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Body Features: Mating Retention Feature Material Brass | Insert Material Brass | Shell Plating Material Tin | Connector Profile Standard | Primary Product Color Black | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 15 | Contact Features: Contact Base Material Brass | Contact Shape & Form Round | Contact Mating Area Plating Material Gold Flash over Palladium Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Materia

Body Features: Primary Product Color Black | Shell Plating Material Tin | Mating Feature Plating Material Clear Chromate | Assembly Process Feature Material Copper Alloy | Connector Profile Standard | Mating Feature Material Zinc | Insert Material Zinc | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 25 | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Th

Body Features: Shell Plating Material Tin | Insert Material Zinc | Primary Product Color Black | Connector Profile Standard | Mating Feature Plating Material Clear Chromate | Assembly Process Feature Material Copper Alloy | Mating Feature Material Zinc | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 9 | Number of Rows 2 | Contact Features: Contact Underplating Material Nickel | Contact Current Rating (Max) 6 AMP | Contact Base Material Phosphor Bronze | Contact Mating Area

Use the download button to access the 747844-4 schematic symbol, PCB footprint, and 3D model.

Body Features: Connector Profile Standard | Insert Material Zinc | Shell Plating Material Tin over Copper | Mating Retention Feature Material Zinc | Primary Product Color Black | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 9 | Contact Features: Contact Shape & Form Round | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Mat

Body Features: Connector Profile Medium | Insert Material Brass | Primary Product Color Black | Shell Plating Material Tin | Mating Retention Feature Material Brass | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 15 | Number of Rows 2 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Gold | Contact Base Material Copper

Configuration Features: PCB Mount Orientation Vertical | Number of Columns 32 | Number of Rows 3 | Number of Positions 64 | Number of Signal Positions 64 | Rows Loaded C | Number of Power or Coaxial Positions 2 | Rows Loaded A | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Gold | Contact Type Socket | Contact Current Rating (Max) 1 AMP | Dimensions: Row-to-Row Spacing 2.54 MM | Connector Height .741 I

Body Features: Shell Plating Material Tin | Primary Product Color Black | Mating Retention Feature Material Zinc | Insert Material Zinc | Connector Profile Standard | Configuration Features: PCB Mount Orientation Right Angle | Number of Positions 25 | Number of Rows 2 | Contact Features: PCB Contact Termination Area Plating Material Tin-Lead | Contact Shape & Form Round | Contact Underplating Material Nickel | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | Con

Body Features: Mating Feature Material Brass | Mating Feature Plating Material Nickel over Copper Flash | Primary Product Color Black | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 15 | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Current Rating (Max) 6 AMP | PCB Contact Termination Area Plating Material Tin-Lead | Contact Mating Area Plating Material Gold | Contact Base Material Phosphor B

Body Features: Connector Profile Standard | Mating Feature Plating Material Nickel over Copper Flash | Mating Feature Material Brass | Primary Product Color Black | Configuration Features: Number of Positions 9 | Number of Rows 2 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Gold Flash | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Base Material Brass | Contact Underplating Material Palladium Nickel | Contact Mating Area Plating Material Gold

TE Connectivity Mod IV Series 30 Way 1 Row Female Straight PCB Connector Housing

Body Features: Connector Profile Standard | Primary Product Color Red | Configuration Features: PCB Mount Orientation Right Angle | Number of Rows 2 | Number of Positions 4 | Contact Features: PCB Contact Termination Area Plating Material Thickness 3 – 5 MICM | Contact Layout Staggered | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Finish Matte | Contact Mating Area Plating Material Thickness 3 – 5 MICM | Contact Mating A

TE Connectivity AMPMODU Series, Series Number 7-146256, 2.54mm Pitch 40 Way 2 Row Straight PCB Header

TE Connectivity AMPMODU Series, 2.54mm Pitch 40 Way 2 Row Straight PCB Header, Through Hole Termination, 3A

Use the download button to access the 7-146252-5 schematic symbol, PCB footprint, and 3D model.

7-1437529-5 is a TE Connectivity connector for PCB interconnect and production BOM sourcing. Key specs include 8 pins, 0.135 inch pitch, through-hole format. From inquiry pricing, in stock sourcing, and worldwide shipping support.

Body Features: Connector Profile Standard | Shell Plating Material Tin | Configuration Features: PCB Mount Orientation Vertical | Number of Rows 2 | Number of Positions 15 | Contact Features: Contact Shape & Form Round | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | PCB Contact Termination Area Plating Material Tin | Contact Underplating Material Nickel | Contact Mating Area Plating Material Gold | Dimensions: Row-to-Row Spacing .112 INCH | PCB Thickness (

Body Features: Connector Profile Standard | Shell Plating Material Tin | Configuration Features: Number of Rows 2 | Number of Positions 25 | PCB Mount Orientation Vertical | Contact Features: Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Shape & Form Round | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) 1.57 MM | Row-to-R

Body Features: Shell Plating Material Tin | Connector Profile Standard | Configuration Features: Number of Rows 2 | PCB Mount Orientation Vertical | Number of Positions 15 | Contact Features: Contact Shape & Form Round | Contact Underplating Material Nickel | PCB Contact Termination Area Plating Material Tin | Contact Base Material Phosphor Bronze | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Mating Area Plating Material Gold | Dimensions: PCB Thickness (Recommended) .062 INCH | Row-to

Body Features: Shell Plating Material Tin | Connector Profile Standard | Configuration Features: PCB Mount Orientation Vertical | Number of Positions 9 | Number of Rows 2 | Contact Features: Contact Base Material Phosphor Bronze | PCB Contact Termination Area Plating Material Tin | Contact Mating Area Plating Material Gold | Contact Mating Area Plating Material Thickness 30 MICIN | Contact Underplating Material Nickel | Contact Shape & Form Round | Dimensions: PCB Thickness (Recommended) .062 INCH | PCB Thi