XCKU040-3FFVA1156E XILINX Integrated Circuit (BGA) In Stock
Xilinx XCKU040-3FFVA1156E is a Kintex UltraScale FPGA with 530,250 logic cells and 1,920 CLBs in a 1156-pin FFVA BGA package. Supports high-speed serial transceivers and advanced DSP blocks for data-intensive applications. Available from global distributors with worldwide shipping.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 1156
- Lifecycle
- ACTIVE
- Datasheet
- XCKU040-3FFVA1156E Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 100.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XCKU040-3FFVA1156E?
- 530,250 logic cells with 1,920 CLBs enabling complex parallel processing pipelines
- 1156-pin FFVA BGA package with 520 user I/O pins for high-bandwidth external interface connectivity
- UltraScale architecture with advanced DSP48E2 slices supporting up to 28.9 Gb/s serial transceivers
What is XCKU040-3FFVA1156E used for?
The XCKU040-3FFVA1156E is deployed in high-performance computing accelerators, 100G Ethernet line cards, and radar signal processing systems requiring over 500,000 logic cells. Its 520 user I/O pins and UltraScale architecture make it suitable for protocol bridging in data center switching fabrics and network packet processing engines. Defense and aerospace applications leverage its hardened UltraRAM blocks and multi-gigabit transceivers for real-time wideband signal processing.
What are the specifications of XCKU040-3FFVA1156E?
| Factory Lead Time | 16Weeks |
| YTEOL | 10 |
| JESD-30 Code | S-PBGA-B1156 |
| JESD-609 Code | e1 |
| Number of CLBs | 1920 |
| Number of Inputs | 520 |
| Number of Logic Cells | 530250 |
| Number of Outputs | 520 |
| Organization | 1920CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA1156,34X34,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 1.03V |
| Supply Voltage-Min | 0.97V |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Technology | 16nm |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| HTS Code | 8542.31.00.60 |
| Country of Origin | Taiwan |
Where can I find the XCKU040-3FFVA1156E datasheet?
XCKU040-3FFVA1156E Datasheet DownloadOfficial datasheet from XILINX
What are equivalent replacements for XCKU040-3FFVA1156E?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many logic cells and CLBs does the XCKU040-3FFVA1156E contain for complex designs?
The XCKU040-3FFVA1156E contains 530,250 logic cells organized into 1,920 CLBs (Configurable Logic Blocks). This capacity supports large design implementations such as multi-core soft processors, full-rate 100G Ethernet MACs, and complex DSP algorithms running in parallel with 520 user I/O pins for external interfacing.
What serial transceiver speeds does the XCKU040-3FFVA1156E support for high-bandwidth links?
As a Kintex UltraScale device, the XCKU040-3FFVA1156E supports GTH transceivers capable of line rates up to 16.3 Gb/s per lane, enabling protocols such as 10G/25G Ethernet, PCIe Gen3 x8 at 64 Gb/s aggregate, and JESD204B for high-speed ADC/DAC interfaces in telecommunications and defense radar systems.
When is XCKU040-3FFVA1156E a practical alternative to the larger XCKU060 for cost-sensitive projects?
The XCKU040-3FFVA1156E is a cost-effective alternative to the XCKU060 when design utilization stays below 530,000 logic cells and the 1156-pin BGA footprint meets board space constraints. It typically costs 20-30% less than the XCKU060 while sharing the same UltraScale architecture, matching signal-integrity, transceiver count, and DSP block performance for medium-complexity applications.
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