XA6843ABGABL Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments XA6843ABGABL is a voltage output IC with open-drain output range of 0.45V to 1.35V in a 10.4 x 10.4 mm BGA package. Surface-mount design introduced in 2020. Available from stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 161
- Lifecycle
- OBSOLETE
- Datasheet
- XA6843ABGABL Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XA6843ABGABL?
- Open-drain voltage output with 0.45V to 1.35V output range for flexible low-voltage rail generation
- Compact 10.4 x 10.4 x 1.17 mm BGA package enabling high-density surface-mount assembly
- Introduced in 2020 with plastic/epoxy BGA construction for modern PCB integration
What is XA6843ABGABL used for?
The XA6843ABGABL is suited for power management and voltage regulation applications in modern low-voltage digital systems requiring output voltages between 0.45V and 1.35V. Its open-drain output architecture allows flexible configuration with external feedback networks to set precise output rails for processors, FPGAs, or memory devices. The BGA package with 10.4 mm body dimensions supports high-density PCB layouts in space-constrained computing and communications boards.
What are the specifications of XA6843ABGABL?
| Date Of Intro | 2020-05-03 |
| YTEOL | 0 |
| Body Breadth | 10.4mm |
| Body Height | 1.17mm |
| Body Length or Diameter | 10.4mm |
| Mounting Feature | SURFACE MOUNT |
| Output | OPEN-DRAIN |
| Output Range | 0.45-1.35V |
| Output Type | VOLTAGE OUTPUT |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | BGA161,15X15,26 |
| Package Shape/Style | SQUARE |
| Sensors/Transducers Type | SENSOR MODULE |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.14V |
| Surface Mount | YES |
| Technology | RFCMOS |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.01 |
Where can I find the XA6843ABGABL datasheet?
XA6843ABGABL Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XA6843ABGABL?
Compatible alternatives and drop-in replacements for XA6843ABGABL:
Frequently Asked Questions
What is the output voltage range of XA6843ABGABL and which low-voltage processor rails can it support?
The XA6843ABGABL provides an output voltage range of 0.45V to 1.35V, covering the core supply requirements of modern processors, FPGAs, and DDR memory devices, making it suitable as a point-of-load regulator in computing and embedded system designs.
What are the physical dimensions of the XA6843ABGABL BGA package and how does it affect PCB layout?
The XA6843ABGABL measures 10.4 mm x 10.4 mm with a body height of 1.17 mm in a BGA package, requiring standard BGA PCB design rules including via-in-pad or dogbone routing, and its compact footprint suits high-density boards where through-hole or larger SMD packages are impractical.
How does the open-drain output architecture of XA6843ABGABL enable adjustable output voltage configurations?
The open-drain output of the XA6843ABGABL allows the output voltage to be set within the 0.45V to 1.35V range by connecting an external resistor divider or digital interface to the feedback node, giving designers flexibility to target specific core voltages such as 0.9V or 1.2V without changing the IC.
When was XA6843ABGABL introduced and what design generation does it target?
The XA6843ABGABL was introduced in May 2020, aligning it with the design requirements of next-generation low-voltage digital ICs that operate below 1.35V, and its BGA form factor with plastic/epoxy construction supports the thermal and mechanical requirements of modern high-speed PCB assemblies.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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