XAM3359AZCZ100 Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments XAM3359AZCZ100 is a Sitara ARM Cortex-A8 single-core 32-bit applications processor running at up to 1000 MHz, featuring integrated PRU-ICSS, gigabit Ethernet, USB 2.0, and LCD controller interfaces in a 324-pin NFBGA package. It is designed for industrial automation, human machine interfaces (HMI), and embedded Linux applications requiring deterministic real-time I/O alongside a rich OS environment. The XAM3359 extended-temperature variant targets demanding industrial and communications equipment operating across wide temperature ranges.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 324
- Lifecycle
- ACTIVE
- Datasheet
- XAM3359AZCZ100 Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XAM3359AZCZ100?
- ARM Cortex-A8 core operating at up to 1000 MHz for Linux and RTOS embedded applications
- Dual PRU-ICSS programmable real-time units enabling deterministic industrial protocol support
- Integrated gigabit Ethernet MAC and USB 2.0 for industrial network and host connectivity
- On-chip LCD controller and 3D graphics accelerator for HMI display applications
- 324-pin NFBGA package with 15 mm x 15 mm body supporting high-density peripheral integration
- Extended industrial temperature grade for reliable operation in harsh environments
What is XAM3359AZCZ100 used for?
The XAM3359AZCZ100 targets industrial HMI panels, programmable logic controllers, and factory automation gateways running embedded Linux or RTOS that require a 1000 MHz Cortex-A8 processor with real-time I/O via the dual PRU-ICSS cores. Communications infrastructure equipment such as protocol converters, energy meters, and EtherCAT or PROFINET field devices leverage its multiple industrial Ethernet MACs and deterministic PRU execution. Medical instruments and building automation controllers also benefit from its rich peripheral set including USB 2.0, LCD driver, and gigabit Ethernet in a single-chip solution.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the XAM3359AZCZ100 datasheet?
XAM3359AZCZ100 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XAM3359AZCZ100?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
At what clock frequency does XAM3359AZCZ100 operate, and which processor core does it use?
The XAM3359AZCZ100 uses a single ARM Cortex-A8 32-bit core operating at up to 1000 MHz. At this frequency it can execute Linux user-space applications, run real-time RTOS tasks, and process industrial protocol stacks simultaneously, making it substantially more powerful than simpler 200 MHz or 400 MHz MCU-class devices used in less demanding automation designs.
What are the PRU-ICSS units in XAM3359AZCZ100, and why do they matter for industrial EtherCAT or PROFINET designs?
The PRU-ICSS (Programmable Real-Time Unit Industrial Communication Subsystem) consists of 2 independent 200 MHz RISC cores that execute deterministic real-time I/O tasks without interrupting the main Cortex-A8 CPU. For EtherCAT and PROFINET, the PRU handles precise sub-microsecond frame timing and I/O update cycles that a general-purpose OS cannot guarantee, enabling cycle times of 100 µs or better required by industrial motion and control applications.
Which communication and display peripherals are integrated in XAM3359AZCZ100 to simplify HMI system design?
The XAM3359AZCZ100 integrates a gigabit Ethernet MAC, USB 2.0 host and device controllers, an LCD controller supporting displays up to 24-bit color, a 3D graphics accelerator, and multiple industrial serial interfaces including SPI, I2C, and UART. This integration eliminates the need for 3 to 5 external interface chips in a typical HMI design, reducing BOM cost, PCB layer count, and firmware integration effort for display-based industrial control panels.
How does the 324-pin NFBGA package of XAM3359AZCZ100 affect PCB design requirements?
The 324-pin NFBGA package has a 15 mm x 15 mm body with a fine-pitch ball array, typically requiring a 4-layer or 6-layer PCB with controlled impedance routing for DDR3 memory interfaces and high-speed differential pairs. Designers must follow TI's recommended layout guidelines for power delivery to the 1000 MHz core, including multiple 100 nF decoupling capacitors per power domain and matched-length DDR3 traces within 10 mil to ensure signal integrity.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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