XA1843ABGABL Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments XA1843ABGABL is an automotive-grade integrated circuit in a compact CSP-161 ball-grid-array package, designed for space-constrained high-reliability applications. Available in stock worldwide with competitive pricing and fast shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 161
- Lifecycle
- OBSOLETE
- Datasheet
- XA1843ABGABL Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XA1843ABGABL?
- Automotive-grade qualification ensuring reliable operation across the extended -40°C to +125°C temperature range
- Compact CSP-161 chip-scale BGA package enabling ultra-dense PCB integration for space-constrained automotive modules
- Manufactured for high-reliability automotive electronics with robust ESD protection on all signal pins
What is XA1843ABGABL used for?
The XA1843ABGABL targets automotive body electronics, infotainment modules, and advanced driver-assistance system subsystems where space constraints demand chip-scale packaging. Its CSP-161 footprint enables high-density board designs in ADAS camera modules, radar front-ends, and in-vehicle communication nodes. The automotive-grade qualification makes it suitable for underhood and cabin environments requiring stable operation from -40°C to +125°C.
What are the specifications of XA1843ABGABL?
| Date Of Intro | 2018-12-23 |
| YTEOL | 0 |
| Package | BGA |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Where can I find the XA1843ABGABL datasheet?
XA1843ABGABL Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XA1843ABGABL?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What temperature range does XA1843ABGABL support for automotive underhood applications?
XA1843ABGABL is qualified for automotive applications across the extended temperature range of -40°C to +125°C, meeting the thermal demands of underhood modules, powertrain control units, and ADAS sensor nodes exposed to harsh engine-bay environments.
How does the CSP-161 package of XA1843ABGABL reduce board area compared to leaded alternatives?
The 161-ball CSP package achieves near-die-size footprint with a pitch as small as 0.5 mm, dramatically reducing PCB area versus equivalent LQFP or QFN packages with 161 pins. This enables designers to pack multiple functions into automotive modules with fewer than 10 cm² of board space.
Which automotive design standards govern XA1843ABGABL qualification, and what does that mean for procurement?
Texas Instruments automotive-grade devices like XA1843ABGABL typically comply with AEC-Q100 Grade 1 standards, requiring testing at -40°C to +125°C junction temperature. Procurement from authorized distributors ensures traceability documentation required for IATF 16949 and ISO 26262 functional safety supply chains.
For a compact ADAS camera PCB, what interconnect pitch does the XA1843ABGABL CSP-161 require?
The CSP-161 format uses a ball pitch typically at 0.5 mm to 0.65 mm, which requires HDI (high-density interconnect) PCB manufacturing with laser-drilled microvias. This enables routing of 161 signals within a footprint of approximately 8 mm × 8 mm, critical for compact automotive camera modules.
Related Guides
CSD87313DMS Synchronous Buck Power Stage Design Guide
Design a compact CSD87313DMS synchronous buck stage with practical guidance for loss, gate drive, PCB layout, EMI, thermal validation, and sourcing.
Aug 6, 2026
STEF05SGR eFuse Selection Guide for 5 V Overcurrent Protection
Choose STEF05SGR for 5 V overcurrent protection by checking current-limit margin, inrush, thermal loss, fault response, and sourcing.
Aug 6, 2026
C0402C103K3RACTU Selection Guide: Choosing a 10 nF 0402 MLCC
Select C0402C103K3RACTU by voltage margin, X7R behavior, tolerance, 0402 assembly risk, and qualified alternatives.
Aug 4, 2026
STM32H753VIT6 MCU Selection Guide: Memory, Package, Connectivity, and Security
Choose STM32H753VIT6 by evaluating memory architecture, LQFP-100 pin fit, connectivity, security, power, and sourcing tradeoffs.
Aug 4, 2026
Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Their engineering team helped us find a pin-compatible alternative when our original MCU went EOL.”
You May Also Like
ACS770ECB-200U-PFF-T
Allegro Microsystems
Integrated Circuit
ACS770KCB-150U-PFF-T
Allegro Microsystems
Integrated Circuit
MC33901WEF
NXP
Integrated Circuit
MC7808BDTRKG
ON Semiconductor
Integrated Circuit
PA94EC
Apex Microtechnology
Integrated Circuit
AP7315-28SR-7
Diodes Inc.
Integrated Circuit
74HCT245D
Nexperia
Integrated Circuit
CY62256VNLL-70ZXCT
Cypress Semiconductor
Integrated Circuit
EPM7032AETC44-4N
Intel
Integrated Circuit
EPM3512AQC208-10N
Intel
Integrated Circuit
EPM3256ATC144-7N
Intel
Integrated Circuit
EPM3256AQC208-7N
Intel
Integrated Circuit
EPM3256AQC208-10N
Intel
Integrated Circuit
EPM3128ATC100-7N
Intel
Integrated Circuit
EPM1270F256C4N
Intel
Integrated Circuit
EPF8282ATC100-4N
Intel
Integrated Circuit
EPF6016QC208-2N
Intel
Integrated Circuit
EPF6016ATC144-3N
Intel
Integrated Circuit
EPF10K30ATC144-3N
Intel
Integrated Circuit
EPC2TI32N
Intel
Integrated Circuit
EPC2LC20
Intel
Integrated Circuit
EP3SL150F1152C4N
Intel
Integrated Circuit
EP2SGX60DF780C5N
Intel
Integrated Circuit
EP2SGX60CF780C5N
Intel
Integrated Circuit