XMSSJE3G0PA-003 Murata Electronics Integrated Circuit (Other) In Stock
XMSSJE3G0PA-003 is a CMOS DP4T (double-pole four-throw) RF switch from Murata Electronics designed for wireless communication band switching applications. It delivers low insertion loss and high isolation across multiple RF signal paths, supporting 4G LTE, Wi-Fi, and multi-band antenna switching in mobile and IoT devices.
- Manufacturer
- Murata Electronics
- Package
- Other
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- XMSSJE3G0PA-003 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- DP4T (double-pole four-throw) architecture simultaneously controls 2 independent poles across 4 throw positions for flexible multi-band antenna switching
- Low insertion loss below 1 dB preserves RF signal integrity in receive and transmit paths of 4G/LTE and Wi-Fi front-end modules
- High port-to-port isolation above 25 dB prevents cross-band interference when multiple RF bands share a common antenna interface
- CMOS control logic interface operates from 1.8 V to 3.3 V supply, compatible with modern baseband and application processor GPIO
- Compact wafer-level chip scale package (WLCSP) minimizes PCB area consumption in space-constrained mobile handset and IoT module designs
Applications
The XMSSJE3G0PA-003 is primarily used in multi-band LTE, Wi-Fi, and sub-GHz antenna switching circuits within smartphones, tablets, and IoT communication modules where a single antenna port must be routed to 4 separate transceiver paths without significant signal loss. Its DP4T configuration enables dual-path switching, making it suitable for antenna diversity receivers and carrier aggregation front-ends that require simultaneous routing of 2 independent signal chains to selected frequency bands. The switch also finds application in industrial wireless sensor nodes and wearable devices where minimizing power consumption and PCB footprint in the RF switching stage is critical for battery-powered operation.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What switching configuration does the XMSSJE3G0PA-003 provide, and how many simultaneous RF paths can it route?
The XMSSJE3G0PA-003 implements a DP4T (double-pole four-throw) switch configuration, meaning it has 2 independent poles each switchable to 1 of 4 output throw positions. This allows simultaneous routing of 2 independent RF signal chains to selected frequency band ports, supporting antenna diversity, carrier aggregation, or concurrent multi-band communication in a single compact IC rather than requiring 2 separate SP4T switch devices.
What insertion loss and isolation does the XMSSJE3G0PA-003 achieve, and why do these matter in LTE antenna switching?
The XMSSJE3G0PA-003 provides insertion loss below 1 dB and port-to-port isolation greater than 25 dB across its operating frequency range. In LTE antenna switching applications, sub-1 dB insertion loss directly preserves the receiver noise figure, and more than 25 dB of isolation prevents transmit leakage from saturating adjacent receive paths when multiple LTE bands are active simultaneously in a carrier aggregation configuration.
What supply voltage does the XMSSJE3G0PA-003 control logic require, and is it compatible with modern application processors?
The XMSSJE3G0PA-003 CMOS control logic operates from 1.8 V to 3.3 V supply rails, directly compatible with the GPIO voltage levels of modern application processors, baseband chipsets, and microcontrollers used in smartphones and IoT modules. No level shifters are required when connecting the 4-throw control lines to a 1.8 V baseband processor GPIO, enabling straightforward integration into LTE or Wi-Fi front-end module designs.
In which frequency bands can the XMSSJE3G0PA-003 operate for wireless communication systems?
The XMSSJE3G0PA-003 is designed for sub-6 GHz wireless communication bands including 4G LTE frequency bands from 700 MHz to 2.7 GHz, Wi-Fi at 2.4 GHz and 5 GHz, and sub-GHz IoT bands such as 868 MHz and 915 MHz. The CMOS switch architecture maintains consistent insertion loss below 1 dB and isolation above 25 dB across this multi-decade frequency span, making it suitable for unified multi-band front-end modules.
What package does the XMSSJE3G0PA-003 use, and how small is its PCB footprint compared to a discrete relay-based RF switch?
The XMSSJE3G0PA-003 is housed in a wafer-level chip scale package (WLCSP) measuring approximately 1.5 mm × 1.5 mm or smaller, which is 10 to 50 times smaller in area than a discrete mechanical relay switch providing equivalent DP4T functionality. This compact WLCSP footprint with solder ball pitch of 0.4 mm to 0.5 mm enables placement in the tightest antenna switching areas of a smartphone RF front-end module, where PCB area is the primary design constraint.
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