XPS63810YFFT Texas Instruments Integrated Circuit (BGA) In Stock
High-efficiency 2.5 A buck-boost converter with I²C programmable output from 1.8 V to 4.975 V, accepting inputs from 2.2 V to 5.5 V using current-mode PWM control. Packaged in a 15-ball BGA for compact smartphone and wearable power management. In stock worldwide.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 15
- Lifecycle
- OBSOLETE
- Datasheet
- XPS63810YFFT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XPS63810YFFT?
- I²C interface allows dynamic output voltage adjustment from 1.8 V to 4.975 V in firmware, enabling adaptive power management across multiple system load modes without component changes
- Seamless buck-boost operation across 2.2 V to 5.5 V input range sustains 2.5 A output even as a Li-ion battery discharges from 4.2 V down to 2.5 V
- Compact 15-ball BGA (PBGA-B15) minimises solution footprint in wearables and smartphones, and current-mode PWM control provides fast load-transient response for sensitive RF and processor rails
What is XPS63810YFFT used for?
XPS63810YFFT is well suited for portable consumer electronics such as smartphones, tablets, and wearables where the system rail must stay regulated at a fixed 3.3 V or adjustable voltage across the full Li-ion battery discharge range from 4.2 V down to 2.5 V. Its I²C programmability makes it a strong fit for multi-mode IoT devices that need to reduce the output rail during deep-sleep states to maximise battery run-time.
What are the specifications of XPS63810YFFT?
| Date Of Intro | 2019-10-17 |
| YTEOL | 0 |
| Additional Feature | 1.8 V TO 4.975 V |
| Analog IC - Other Type | SWITCHING REGULATOR |
| Control Mode | CURRENT-MODE |
| Control Technique | PULSE WIDTH MODULATION |
| Input Voltage-Max | 5.5V |
| Input Voltage-Min | 2.2V |
| Input Voltage-Nom | 3.6V |
| JESD-30 Code | R-PBGA-B15 |
| Number of Functions | 1 |
| Output Current-Max | 3A |
| Output Voltage-Max | 5.2V |
| Output Voltage-Min | 1.8V |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA15,3X5,16 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Supply Current-Max (Isup) | 0.013mA |
| Surface Mount | YES |
| Switcher Configuration | BUCK-BOOST |
| Switching Frequency-Max | 2600kHz |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 0.4mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the XPS63810YFFT datasheet?
XPS63810YFFT Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XPS63810YFFT?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does XPS63810YFFT maintain 2.5 A output as a Li-ion cell discharges from 4.2 V down to 2.5 V?
XPS63810YFFT uses a 4-switch buck-boost topology that transitions automatically between boost, buck-boost, and buck modes as the input voltage crosses the regulated output level. At a programmed output of 3.3 V, the device operates in buck mode when Vin is above 3.3 V, smoothly transitions to buck-boost near the crossover, and continues in boost mode below 3.3 V—all while delivering up to 2.5 A to the load without output voltage disturbances visible above 50 mV.
What output voltage resolution is achievable via I²C on XPS63810YFFT, and how does that help power-aware firmware design?
The I²C interface on XPS63810YFFT allows firmware to set the output between 1.8 V and 4.975 V in steps as small as 5 mV to 25 mV (exact step size detailed in the datasheet register map). This fine resolution lets an MCU drop the rail from 3.3 V to 1.8 V during peripheral sleep, cutting dynamic power by approximately 70% proportional to V² scaling, and then restore it in under 100 µs when full performance is needed—useful for NFC and BLE radio bursts in wearable designs.
For a compact wearable PCB, how does the BGA-15 package of XPS63810YFFT compare to a similar converter in an SOT-23 or WSON package?
The 15-ball PBGA-B15 package typically measures around 1.6 mm × 1.6 mm with a 0.5 mm ball pitch, making the total solution footprint—including a few 100 nF bypass capacitors—under 10 mm². An equivalent WSON or DFN-10 converter occupies 2 mm × 2 mm or larger plus separate capacitors, typically totalling 15–20 mm². For a smartwatch where every mm² of PCB is contested, the BGA saves meaningful area and keeps inductor and capacitor placement very close to the IC pads.
When is XPS63810YFFT a lower-cost or simpler alternative to pairing a dedicated LDO with a boost converter in a battery-powered design?
When the load needs a regulated output voltage that can fall between the minimum and maximum battery voltage—for example, a fixed 3.3 V rail powered by a single Li-ion cell that swings from 4.2 V to 2.5 V—a separate LDO plus boost topology requires 2 ICs, 2 inductors, and extra capacitors. XPS63810YFFT replaces both with 1 IC and 1 inductor, reducing total component count by roughly 8 parts and BOM cost significantly. The I²C control also removes the need for a discrete enable pin circuit.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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