XA1243FPBGABL Texas Instruments Integrated Circuit (BGA) In Stock
Texas Instruments XA1243FPBGABL is a high-performance integrated circuit in a 161-ball FCBGA package designed for advanced signal processing and communication applications. Provides dense integration with 161 pins enabling high I/O bandwidth in compact board footprint. Available in stock with worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- BGA
- Pin Count
- 161
- Lifecycle
- OBSOLETE
- Datasheet
- XA1243FPBGABL Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of XA1243FPBGABL?
- 161-ball FCBGA package enabling dense I/O integration with high signal bandwidth in compact PCB footprint
- Advanced process node integration supporting high-speed digital signal processing at elevated clock frequencies
- Lead-free (Pb-free) FCBGA-161 packaging compliant with RoHS environmental directives for global market qualification
What is XA1243FPBGABL used for?
The XA1243FPBGABL suits high-speed communication and signal processing board designs that require many I/O signals in a small area using BGA packaging. Its 161-ball FCBGA footprint enables system designers to achieve higher interconnect density than equivalent LQFP or QFP packages of comparable pin count. It is applicable in telecom line cards, industrial machine vision systems, and test-and-measurement hardware requiring dense digital integration.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Where can I find the XA1243FPBGABL datasheet?
XA1243FPBGABL Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for XA1243FPBGABL?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many I/O balls does the XA1243FPBGABL package have and what assembly technology does it require?
The XA1243FPBGABL uses an FCBGA-161 package with 161 solder balls, requiring surface-mount BGA assembly with controlled reflow soldering. BGA packages demand precise paste printing and X-ray inspection to verify solder joint quality under the package body, making it suited for professional PCB manufacturing processes.
For high-speed PCB routing, what are the key layout considerations for the XA1243FPBGABL FCBGA-161?
When routing the 161-ball FCBGA package of XA1243FPBGABL, designers should use controlled impedance traces (typically 50 ohm single-ended or 100 ohm differential), employ via-in-pad or micro-via fanout for inner ball rows, and maintain matched trace lengths within differential pairs to under 5 mils length mismatch for high-speed signals.
Is the XA1243FPBGABL RoHS compliant and suitable for designs targeting European and Asian markets?
Yes, the XA1243FPBGABL uses lead-free (Pb-free) ball metallurgy and is RoHS compliant, meeting the EU Restriction of Hazardous Substances directive. This makes it suitable for products sold in European, Japanese, and Chinese markets where Pb-free construction is mandatory for commercial electronics.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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