WL1831MODGBMOCR Texas Instruments Integrated Circuit (Other) In Stock
The WL1831MODGBMOCR is a dual-band Wi-Fi and Bluetooth combo module from Texas Instruments in a compact 100-ball LGA package, integrating IEEE 802.11 a/b/g/n and Bluetooth 4.0 wireless connectivity. It supports data rates up to 150 Mbps and operates across the -40 °C to 85 °C industrial temperature range. Available in stock worldwide with competitive pricing for IoT and embedded wireless designs.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- WL1831MODGBMOCR Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $15.3699(MOQ 100)
- Temp Range
- -20.0°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-band 802.11 a/b/g/n Wi-Fi plus Bluetooth 4.0 combo in a single 100-ball LGA module reducing BOM and RF certification effort
- Industrial-grade operating temperature range of -40 °C to 85 °C with peak reflow tolerance of 260 °C for reliable embedded wireless deployment
- Compact LGA100 package footprint enabling integration into space-constrained IoT gateway and industrial wireless sensor designs
Applications
The WL1831MODGBMOCR is designed for IoT gateways, industrial wireless sensor nodes, and embedded computing platforms that require certified dual-band Wi-Fi and Bluetooth connectivity in a single compact module. Its 802.11 a/b/g/n support and Bluetooth 4.0 enable simultaneous wireless LAN and low-energy peripheral connections, making it well-suited for smart home hubs, medical telemetry devices, and rugged handheld terminals. The pre-certified module format reduces regulatory approval time and RF design complexity for system integrators targeting FCC, CE, and IC market entry.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Data Rate | 100000Mbps |
| JESD-30 Code | R-PBGA-B100 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LGA100(UNSPEC) |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Nom | 3.7V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Form | BUTT |
| Terminal Pitch | 0.7mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.75 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for WL1831MODGBMOCR:
Frequently Asked Questions
What wireless standards and data rates does the WL1831MODGBMOCR support?
The WL1831MODGBMOCR supports IEEE 802.11 a/b/g/n dual-band Wi-Fi across the 2.4 GHz and 5 GHz bands, plus Bluetooth 4.0 with low-energy (BLE) support. Maximum Wi-Fi throughput reaches up to 150 Mbps in 802.11n single-stream mode, while BLE operates at 1 Mbps for low-power peripheral communication in IoT sensor applications.
How does the 100-ball LGA package of WL1831MODGBMOCR affect PCB integration in compact embedded systems?
The LGA100 package uses a land grid array with 100 solder pads and no protruding leads, allowing a smaller PCB footprint than equivalent QFN or module-on-board solutions. The package body is rectangular and designed for standard SMD reflow at up to 260 °C peak temperature, enabling integration into multilayer PCBs as thin as 1.0 mm, which is ideal for ultra-slim IoT gateway and wearable device designs.
Which industrial applications benefit most from WL1831MODGBMOCR operating across -40 °C to 85 °C?
Industrial wireless sensor networks deployed in factory floors, outdoor utility meters, and cold-chain logistics equipment experience ambient temperatures well outside the 0 °C to 70 °C commercial range. The WL1831MODGBMOCR is rated for -40 °C to 85 °C operation, ensuring stable Wi-Fi and Bluetooth 4.0 connectivity in these environments without additional thermal management, reducing system cost for rugged wireless node deployments.
When is WL1831MODGBMOCR preferable to a discrete Wi-Fi chip plus separate Bluetooth IC in a new IoT design?
A pre-certified combo module like the WL1831MODGBMOCR is preferred when the design team lacks RF expertise or when time-to-market is under 6 months. Combining 802.11 a/b/g/n and Bluetooth 4.0 in a single pre-tested module eliminates the need for a separate RF layout review, antenna matching network, and duplicate regulatory certifications, potentially saving 8 to 12 weeks of compliance testing and reducing the component count by at least 20 parts compared to a discrete two-chip solution.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $17.4770 | $1747.70 |
| 250+ | $16.6466 | $4161.64 |
| 500+ | $16.4322 | $8216.10 |
| 1200+ | $15.3699 | $18443.89 |
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