XIO3130INMH Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments XIO3130INMH is a PCI Express to PCI bridge IC in a 196-ball BGA package, supporting up to 250 MBps data transfer rate and 100 MHz clock frequency. Enables seamless PCIe-to-PCI protocol bridging for legacy system integration. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 196
- Lifecycle
- OBSOLETE
- Datasheet
- XIO3130INMH Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- PCI Express to PCI bridge supporting 250 MBps maximum data transfer rate for high-bandwidth legacy bridging
- 100 MHz maximum clock frequency with full PCI bus compatibility for legacy peripheral support
- Compact 196-ball BGA package (14x14 mm) enabling space-efficient PCIe bridge integration on modern boards
Applications
The XIO3130INMH is designed for systems requiring connectivity between PCIe-based processors and legacy PCI peripherals, such as industrial control computers, embedded systems, and server backplane designs. It is used in applications where older PCI cards or devices must interface with modern PCIe platforms. Typical use cases include factory automation controllers, medical imaging systems, and telecommunications equipment with mixed-generation bus architectures.
Specifications
| YTEOL | 0 |
| Bus Compatibility | PCI |
| Clock Frequency-Max | 100MHz |
| Data Transfer Rate-Max | 250MBps |
| JESD-30 Code | S-PBGA-B196 |
| JESD-609 Code | e1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA196,14X14,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Max | 1.65V |
| Supply Voltage-Min | 1.35V |
| Supply Voltage-Nom | 1.5V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, PCI |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
| Country of Origin | Philippines |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for XIO3130INMH:
Frequently Asked Questions
What is the maximum data transfer rate supported by the XIO3130INMH?
The XIO3130INMH supports a maximum data transfer rate of 250 MBps, which aligns with the PCI 32-bit 33 MHz bus specification, enabling full-bandwidth legacy PCI device operation through the PCIe bridge.
What package does the XIO3130INMH come in?
The XIO3130INMH is housed in a 196-ball BGA (Ball Grid Array) package measuring 14x14 mm, designated S-PBGA-B196, which is a low-profile square grid array format suitable for compact board designs.
What bus interface standard does the XIO3130INMH support?
The XIO3130INMH supports the PCI bus standard with a maximum clock frequency of 100 MHz, providing a bridge between PCI Express host interfaces and conventional PCI peripherals running at standard PCI bus speeds.
What applications is the XIO3130INMH suitable for?
The XIO3130INMH is ideal for industrial computers, embedded systems, and telecommunications equipment that need to maintain compatibility with legacy PCI devices while using modern PCIe-based processors and chipsets.
Is the XIO3130INMH compatible with standard PCI cards and peripherals?
Yes, the XIO3130INMH provides full PCI bus compatibility, allowing standard 32-bit PCI cards and peripherals to operate correctly when connected to PCIe host systems, making it a reliable bridge for system upgrades and legacy device support.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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