XLMG1020YFFT Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments XLMG1020YFFT is a single-function buffer or inverter peripheral driver IC with source-and-sink output current, under-voltage protection, and a 6-ball DSBGA package for space-critical interface level-shifting and signal buffering on embedded boards.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 6
- Lifecycle
- OBSOLETE
- Datasheet
- XLMG1020YFFT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Single-function buffer or inverter driver with bi-directional source-and-sink output current for flexible signal conditioning
- Integrated under-voltage lockout protection prevents erroneous output states during supply ramp-up and brown-out events
- Ultra-compact 6-ball DSBGA (wafer-level BGA) package enables sub-1 mm² PCB footprint for wearable and IoT interface designs
Applications
The XLMG1020YFFT buffer driver is intended for signal buffering, level translation, and peripheral interface driving in space-constrained embedded systems such as IoT sensor modules, wearable devices, and mobile platform accessory interfaces. Its bi-directional source-and-sink output current capability makes it suitable for driving capacitive loads on I2C, SPI, and GPIO lines where standard MCU drive strength is insufficient. The DSBGA-6 package shrinks the logic driver footprint to a fraction of traditional SOT-23 equivalents, critical in densely packed multi-layer PCB designs.
Specifications
| Date Of Intro | 2018-02-23 |
| YTEOL | 0 |
| Built-in Protections | UNDER VOLTAGE |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 Code | R-PBGA-B6 |
| JESD-609 Code | e1 |
| Number of Functions | 1 |
| Output Current Flow Direction | SOURCE AND SINK |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 5.25V |
| Supply Voltage-Min | 4.75V |
| Supply Voltage-Nom | 5V |
| Surface Mount | YES |
| Temperature Grade | AUTOMOTIVE |
| Terminal Finish | TIN SILVER COPPER |
| Terminal Form | BALL |
| Terminal Pitch | 0.4mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for XLMG1020YFFT:
Frequently Asked Questions
How does the under-voltage lockout in the XLMG1020YFFT protect downstream peripherals during system power-up?
The under-voltage lockout holds the output in a defined inactive state until the supply voltage rises above the threshold, preventing undefined logic levels from reaching downstream ICs during the supply ramp from 0 V to the nominal operating voltage. This is critical in systems where microcontrollers or memory devices must not receive spurious transitions on their control lines during the first milliseconds of power-on sequencing.
What board-space advantage does the DSBGA-6 package of the XLMG1020YFFT offer in a wearable sensor design?
The DSBGA-6 wafer-level package measures under 1 mm × 1 mm with a 0.4 mm ball pitch, occupying less than 1 mm² of PCB area. Compared to a SOT-23-5 package requiring approximately 8 mm², the DSBGA-6 format saves over 85% of board space, enabling multiple interface drivers to be placed within the footprint of a single jellybean component on a 4-layer wearable PCB stack.
In which I2C or SPI bus scenarios would the XLMG1020YFFT bi-directional source-and-sink output deliver measurable signal integrity improvements?
On I2C buses operating at 400 kHz (Fast-mode) or 1 MHz (Fast-mode Plus) with long traces or heavy capacitive loading above 100 pF, the bi-directional source-and-sink drive of the XLMG1020YFFT pulls lines to valid logic levels faster than open-drain drivers relying solely on pull-up resistors. This reduces rise-time from over 300 ns to well under 120 ns on 3.3 V buses, keeping signals within the I2C specification and reducing read errors in multi-device sensor arrays.
Related Guides
How to Choose a 3528 SMD Indicator LED for Blue Status Lighting: Selection Guide
A practical 3528 SMD indicator LED selection guide using 150141BS73100 and related Wurth 150141 variants for blue status lighting.
Jul 5, 2026
BAS70KFILM Design Guide for Low-Leakage Signal Clamping and RF Detector Inputs
Practical BAS70KFILM design guidance for signal clamps, RF detector inputs, leakage control, capacitance, layout, and sourcing alternatives.
Jul 5, 2026
How to Choose a BAS70 Schottky Diode for Signal Clamping: Selection Guide
A practical BAS70KFILM and BAS70-family Schottky diode selection guide for signal clamping, RF detection, leakage, and topology choices.
Jul 4, 2026
AMC1202DWVR Design Guide for Isolated Current Sensing
Practical AMC1202DWVR design guide covering shunt sizing, isolation layout, input filtering, ADC scaling, and sourcing choices.
Jul 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”