ap

Body Features: Primary Product Color Gray | Configuration Features: Number of Positions 96 | PCB Mount Orientation Vertical | Rows Loaded A | Number of Signal Positions 96 | Number of Columns 32 | Rows Loaded B | Number of Rows 3 | Number of Power or Coaxial Positions 96 | Rows Loaded C | Contact Features: Contact Base Material Brass | PCB Contact Termination Area Plating Material Thickness 2.54 – 5.08 MICM | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 1.5 AMP |

Contact Features: Barrel Type Closed | Contact Current Rating (Max) 50 AMP | Mating Tab Thickness 3.35 MM | Contact Base Material Copper Alloy | Contact Underplating Material Thickness 1.27 MICIN | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Mating Area Plating Material Silver | Mating Tab Thickness .131 INCH | Wire Contact Termination Area Plating Material Silver | Contact Underplating Material Nickel | Contact Orientation Straight | Wire Contact Termination Area Plating Material Fin

Configuration Features: Number of Signal Positions 0 | Number of Positions 2 | Number of Power Positions 0 | Number of Rows 1 | Contact Features: Contact Retention Within Housing Without | Contact Type Tab | Dimensions: Wire Size 12 – 6 AWG | Connector Height 15.88 MM | Compatible Insulation Diameter Range 10 MM | Wire Size 3.085 – 14 MMSQ | Product Length 1.9 INCH | Product Length 48.23 MM | Compatible Insulation Diameter Range .394 INCH | Wire Size 6088 – 27629 CMA | Product Width 1.38 INCH | Connec

Body Features: Connector Profile Low | Configuration Features: Number of Rows 1 | PCB Mount Orientation Right Angle | PCB Mount Orientation Vertical | Number of Power Positions 6 | Number of Positions 6 | Contact Features: Mating Post Length .33 INCH | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Retention Within Housing Without | Contact Current Rating (Max) 7.5 AMP | Mating Post Length 8.6 MM | Contact Layout Inline | Contact Type Pin | Contact Base Material Brass | PCB Contact Termi

Body Features: Connector Profile Low | Configuration Features: Number of Positions 5 | PCB Mount Orientation Vertical | PCB Mount Orientation Right Angle | Number of Rows 1 | Number of Power Positions 5 | Contact Features: Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Layout Inline | Contact Retention Within Housing Without | Mating Post Length .33 INCH | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Type Pin | PCB Contact T

Body Features: Connector Profile Low | Configuration Features: Number of Power Positions 4 | PCB Mount Orientation Right Angle | PCB Mount Orientation Vertical | Number of Rows 1 | Number of Positions 4 | Contact Features: Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Base Material Brass | Contact Retention Within Housing Without | Contact Layout Inline | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 80 MICIN | Contact Type Pin | PCB Contact T

Body Features: Connector Profile Low | Configuration Features: PCB Mount Orientation Vertical | PCB Mount Orientation Right Angle | Number of Power Positions 3 | Number of Positions 3 | Number of Rows 1 | Contact Features: Contact Mating Area Plating Material Thickness 80 MICIN | Mating Post Length 8.6 MM | Contact Base Material Brass | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Mating Area Plating Material Thickness 2.03 MICM | Contact Layout Inli

Body Features: Connector Profile Low | Configuration Features: Number of Power Positions 2 | Number of Rows 1 | PCB Mount Orientation Right Angle | PCB Mount Orientation Vertical | Number of Positions 2 | Contact Features: Contact Retention Within Housing Without | Contact Layout Inline | Contact Current Rating (Max) 7.5 AMP | Contact Mating Area Plating Material Thickness 80 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Tin | Contact Base Material Brass |

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