XCVU13P-2FLGA2577I Xilinx Integrated Circuit (BGA) In Stock
Virtex UltraScale+ FPGA with 3.78M logic cells, 832 I/O pins, and 2577-BBGA package. Features industry-leading density for high-performance computing, data center acceleration, and advanced signal processing applications. Available with worldwide shipping.
- Manufacturer
- Xilinx
- Package
- BGA
- Pin Count
- 2577
- Lifecycle
- ACTIVE
- Datasheet
- XCVU13P-2FLGA2577I Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 3,780,000 logic cells with 216,000 CLBs for ultra-high-density design
- 832 dedicated I/O pins supporting high-bandwidth parallel interfaces
- 2577-BBGA FCBGA package enabling compact, high-pin-count PCB integration
- UltraScale+ architecture with advanced DSP and memory resources for HPC workloads
- 20-week factory lead time with global distribution support
Applications
The XCVU13P-2FLGA2577I is widely deployed in data center acceleration cards, high-frequency trading systems, and AI/ML inference engines where maximum logic density is critical. Its UltraScale+ architecture makes it ideal for advanced radar and electronic warfare signal processing, as well as 100G/400G line-rate network packet processing. Research institutions and semiconductor companies also use it for ASIC prototyping and complex SoC emulation platforms.
Specifications
| Factory Lead Time | 20Weeks |
| YTEOL | 10 |
| JESD-30 Code | S-PBGA-B2577 |
| Number of CLBs | 216000 |
| Number of Inputs | 832 |
| Number of Logic Cells | 3780000 |
| Number of Outputs | 832 |
| Organization | 216000CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA2577,51X51,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Supply Voltage-Max | 0.876V |
| Supply Voltage-Min | 0.825V |
| Supply Voltage-Nom | 0.85V |
| Surface Mount | YES |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| HTS Code | 8542.31.00.60 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the key specifications of the XCVU13P-2FLGA2577I?
The XCVU13P-2FLGA2577I is a Xilinx Virtex UltraScale+ FPGA featuring 3,780,000 logic cells organized across 216,000 CLBs, 832 input and 832 output pins, and housed in a 2577-ball BBGA FCBGA package (51x51 mm, 40 mm pitch). It is rated at speed grade -2 and is an industrial-temperature variant.
What applications is the XCVU13P-2FLGA2577I best suited for?
This device targets demanding applications including data center FPGA acceleration, AI and machine learning inference, high-frequency trading, advanced radar and electronic warfare signal processing, 100G/400G network line cards, and large-scale ASIC prototyping. Its 3.78M logic cell density makes it one of the highest-capacity FPGAs available for these workloads.
What is the package type and how does it affect board design?
The XCVU13P-2FLGA2577I uses a 2577-ball FCBGA (Flip-Chip Ball Grid Array) package measuring 51x51 mm with a 40 mm body. This large-format BGA package requires careful PCB design with controlled impedance routing, proper via fanout strategies, and robust power delivery networks to ensure signal integrity at high operating frequencies.
What is the typical lead time and availability for XCVU13P-2FLGA2577I?
The factory lead time for XCVU13P-2FLGA2577I is approximately 20 weeks. Due to its high-end positioning, stock levels can vary. Buyers are advised to plan procurement well in advance or source from authorized distributors and broker networks that maintain spot inventory for urgent project timelines.
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