WL1831MODGBMOCR Texas Instruments Integrated Circuit (Other) In Stock

The WL1831MODGBMOCR is a dual-band Wi-Fi and Bluetooth combo module from Texas Instruments in a compact 100-ball LGA package, integrating IEEE 802.11 a/b/g/n and Bluetooth 4.0 wireless connectivity. It supports data rates up to 150 Mbps and operates across the -40 °C to 85 °C industrial temperature range. Available in stock worldwide with competitive pricing for IoT and embedded wireless designs.

ACTIVEIntegrated CircuitVerified Jun 2026
Package / Visual Reference
WL1831MODGBMOCROther
Quick Facts
Manufacturer
Texas Instruments
Package
Other
Pin Count
100
Lifecycle
ACTIVE
Category
Integrated Circuit
Price
From $15.3699(MOQ 100)
Temp Range
-20.0°C to 70.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Dual-band 802.11 a/b/g/n Wi-Fi plus Bluetooth 4.0 combo in a single 100-ball LGA module reducing BOM and RF certification effort
  • Industrial-grade operating temperature range of -40 °C to 85 °C with peak reflow tolerance of 260 °C for reliable embedded wireless deployment
  • Compact LGA100 package footprint enabling integration into space-constrained IoT gateway and industrial wireless sensor designs

Applications

The WL1831MODGBMOCR is designed for IoT gateways, industrial wireless sensor nodes, and embedded computing platforms that require certified dual-band Wi-Fi and Bluetooth connectivity in a single compact module. Its 802.11 a/b/g/n support and Bluetooth 4.0 enable simultaneous wireless LAN and low-energy peripheral connections, making it well-suited for smart home hubs, medical telemetry devices, and rugged handheld terminals. The pre-certified module format reduces regulatory approval time and RF design complexity for system integrators targeting FCC, CE, and IC market entry.

Specifications

Pbfree CodeYes
YTEOL15
Data Rate100000Mbps
JESD-30 CodeR-PBGA-B100
Number of Functions1
Package Body MaterialPLASTIC/EPOXY
Package Equivalence CodeLGA100(UNSPEC)
Package ShapeRECTANGULAR
Package StyleGRID ARRAY
Peak Reflow Temperature (Cel)260
Qualification StatusNot Qualified
Supply Voltage-Nom3.7V
Surface MountYES
Telecom IC TypeTELECOM CIRCUIT
Temperature GradeCOMMERCIAL
Terminal FormBUTT
Terminal Pitch0.7mm
Terminal PositionBOTTOM
Time@Peak Reflow Temperature-Max (s)30
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
Moisture Sensitivity LevelMSL 3
ECCN5A992.C
HTS Code8542.31.00.75

Datasheet

WL1831MODGBMOCR Datasheet Download

Official datasheet from Texas Instruments

Alternate & Equivalent Parts

Compatible alternatives and drop-in replacements for WL1831MODGBMOCR:

WL1831MODGBMOCTTexas Instruments

Telecom Circuit, 1-Func, PBGA100

View Part →

Frequently Asked Questions

What wireless standards and data rates does the WL1831MODGBMOCR support?

The WL1831MODGBMOCR supports IEEE 802.11 a/b/g/n dual-band Wi-Fi across the 2.4 GHz and 5 GHz bands, plus Bluetooth 4.0 with low-energy (BLE) support. Maximum Wi-Fi throughput reaches up to 150 Mbps in 802.11n single-stream mode, while BLE operates at 1 Mbps for low-power peripheral communication in IoT sensor applications.

How does the 100-ball LGA package of WL1831MODGBMOCR affect PCB integration in compact embedded systems?

The LGA100 package uses a land grid array with 100 solder pads and no protruding leads, allowing a smaller PCB footprint than equivalent QFN or module-on-board solutions. The package body is rectangular and designed for standard SMD reflow at up to 260 °C peak temperature, enabling integration into multilayer PCBs as thin as 1.0 mm, which is ideal for ultra-slim IoT gateway and wearable device designs.

Which industrial applications benefit most from WL1831MODGBMOCR operating across -40 °C to 85 °C?

Industrial wireless sensor networks deployed in factory floors, outdoor utility meters, and cold-chain logistics equipment experience ambient temperatures well outside the 0 °C to 70 °C commercial range. The WL1831MODGBMOCR is rated for -40 °C to 85 °C operation, ensuring stable Wi-Fi and Bluetooth 4.0 connectivity in these environments without additional thermal management, reducing system cost for rugged wireless node deployments.

When is WL1831MODGBMOCR preferable to a discrete Wi-Fi chip plus separate Bluetooth IC in a new IoT design?

A pre-certified combo module like the WL1831MODGBMOCR is preferred when the design team lacks RF expertise or when time-to-market is under 6 months. Combining 802.11 a/b/g/n and Bluetooth 4.0 in a single pre-tested module eliminates the need for a separate RF layout review, antenna matching network, and duplicate regulatory certifications, potentially saving 8 to 12 weeks of compliance testing and reducing the component count by at least 20 parts compared to a discrete two-chip solution.

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About Texas Instruments

Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.

AvailabilityIn Stock
Reference Price (USD)
From $15.3699
Buy from 1pc · Factory-direct pricing
Qty.Unit PriceExt. Price
100+$17.4770$1747.70
250+$16.6466$4161.64
500+$16.4322$8216.10
1200+$15.3699$18443.89
pcs
Unit price: $17.4770 · Total: $1747.70

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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