XCC2652R1FRGZR Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock

XCC2652R1FRGZR is a 32-bit ARM Cortex-M0 multiprotocol wireless MCU by Texas Instruments in a 48-pin QFN package, supporting Zigbee, Bluetooth LE 5, and Thread from a single chip. Key specs: 32-bit Cortex-M0, 256 KB ROM, 31 I/O lines. From $4.50, in stock with worldwide shipping.

OBSOLETEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
XCC2652R1FRGZRQuad Flat No-Lead
Quick Facts
Manufacturer
Texas Instruments
Package
Quad Flat No-Lead
Pin Count
49
Lifecycle
OBSOLETE
Category
Integrated Circuit
Temp Range
-40.0°C to 85.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of XCC2652R1FRGZR?

  • Multiprotocol radio supports Zigbee, Bluetooth LE 5, Thread, and IEEE 802.15.4 from a single 2.4 GHz radio, eliminating multiple RF ICs
  • 32-bit ARM Cortex-M0 application processor with 256 KB ROM and on-chip ADC enables standalone IoT node operation without an external MCU
  • 48-pin QFN package with 31 I/O lines provides ample connectivity for sensor peripherals and display interfaces in compact wireless devices

What is XCC2652R1FRGZR used for?

XCC2652R1FRGZR is designed for smart home devices, building automation sensors, and industrial IoT nodes requiring concurrent multiprotocol wireless operation. Its support for Zigbee, Thread, and Bluetooth LE enables simultaneous mesh networking and smartphone connectivity from a single chip, simplifying Matter-compliant product designs. The integrated ADC and 31 I/O lines make it suitable for wireless sensor nodes that also drive local actuators or small displays.

What are the specifications of XCC2652R1FRGZR?

Date Of Intro2018-01-26
YTEOL0
Has ADCYES
Additional FeatureIT ALSO HAS 256KB ROM
Bit Size32
DAC ChannelsNO
DMA ChannelsYES
JESD-30 CodeS-PQCC-N48
JESD-609 Codee4
Number of I/O Lines31
On Chip Program ROM Width8
PWM ChannelsNO
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeLCC48,.28SQ,20
Package ShapeSQUARE
Package StyleCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)260
RAM (bytes)81920
ROM (words)360448
ROM ProgrammabilityFLASH
Speed48MHz
Supply Voltage-Max3.8V
Supply Voltage-Min1.8V
Supply Voltage-Nom3V
Surface MountYES
TechnologyCMOS
Temperature GradeINDUSTRIAL
Terminal FinishNICKEL PALLADIUM GOLD
Terminal FormNO LEAD
Terminal Pitch0.5mm
Terminal PositionQUAD
Time@Peak Reflow Temperature-Max (s)30
uPs/uCs/Peripheral ICs TypeMICROCONTROLLER, RISC
PackageQuad Flat No-Lead

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
HTS Code8542.31.00.25

Where can I find the XCC2652R1FRGZR datasheet?

XCC2652R1FRGZR Datasheet Download

Official datasheet from Texas Instruments

What are equivalent replacements for XCC2652R1FRGZR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Which wireless protocols does XCC2652R1FRGZR support concurrently and how does that simplify IoT design?

XCC2652R1FRGZR supports Zigbee, Bluetooth LE 5, Thread, and IEEE 802.15.4 concurrently from a single 2.4 GHz radio. This multiprotocol capability eliminates the need for a separate Bluetooth module alongside a Zigbee chip, reducing BOM cost, board area, and antenna complexity in Matter-compatible smart home devices such as smart plugs, door locks, and climate sensors.

How much memory does XCC2652R1FRGZR offer and is it sufficient for a full Zigbee 3.0 stack plus application?

XCC2652R1FRGZR includes 256 KB of ROM for protocol stack code and additional on-chip SRAM for stack and application variables. Texas Instruments' TI-OpenThread and Z-Stack Zigbee implementations are pre-compiled into ROM, leaving external flash (connected via SPI) for application code and network parameters, so a full Zigbee 3.0 coordinator stack plus a modest application can coexist within the memory architecture.

Can XCC2652R1FRGZR be used as a network co-processor alongside an existing host MCU?

Yes, XCC2652R1FRGZR supports a network processor (NP) mode where it handles all wireless protocol layers and communicates with a host MCU via UART or SPI at speeds up to 10 MHz. This allows an existing host MCU, such as an STM32 or nRF52, to offload all RF stack processing to the XCC2652R1FRGZR, reducing host firmware complexity while retaining full Zigbee and Bluetooth LE 5 capability.

What I/O count and peripheral set does XCC2652R1FRGZR offer for a sensor hub design?

XCC2652R1FRGZR provides 31 general-purpose I/O lines in its 48-pin QFN package, along with an integrated ADC, DMA controller, and multiple serial interfaces. This supports connecting multiple I2C or SPI sensors, driving a small UART debug interface, and reading analog sensor outputs simultaneously, making it a complete wireless sensor hub solution without external interface expanders.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

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CTO, AutoDrive Systems, Italy