XCC1352R1F3RGZR Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
Texas Instruments XCC1352R1F3RGZR is a SimpleLink multi-band wireless MCU supporting Sub-1 GHz and 2.4 GHz protocols with 352 KB Flash, 80 KB RAM, 28 I/O pins, and an ARM Cortex-M4F core in a 48-pin QFN package. Designed for IoT sensor nodes and smart home devices requiring dual-band connectivity. Available from stock worldwide.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 49
- Lifecycle
- OBSOLETE
- Datasheet
- XCC1352R1F3RGZR Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XCC1352R1F3RGZR?
- Dual-band radio supporting Sub-1 GHz and 2.4 GHz (Zigbee, Thread, BLE) in a single 48-pin QFN chip for multi-protocol IoT
- ARM Cortex-M4F core with 352 KB Flash and 80 KB RAM runs both RF protocol stack and application code without external memory
- 28 configurable I/O lines with integrated ADC, DMA, and PWM channels enable direct sensor and actuator interfacing in smart-node designs
What is XCC1352R1F3RGZR used for?
XCC1352R1F3RGZR is targeted at IoT edge nodes in smart home, building automation, and industrial wireless sensor networks requiring simultaneous Sub-1 GHz long-range and 2.4 GHz mesh connectivity. Its dual-band capability allows a single chip to bridge Zigbee/Thread mesh networks with Sub-1 GHz proprietary or Wi-SUN protocols. The 48-pin QFN package and integrated power management suit compact battery-powered sensor designs with low-power sleep modes.
What are the specifications of XCC1352R1F3RGZR?
| Date Of Intro | 2018-01-26 |
| YTEOL | 0 |
| Has ADC | YES |
| Additional Feature | 32.768KHZ NOMINAL CRYSTAL CLOCK AVAILABLE |
| DAC Channels | NO |
| DMA Channels | YES |
| JESD-30 Code | S-PQCC-N48 |
| Number of I/O Lines | 28 |
| On Chip Program ROM Width | 8 |
| PWM Channels | YES |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| RAM (bytes) | 81920 |
| ROM (words) | 360448 |
| ROM Programmability | FLASH |
| Speed | 48MHz |
| Supply Voltage-Max | 3.8V |
| Supply Voltage-Min | 1.8V |
| Supply Voltage-Nom | 3V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.30 |
Where can I find the XCC1352R1F3RGZR datasheet?
XCC1352R1F3RGZR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XCC1352R1F3RGZR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which wireless protocols does XCC1352R1F3RGZR support and at what frequency bands?
XCC1352R1F3RGZR supports Sub-1 GHz protocols (proprietary, Wi-SUN, IEEE 802.15.4g) and 2.4 GHz protocols including Zigbee, Thread, and Bluetooth Low Energy (BLE 5). The dual-band radio operates across both frequency ranges from a single chip. The Sub-1 GHz band provides longer range and better wall penetration for outdoor smart metering, while the 2.4 GHz band suits dense indoor mesh topologies in smart home automation.
How does XCC1352R1F3RGZR's 352 KB Flash and 80 KB RAM support concurrent RF stack and application execution?
The 352 KB Flash accommodates TI's full SimpleLink SDK RF protocol stack (approximately 80 KB to 140 KB depending on the protocol) plus application firmware, leaving 200 KB or more for user code. The 80 KB RAM is split between the RF core and the ARM Cortex-M4F application processor, enabling concurrent packet buffering and sensor data processing. This removes the need for external SPI Flash or SRAM in typical IoT nodes, reducing BOM cost and PCB area.
For a compact battery-powered smart meter node, does XCC1352R1F3RGZR's 48-pin QFN package offer routing advantages over module-based solutions?
The 48-pin QFN package measures approximately 7 mm × 7 mm, which is significantly smaller than pre-certified RF modules that often exceed 20 mm × 30 mm. For high-volume smart meter designs where PCB area directly affects product cost, the bare chip allows a tighter board layout with 28 I/O pins directly accessible. However, the chip-based approach requires obtaining your own regulatory certifications (FCC, CE) for the RF subsystem, whereas certified modules eliminate this step for lower-volume or faster time-to-market projects.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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