WL1831MODGBMOCR Texas Instruments Integrated Circuit (Other) In Stock
The WL1831MODGBMOCR is a dual-band Wi-Fi and Bluetooth combo module from Texas Instruments in a compact 100-ball LGA package, integrating IEEE 802.11 a/b/g/n and Bluetooth 4.0 wireless connectivity. It supports data rates up to 150 Mbps and operates across the -40 °C to 85 °C industrial temperature range. Available in stock worldwide with competitive pricing for IoT and embedded wireless designs.
- Manufacturer
- Texas Instruments
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- WL1831MODGBMOCR Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $15.3699(MOQ 100)
- Temp Range
- -20.0°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of WL1831MODGBMOCR?
- Dual-band 802.11 a/b/g/n Wi-Fi plus Bluetooth 4.0 combo in a single 100-ball LGA module reducing BOM and RF certification effort
- Industrial-grade operating temperature range of -40 °C to 85 °C with peak reflow tolerance of 260 °C for reliable embedded wireless deployment
- Compact LGA100 package footprint enabling integration into space-constrained IoT gateway and industrial wireless sensor designs
What is WL1831MODGBMOCR used for?
The WL1831MODGBMOCR is designed for IoT gateways, industrial wireless sensor nodes, and embedded computing platforms that require certified dual-band Wi-Fi and Bluetooth connectivity in a single compact module. Its 802.11 a/b/g/n support and Bluetooth 4.0 enable simultaneous wireless LAN and low-energy peripheral connections, making it well-suited for smart home hubs, medical telemetry devices, and rugged handheld terminals. The pre-certified module format reduces regulatory approval time and RF design complexity for system integrators targeting FCC, CE, and IC market entry.
What are the specifications of WL1831MODGBMOCR?
| Pbfree Code | Yes |
| YTEOL | 15 |
| Data Rate | 100000Mbps |
| JESD-30 Code | R-PBGA-B100 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LGA100(UNSPEC) |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Nom | 3.7V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Form | BUTT |
| Terminal Pitch | 0.7mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.75 |
Where can I find the WL1831MODGBMOCR datasheet?
WL1831MODGBMOCR Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for WL1831MODGBMOCR?
Compatible alternatives and drop-in replacements for WL1831MODGBMOCR:
Frequently Asked Questions
What wireless standards and data rates does the WL1831MODGBMOCR support?
The WL1831MODGBMOCR supports IEEE 802.11 a/b/g/n dual-band Wi-Fi across the 2.4 GHz and 5 GHz bands, plus Bluetooth 4.0 with low-energy (BLE) support. Maximum Wi-Fi throughput reaches up to 150 Mbps in 802.11n single-stream mode, while BLE operates at 1 Mbps for low-power peripheral communication in IoT sensor applications.
How does the 100-ball LGA package of WL1831MODGBMOCR affect PCB integration in compact embedded systems?
The LGA100 package uses a land grid array with 100 solder pads and no protruding leads, allowing a smaller PCB footprint than equivalent QFN or module-on-board solutions. The package body is rectangular and designed for standard SMD reflow at up to 260 °C peak temperature, enabling integration into multilayer PCBs as thin as 1.0 mm, which is ideal for ultra-slim IoT gateway and wearable device designs.
Which industrial applications benefit most from WL1831MODGBMOCR operating across -40 °C to 85 °C?
Industrial wireless sensor networks deployed in factory floors, outdoor utility meters, and cold-chain logistics equipment experience ambient temperatures well outside the 0 °C to 70 °C commercial range. The WL1831MODGBMOCR is rated for -40 °C to 85 °C operation, ensuring stable Wi-Fi and Bluetooth 4.0 connectivity in these environments without additional thermal management, reducing system cost for rugged wireless node deployments.
When is WL1831MODGBMOCR preferable to a discrete Wi-Fi chip plus separate Bluetooth IC in a new IoT design?
A pre-certified combo module like the WL1831MODGBMOCR is preferred when the design team lacks RF expertise or when time-to-market is under 6 months. Combining 802.11 a/b/g/n and Bluetooth 4.0 in a single pre-tested module eliminates the need for a separate RF layout review, antenna matching network, and duplicate regulatory certifications, potentially saving 8 to 12 weeks of compliance testing and reducing the component count by at least 20 parts compared to a discrete two-chip solution.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
More from Texas Instruments
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $17.4770 | $1747.70 |
| 250+ | $16.6466 | $4161.64 |
| 500+ | $16.4322 | $8216.10 |
| 1200+ | $15.3699 | $18443.89 |
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