XC6SLX25-2FTG256C XILINX Integrated Circuit (BGA) In Stock
XC6SLX25-2FTG256C from XILINX is a integrated Circuit. Key specs include 12 Weeks, Clock Frequency-Max: 667 MHz, Combinatorial Delay of a CLB-Max: 0.26 ns. From inquiry pricing, buyers can request stock with worldwide shipping.
- Manufacturer
- XILINX
- Package
- BGA
- Pin Count
- 256
- Lifecycle
- ACTIVE
- Datasheet
- XC6SLX25-2FTG256C Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $51.8400(MOQ 1)
- Temp Range
- ?°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- XILINX Integrated Circuit for XC6SLX25-2FTG256C sourcing and replacement review
- BGA package configuration for board-level fit checks
- 12 Weeks
- Clock Frequency-Max: 667 MHz
- 256-pin configuration for footprint and connector mapping
Applications
XC6SLX25-2FTG256C is used in assemblies that require a integrated Circuit with 12 Weeks and a documented BGA form factor. Typical uses include maintenance builds, approved-source replacements, prototype validation, and production purchasing where engineers must match electrical, mechanical, and lifecycle requirements before release.
Specifications
| Factory Lead Time | 12Weeks |
| YTEOL | 4 |
| Clock Frequency-Max | 667MHz |
| Combinatorial Delay of a CLB-Max | 0.26ns |
| JESD-30 Code | S-PBGA-B256 |
| JESD-609 Code | e1 |
| Number of CLBs | 1879 |
| Number of Inputs | 186 |
| Number of Logic Cells | 24051 |
| Number of Outputs | 186 |
| Organization | 1879CLBS |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA256,16X16,40 |
| Package Shape | SQUARE |
| Package Style | GRID ARRAY, LOW PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Qualification Status | Not Qualified |
| Supply Voltage-Max | 1.26V |
| Supply Voltage-Min | 1.14V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS, 40 nm |
| Temperature Grade | OTHER |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| Terminal Form | BALL |
| Terminal Pitch | 1mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| HTS Code | 8542.31.00.60 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for XC6SLX25-2FTG256C:
suggested
suggested
Frequently Asked Questions
Which design checks matter before using XC6SLX25-2FTG256C in a integrated Circuit application?
XC6SLX25-2FTG256C should be checked against 12 Weeks, the current datasheet, and the target circuit conditions before it is approved for a production design.
How should the BGA package influence board approval for XC6SLX25-2FTG256C?
The BGA package should be compared with the PCB footprint, assembly process, and 256 pins requirement so purchasing does not approve a mechanically incompatible substitute.
When comparing alternates, which XILINX specification should stay matched?
Keep Combinatorial Delay of a CLB-Max: 0.26 ns aligned first, then review tolerance, lifecycle, compliance, and sourcing risk because nearby MPNs can differ in ratings even when descriptions look similar.
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Why Buy from FindMyChip
About XILINX
XILINX is a leading electronic component manufacturer. FindMyChip sources XILINX ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $54.0000 | $54.00 |
| 3+ | $51.8400 | $155.52 |
In Stock · 24h Response · Worldwide Shipping
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