XC7Z035-2FFG900I XILINX Integrated Circuit (BGA) In Stock

XC7Z035-2FFG900I is a Xilinx Zynq-7000 programmable SoC in FBGA-900. It combines 28 nm logic, -2 speed grade, industrial screening, and 245°C reflow. From $ pricing, in stock, worldwide shipping.

ACTIVEIntegrated CircuitVerified Jul 2026
Package / Visual Reference
XC7Z035-2FFG900IBGA
Quick Facts
Manufacturer
XILINX
Package
BGA
Pin Count
900
Lifecycle
ACTIVE
Category
Integrated Circuit
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

What are the key features of XC7Z035-2FFG900I?

  • Zynq-7000 programmable SoC architecture combining ARM processing and FPGA fabric
  • FBGA-900 high-density package for complex I/O and memory interfaces
  • 28 nm process technology for lower power programmable logic integration
  • -2 speed grade industrial ordering code for performance-focused embedded systems
  • 245°C peak reflow rating with 30 s maximum time at peak

What is XC7Z035-2FFG900I used for?

XC7Z035-2FFG900I is used in industrial control, embedded vision, communications, and data acquisition systems that need processor-class software plus programmable logic acceleration. It fits designs requiring dense BGA routing, configurable I/O, and long-life sourcing for factory or infrastructure equipment.

What are the specifications of XC7Z035-2FFG900I?

Factory Lead Time16Weeks
YTEOL14
Peak Reflow Temperature (Cel)245
Technology28nm
Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)30
PackageBGA

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 4
HTS Code8542.31.00.60
Country of OriginTaiwan

Where can I find the XC7Z035-2FFG900I datasheet?

XC7Z035-2FFG900I Datasheet Download

Official datasheet from XILINX

What are equivalent replacements for XC7Z035-2FFG900I?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How should engineers evaluate XC7Z035-2FFG900I for industrial programmable-logic designs?

It suits high-density embedded designs needing a Zynq-7000 programmable SoC in an FBGA-900 footprint, with listed 28 nm technology and 245°C peak reflow process compatibility.

Which assembly controls matter for the FFG900 BGA package?

The fetched manufacturing data lists a 245°C peak reflow temperature and 30 s maximum time at peak, so SMT profiles should match BGA handling and process controls.

What lead-time signal should buyers consider when planning XC7Z035-2FFG900I builds?

Current context reports a 16-week factory lead time and FBGA-900 package, so buyers should reserve schedule buffer and confirm 245°C assembly compatibility for production lots.

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About XILINX

XILINX is a leading electronic component manufacturer. FindMyChip sources XILINX ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
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pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.

MR
Marco Rossi
CTO, AutoDrive Systems, Italy