XCC2652R1FRGZR Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
XCC2652R1FRGZR is a 32-bit ARM Cortex-M0 multiprotocol wireless MCU by Texas Instruments in a 48-pin QFN package, supporting Zigbee, Bluetooth LE 5, and Thread from a single chip. Key specs: 32-bit Cortex-M0, 256 KB ROM, 31 I/O lines. From $4.50, in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 49
- Lifecycle
- OBSOLETE
- Datasheet
- XCC2652R1FRGZR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XCC2652R1FRGZR?
- Multiprotocol radio supports Zigbee, Bluetooth LE 5, Thread, and IEEE 802.15.4 from a single 2.4 GHz radio, eliminating multiple RF ICs
- 32-bit ARM Cortex-M0 application processor with 256 KB ROM and on-chip ADC enables standalone IoT node operation without an external MCU
- 48-pin QFN package with 31 I/O lines provides ample connectivity for sensor peripherals and display interfaces in compact wireless devices
What is XCC2652R1FRGZR used for?
XCC2652R1FRGZR is designed for smart home devices, building automation sensors, and industrial IoT nodes requiring concurrent multiprotocol wireless operation. Its support for Zigbee, Thread, and Bluetooth LE enables simultaneous mesh networking and smartphone connectivity from a single chip, simplifying Matter-compliant product designs. The integrated ADC and 31 I/O lines make it suitable for wireless sensor nodes that also drive local actuators or small displays.
What are the specifications of XCC2652R1FRGZR?
| Date Of Intro | 2018-01-26 |
| YTEOL | 0 |
| Has ADC | YES |
| Additional Feature | IT ALSO HAS 256KB ROM |
| Bit Size | 32 |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PQCC-N48 |
| JESD-609 Code | e4 |
| Number of I/O Lines | 31 |
| On Chip Program ROM Width | 8 |
| PWM Channels | NO |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC48,.28SQ,20 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| RAM (bytes) | 81920 |
| ROM (words) | 360448 |
| ROM Programmability | FLASH |
| Speed | 48MHz |
| Supply Voltage-Max | 3.8V |
| Supply Voltage-Min | 1.8V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.25 |
Where can I find the XCC2652R1FRGZR datasheet?
XCC2652R1FRGZR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XCC2652R1FRGZR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which wireless protocols does XCC2652R1FRGZR support concurrently and how does that simplify IoT design?
XCC2652R1FRGZR supports Zigbee, Bluetooth LE 5, Thread, and IEEE 802.15.4 concurrently from a single 2.4 GHz radio. This multiprotocol capability eliminates the need for a separate Bluetooth module alongside a Zigbee chip, reducing BOM cost, board area, and antenna complexity in Matter-compatible smart home devices such as smart plugs, door locks, and climate sensors.
How much memory does XCC2652R1FRGZR offer and is it sufficient for a full Zigbee 3.0 stack plus application?
XCC2652R1FRGZR includes 256 KB of ROM for protocol stack code and additional on-chip SRAM for stack and application variables. Texas Instruments' TI-OpenThread and Z-Stack Zigbee implementations are pre-compiled into ROM, leaving external flash (connected via SPI) for application code and network parameters, so a full Zigbee 3.0 coordinator stack plus a modest application can coexist within the memory architecture.
Can XCC2652R1FRGZR be used as a network co-processor alongside an existing host MCU?
Yes, XCC2652R1FRGZR supports a network processor (NP) mode where it handles all wireless protocol layers and communicates with a host MCU via UART or SPI at speeds up to 10 MHz. This allows an existing host MCU, such as an STM32 or nRF52, to offload all RF stack processing to the XCC2652R1FRGZR, reducing host firmware complexity while retaining full Zigbee and Bluetooth LE 5 capability.
What I/O count and peripheral set does XCC2652R1FRGZR offer for a sensor hub design?
XCC2652R1FRGZR provides 31 general-purpose I/O lines in its 48-pin QFN package, along with an integrated ADC, DMA controller, and multiple serial interfaces. This supports connecting multiple I2C or SPI sensors, driving a small UART debug interface, and reading analog sensor outputs simultaneously, making it a complete wireless sensor hub solution without external interface expanders.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit