XC7Z035-2FFG900I XILINX Integrated Circuit (BGA) In Stock
XC7Z035-2FFG900I is a Xilinx Zynq-7000 programmable SoC in FBGA-900. It combines 28 nm logic, -2 speed grade, industrial screening, and 245°C reflow. From $ pricing, in stock, worldwide shipping.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 900
- Lifecycle
- ACTIVE
- Datasheet
- XC7Z035-2FFG900I Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XC7Z035-2FFG900I?
- Zynq-7000 programmable SoC architecture combining ARM processing and FPGA fabric
- FBGA-900 high-density package for complex I/O and memory interfaces
- 28 nm process technology for lower power programmable logic integration
- -2 speed grade industrial ordering code for performance-focused embedded systems
- 245°C peak reflow rating with 30 s maximum time at peak
What is XC7Z035-2FFG900I used for?
XC7Z035-2FFG900I is used in industrial control, embedded vision, communications, and data acquisition systems that need processor-class software plus programmable logic acceleration. It fits designs requiring dense BGA routing, configurable I/O, and long-life sourcing for factory or infrastructure equipment.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 4 |
| HTS Code | 8542.31.00.60 |
| Country of Origin | Taiwan |
Where can I find the XC7Z035-2FFG900I datasheet?
XC7Z035-2FFG900I Datasheet DownloadOfficial datasheet from XILINX
What are equivalent replacements for XC7Z035-2FFG900I?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How should engineers evaluate XC7Z035-2FFG900I for industrial programmable-logic designs?
It suits high-density embedded designs needing a Zynq-7000 programmable SoC in an FBGA-900 footprint, with listed 28 nm technology and 245°C peak reflow process compatibility.
Which assembly controls matter for the FFG900 BGA package?
The fetched manufacturing data lists a 245°C peak reflow temperature and 30 s maximum time at peak, so SMT profiles should match BGA handling and process controls.
What lead-time signal should buyers consider when planning XC7Z035-2FFG900I builds?
Current context reports a 16-week factory lead time and FBGA-900 package, so buyers should reserve schedule buffer and confirm 245°C assembly compatibility for production lots.
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Why Buy from FindMyChip
About XILINX
XILINX is a leading electronic component manufacturer. FindMyChip sources XILINX ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”
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