XCVU13P-2FLGA2577I Xilinx Integrated Circuit (BGA) In Stock

Name: XCVU13P-2FLGA2577I
Brand: Xilinx
SKU: XCVU13P-2FLGA2577I
Availability: InStock

Virtex UltraScale+ FPGA with 3.78M logic cells, 832 I/O pins, and 2577-BBGA package. Features industry-leading density for high-performance computing, data center acceleration, and advanced signal processing applications. Available with worldwide shipping.

ACTIVEIntegrated CircuitVerified Apr 2026

Package / Visual Reference

XCVU13P-2FLGA2577IBGA

Quick Facts

Manufacturer: Xilinx
Package: BGA
Pin Count: 2577
Lifecycle: ACTIVE
Datasheet: XCVU13P-2FLGA2577I Datasheet PDF
Category: Integrated Circuit
Temp Range: -40.0°C to 100.0°C
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of XCVU13P-2FLGA2577I?

3,780,000 logic cells with 216,000 CLBs for ultra-high-density design
832 dedicated I/O pins supporting high-bandwidth parallel interfaces
2577-BBGA FCBGA package enabling compact, high-pin-count PCB integration
UltraScale+ architecture with advanced DSP and memory resources for HPC workloads
20-week factory lead time with global distribution support

What is XCVU13P-2FLGA2577I used for?

The XCVU13P-2FLGA2577I is widely deployed in data center acceleration cards, high-frequency trading systems, and AI/ML inference engines where maximum logic density is critical. Its UltraScale+ architecture makes it ideal for advanced radar and electronic warfare signal processing, as well as 100G/400G line-rate network packet processing. Research institutions and semiconductor companies also use it for ASIC prototyping and complex SoC emulation platforms.

What are the specifications of XCVU13P-2FLGA2577I?

Factory Lead Time	20Weeks
YTEOL	10
JESD-30 Code	S-PBGA-B2577
Number of CLBs	216000
Number of Inputs	832
Number of Logic Cells	3780000
Number of Outputs	832
Organization	216000CLBS
Package Body Material	PLASTIC/EPOXY
Package Equivalence Code	BGA2577,51X51,40
Package Shape	SQUARE
Package Style	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY
Supply Voltage-Max	0.876V
Supply Voltage-Min	0.825V
Supply Voltage-Nom	0.85V
Surface Mount	YES
Temperature Grade	INDUSTRIAL
Terminal Form	BALL
Terminal Pitch	1mm
Terminal Position	BOTTOM
Package	BGA

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
HTS Code	8542.31.00.60

Where can I find the XCVU13P-2FLGA2577I datasheet?

XCVU13P-2FLGA2577I Datasheet Download

Official datasheet from Xilinx

What are equivalent replacements for XCVU13P-2FLGA2577I?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What are the key specifications of the XCVU13P-2FLGA2577I?

The XCVU13P-2FLGA2577I is a Xilinx Virtex UltraScale+ FPGA featuring 3,780,000 logic cells organized across 216,000 CLBs, 832 input and 832 output pins, and housed in a 2577-ball BBGA FCBGA package (51x51 mm, 40 mm pitch). It is rated at speed grade -2 and is an industrial-temperature variant.

What applications is the XCVU13P-2FLGA2577I best suited for?

This device targets demanding applications including data center FPGA acceleration, AI and machine learning inference, high-frequency trading, advanced radar and electronic warfare signal processing, 100G/400G network line cards, and large-scale ASIC prototyping. Its 3.78M logic cell density makes it one of the highest-capacity FPGAs available for these workloads.

What is the package type and how does it affect board design?

The XCVU13P-2FLGA2577I uses a 2577-ball FCBGA (Flip-Chip Ball Grid Array) package measuring 51x51 mm with a 40 mm body. This large-format BGA package requires careful PCB design with controlled impedance routing, proper via fanout strategies, and robust power delivery networks to ensure signal integrity at high operating frequencies.

What is the typical lead time and availability for XCVU13P-2FLGA2577I?

The factory lead time for XCVU13P-2FLGA2577I is approximately 20 weeks. Due to its high-end positioning, stock levels can vary. Buyers are advised to plan procurement well in advance or source from authorized distributors and broker networks that maintain spot inventory for urgent project timelines.

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Lead Time3-7 business days

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OriginChina (Authorized)

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CTO, AutoDrive Systems, Italy