XCVU9P-2FLGA2104I AMD Xilinx Integrated Circuit (BGA) In Stock
Virtex UltraScale+ FPGA with 2,586,150 logic cells, 147,780 CLBs, and 2104-BBGA package for high-performance computing and data center acceleration. Available in stock with worldwide shipping.
- Manufacturer
- AMD Xilinx
- Package
- BGA
- Pin Count
- 2104
- Lifecycle
- ACTIVE
- Datasheet
- XCVU9P-2FLGA2104I Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 2,586,150 Logic Cells for ultra-high-density programmable logic
- 147,780 CLBs enabling massive parallel processing architectures
- 2104-BBGA FCBGA package with 832 I/O pins for high-bandwidth connectivity
- Virtex UltraScale+ architecture with advanced power optimization
- 20-week factory lead time with global distribution availability
Applications
The XCVU9P-2FLGA2104I is ideal for data center acceleration, high-performance computing, and advanced networking applications requiring massive logic density. Its 2.5 million logic cells make it well-suited for machine learning inference engines, 100G/400G network line cards, and complex signal processing systems. The device also targets demanding aerospace, defense, and medical imaging applications where high throughput and reliability are critical.
Specifications
| Factory Lead Time | 20Weeks |
| YTEOL | 10 |
| JESD-30 Code | S-PBGA-B2104 |
| Number of CLBs | 147780 |
| Number of Inputs | 832 |
| Number of Logic Cells | 2586150 |
| Number of Outputs | 832 |
| Organization | 147780CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA2104,46X46,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Supply Voltage-Max | 0.876V |
| Supply Voltage-Min | 0.825V |
| Supply Voltage-Nom | 0.85V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.60 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the key specifications of the XCVU9P-2FLGA2104I?
The XCVU9P-2FLGA2104I is a Virtex UltraScale+ FPGA featuring 2,586,150 logic cells, 147,780 CLBs, 832 inputs and 832 outputs, housed in a 2104-BBGA FCBGA package. It carries a JESD-30 code of S-PBGA-B2104 and has a factory lead time of approximately 20 weeks.
What applications is the XCVU9P-2FLGA2104I best suited for?
This FPGA is designed for high-performance applications such as data center acceleration, machine learning inference, 100G/400G networking, high-frequency trading, advanced radar and signal processing, and medical imaging. Its massive logic density supports complex parallel workloads requiring deterministic low-latency performance.
What package type does the XCVU9P-2FLGA2104I use and what are its I/O capabilities?
The XCVU9P-2FLGA2104I uses a 2104-BBGA FCBGA (Flip-Chip Ball Grid Array) package measuring 46x46 mm. It provides 832 input pins and 832 output pins, delivering high pin-count connectivity essential for bandwidth-intensive system designs in networking and computing platforms.
Is the XCVU9P-2FLGA2104I available for purchase and what is the lead time?
The XCVU9P-2FLGA2104I is available through authorized AMD Xilinx distributors worldwide. The factory lead time is approximately 20 weeks. For competitive pricing and immediate stock inquiries, you can submit a quote request to receive offers from global suppliers with worldwide shipping options.
Are there alternative parts or pin-compatible options to the XCVU9P-2FLGA2104I?
Within the Virtex UltraScale+ family, AMD Xilinx offers variants such as the XCVU9P in different speed grades and package configurations. Depending on your logic density requirements, alternatives in the same family include lower-density options like the XCVU7P or higher-density devices like the XCVU13P, all sharing the UltraScale+ architecture.
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