XCVU9P-2FLGA2104I AMD Xilinx Integrated Circuit (BGA) In Stock

Name: XCVU9P-2FLGA2104I
Brand: AMD Xilinx
SKU: XCVU9P-2FLGA2104I
Availability: InStock

Virtex UltraScale+ FPGA with 2,586,150 logic cells, 147,780 CLBs, and 2104-BBGA package for high-performance computing and data center acceleration. Available in stock with worldwide shipping.

ACTIVEIntegrated CircuitVerified Apr 2026

Package / Visual Reference

XCVU9P-2FLGA2104IBGA

Quick Facts

Manufacturer: AMD Xilinx
Package: BGA
Pin Count: 2104
Lifecycle: ACTIVE
Datasheet: XCVU9P-2FLGA2104I Datasheet PDF
Category: Integrated Circuit
Temp Range: -40.0°C to 100.0°C
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of XCVU9P-2FLGA2104I?

2,586,150 Logic Cells for ultra-high-density programmable logic
147,780 CLBs enabling massive parallel processing architectures
2104-BBGA FCBGA package with 832 I/O pins for high-bandwidth connectivity
Virtex UltraScale+ architecture with advanced power optimization
20-week factory lead time with global distribution availability

What is XCVU9P-2FLGA2104I used for?

The XCVU9P-2FLGA2104I is ideal for data center acceleration, high-performance computing, and advanced networking applications requiring massive logic density. Its 2.5 million logic cells make it well-suited for machine learning inference engines, 100G/400G network line cards, and complex signal processing systems. The device also targets demanding aerospace, defense, and medical imaging applications where high throughput and reliability are critical.

What are the specifications of XCVU9P-2FLGA2104I?

Factory Lead Time	20Weeks
YTEOL	10
JESD-30 Code	S-PBGA-B2104
Number of CLBs	147780
Number of Inputs	832
Number of Logic Cells	2586150
Number of Outputs	832
Organization	147780CLBS
Package Body Material	PLASTIC/EPOXY
Package Equivalence Code	BGA2104,46X46,40
Package Shape	SQUARE
Package Style	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage-Max	0.876V
Supply Voltage-Min	0.825V
Supply Voltage-Nom	0.85V
Surface Mount	YES
Temperature Grade	INDUSTRIAL
Terminal Form	BALL
Terminal Pitch	1mm
Terminal Position	BOTTOM
Package	BGA

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
HTS Code	8542.31.00.60
Country of Origin	Taiwan

Where can I find the XCVU9P-2FLGA2104I datasheet?

XCVU9P-2FLGA2104I Datasheet Download

Official datasheet from AMD Xilinx

What are equivalent replacements for XCVU9P-2FLGA2104I?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What are the key specifications of the XCVU9P-2FLGA2104I?

The XCVU9P-2FLGA2104I is a Virtex UltraScale+ FPGA featuring 2,586,150 logic cells, 147,780 CLBs, 832 inputs and 832 outputs, housed in a 2104-BBGA FCBGA package. It carries a JESD-30 code of S-PBGA-B2104 and has a factory lead time of approximately 20 weeks.

What applications is the XCVU9P-2FLGA2104I best suited for?

This FPGA is designed for high-performance applications such as data center acceleration, machine learning inference, 100G/400G networking, high-frequency trading, advanced radar and signal processing, and medical imaging. Its massive logic density supports complex parallel workloads requiring deterministic low-latency performance.

What package type does the XCVU9P-2FLGA2104I use and what are its I/O capabilities?

The XCVU9P-2FLGA2104I uses a 2104-BBGA FCBGA (Flip-Chip Ball Grid Array) package measuring 46x46 mm. It provides 832 input pins and 832 output pins, delivering high pin-count connectivity essential for bandwidth-intensive system designs in networking and computing platforms.

Is the XCVU9P-2FLGA2104I available for purchase and what is the lead time?

The XCVU9P-2FLGA2104I is available through authorized AMD Xilinx distributors worldwide. The factory lead time is approximately 20 weeks. For competitive pricing and immediate stock inquiries, you can submit a quote request to receive offers from global suppliers with worldwide shipping options.

Are there alternative parts or pin-compatible options to the XCVU9P-2FLGA2104I?

Within the Virtex UltraScale+ family, AMD Xilinx offers variants such as the XCVU9P in different speed grades and package configurations. Depending on your logic density requirements, alternatives in the same family include lower-density options like the XCVU7P or higher-density devices like the XCVU13P, all sharing the UltraScale+ architecture.

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