Search Electronic Components

7-1393117-1 is a TE Connectivity connector for PCB interconnect and production BOM sourcing. Key specs include 34.9 mm pitch. From inquiry pricing, in stock sourcing, and worldwide shipping support.

Body Features: Primary Product Color Black | Configuration Features: Number of Positions 50 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin | Contact Current Rating (Max) 3 AMP | Contact Base Material Copper Alloy | Contact Type Socket | Dimensions: Connector Height .24 INCH | Compatible Insulation Diameter Range 1.27 MM | Connector Length 63.5 MM | Connector Length 2.5 INCH | Row-to-Row Spacing 2.54 MM | Connector Height 6.1 MM | Row-to-Row Spacing .1 INCH | Compati

Contact Features: Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Thickness 2.54 MICM | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 1.27 MICM | Contact Mating Area Plating Material Finish Bright | Mating Pin Diameter .062 INCH | Contact Retention Within Housing With | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Tin | Contact U

Contact Features: Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Tin | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Nickel | Contact Base Material Brass | Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Orientation Straight | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness 100 MICIN | Contact Underplating Material Thickness .76 MI

Contact Features: Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Underplating Material Thickness .76 MICM | Contact Retention Within Housing With | Contact Type Socket | Contact Underplating Material Thickness 30 MICIN | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Size Size 16 | Wire Contact Termination Area Plating Material Tin | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Gold | Contact Orientation Str

Body Features: Shell Plating Material Nickel over Copper | Insert Material Thermoplastic | Connector Profile High | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 50 | Number of Signal Positions 50 | Contact Features: Contact Mating Area Plating Material Gold | Contact Current Rating (Max) .3 AMP | Contact Base Material Phosphor Bronze | Contact Current Rating (Max) 1.5 AMP | Contact Current Rating (Max) .5 AMP | PCB Contact T

Contact Features: Contact Mating Area Plating Material Finish Bright | Contact Underplating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness .38 MICM | Barrel Type Open | Contact Base Material Brass | Mating Pin Diameter .062 INCH | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness .15 MICIN | Wire Contact Termination Area Plating Material Tin | Contact Orientation Straight | Contact Type Socket | Mat

Contact Features: Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination Area Plating Material Finish Matte | Mating Pin Diameter 1.57 MM | Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Contact Type Socket | Wire Contact Termination Area Pla

Contact Features: Contact Orientation Straight | Contact Size Size 16 | Wire Contact Termination Area Plating Thickness 200 – 300 MICIN | Wire Contact Termination Area Plating Material Silver | Contact Type Socket | Contact Base Material Copper Alloy | Wire Contact Termination Area Plating Thickness 5.08 – 7.62 MICM | Mating Pin Diameter .062 INCH | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Gold | Contact Current Rating (Max) 15 AMP | Contact Retention Within Housing Without | C

TE Connectivity Female Straight PCB Connector Housing

Contact Features: Wire Contact Termination Area Plating Material Tin | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Mating Area Plating Material Gold | Contact Type Socket | Contact Current Rating (Max) 13 AMP | Contact Underplating Material Thickness 30 MICIN | Contact Size Size 16 | Wire Contact Termination Area Plating Material Finish Bright | Contact Mating Area Plating Material Finish Bright | Contact Orientation Straight | Contact Underplating Material Thickness .76 MICM | Wire

Contact Features: Contact Underplating Material Thickness 30 MICIN | Contact Mating Area Plating Material Thickness .15 MICIN | Contact Size Size 16 | Contact Base Material Brass | Wire Contact Termination Area Plating Material Finish Matte | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Orientation Straight | Contact Mating Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Mating Area Plating

Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Size Size 16 | Contact Current Rating (Max) 13 AMP | Contact Orientation Straight | Contact Type Socket | Wire Contact Termination Area Plating Material Finish Matte | Barrel Type Open | Contact Underplating Material Thickness 30 MICIN | Mating Pin Diameter 1.57 MM | Contact Mating Area Plating Material Gold | Wire Contact Termination Area Plating Thickness 50 MICIN | Contact Underplating Material Thickness .76 MICM | Mating

Contact Features: Contact Current Rating (Max) 13 AMP | Contact Mating Area Plating Material Thickness .76 MICM | Wire Contact Termination Area Plating Material Finish Bright | Contact Underplating Material Thickness 1.27 MICM | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Retention Within Housing With | Contact Orientation Straight | Contact Base Material Brass | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Wire Contact Termination A

Contact Features: Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Underplating Material Thickness 30 MICIN | Contact Size Size 16 | Contact Type Socket | Contact Base Material Brass | Contact Retention Within Housing With | Contact Underplating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Mating Pin Diameter 1.57 MM | Contact Underplating Material Nickel | Wire Contact Termination Area Plating Material Tin | Contact Mating Area Plati

Contact Features: Contact Underplating Material Copper | Contact Mating Area Plating Material Thickness 2.54 MICM | Mating Tab Width 5.84 MM | Mating Tab Thickness .105 INCH | Mating Tab Thickness 2.67 MM | Wire Contact Termination Area Plating Material Silver | Wire Contact Termination Area Plating Thickness 100 MICIN | Wire Contact Termination Area Plating Material Finish Bright | Contact Orientation Right Angle | Wire Contact Termination Area Plating Thickness 2.54 MICM | Contact Type Tab | Contact Matin

Contact Features: Contact Type Tab | Wire Contact Termination Area Plating Thickness .76 MICM | Contact Current Rating (Max) 35 AMP | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Copper | Contact Orientation Right Angle | Wire Contact Termination Area Plating Material Finish Bright | Mating Tab Width .23 INCH | Contact Underplating Material Copper | Wire Contact Termination Area Plating Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Contact Mating Area Pl

Contact Features: Wire Contact Termination Area Plating Material Finish Matte | Contact Type Pin | Wire Contact Termination Area Plating Thickness 1.27 MICM | Contact Size Size 16 | Wire Contact Termination Area Plating Material Tin | Contact Retention Within Housing With | Contact Mating Area Plating Material Thickness 30 MICIN | Mating Pin Diameter 1.57 MM | Mating Pin Diameter .062 INCH | Contact Mating Area Plating Material Precious Metal | Wire Contact Termination Area Plating Thickness 50 MICIN | Cont

Contact Features: Contact Base Material Brass | Contact Size Size 16 | Wire Contact Termination Area Plating Material Gold | Contact Underplating Material Thickness 1.27 MICM | Contact Current Rating (Max) 13 AMP | Wire Contact Termination Area Plating Thickness 10 MICIN | Contact Retention Within Housing With | Contact Underplating Material Nickel | Contact Type Pin | Contact Mating Area Plating Material Finish Bright | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Orientation Straight

Contact Features: Contact Type Pin | Contact Underplating Material Nickel | Contact Base Material Brass | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Tin | Contact Underplating Material Thickness 1.27 MICM | Contact Orientation Straight | Wire Contact Termination Area Plating Thickness .25 MICM | Contact Mating Area Plating Material Thickness .76 MICM | Mating Pin Diameter .062 INCH | Contact Size Size 16 | Wire Contact Termination Area Plating Thickness 10