WL1805MODGBMOCT Texas Instruments Integrated Circuit (LGA) In Stock
Texas Instruments WL1805MODGBMOCT is a certified Bluetooth RF module in a 100-ball LGA package designed for IoT and wireless connectivity applications. It integrates a complete Bluetooth radio with antenna in a compact SMD form factor supporting multi-Mbps data rates. Available from stock worldwide with competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- —
- Pin Count
- 999
- Lifecycle
- ACTIVE
- Datasheet
- WL1805MODGBMOCT Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $18.8011(MOQ 10)
- Temp Range
- -20.0°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Fully certified Bluetooth RF module with integrated antenna reduces RF design complexity and accelerates regulatory certification
- 100-ball LGA (10×10 grid) SMD package enables automated assembly and compact PCB footprint for space-constrained IoT products
- Integrated RF front-end with single-chip Bluetooth stack simplifies firmware development and reduces external component count
Applications
The WL1805MODGBMOCT is targeted at IoT edge devices, smart home accessories, and wearable electronics that require pre-certified Bluetooth connectivity without in-house RF expertise. Its SMD LGA100 form factor is compatible with standard pick-and-place assembly processes, enabling high-volume manufacturing of connected sensors, remote controls, and medical monitoring devices. The integrated antenna and certified RF module approach cuts weeks from the development cycle by bypassing individual component RF compliance testing.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Data Rate | 100000Mbps |
| JESD-30 Code | R-PBGA-B100 |
| JESD-609 Code | e4 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LGA100(UNSPEC) |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Voltage-Nom | 3.7V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | COMMERCIAL |
| Terminal Form | BUTT |
| Terminal Pitch | 0.7mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | 30 |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | 5A992.C |
| HTS Code | 8542.31.00.75 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the pre-certification of WL1805MODGBMOCT mean for a product development team's regulatory timeline?
The WL1805MODGBMOCT ships with Bluetooth RF certifications already obtained, meaning the host product developer typically only needs to submit for a reduced-scope certification (for example an FCC Part 15 modular grant) rather than a full device-level RF test. This can cut regulatory approval time by 4–8 weeks and reduce testing costs by thousands of dollars compared to using a discrete chipset that requires full system-level certification.
How does the 100-ball LGA package of WL1805MODGBMOCT affect PCB design and assembly requirements?
The WL1805MODGBMOCT uses an LGA100 package with a rectangular 10×10 ball grid on a standard pitch, compatible with conventional SMT reflow assembly. PCB land patterns must follow TI's recommended pad dimensions to ensure reliable solder joint formation across all 100 pads. X-ray inspection is recommended post-reflow to verify 100% ball coverage, which is standard practice for area-array packages with pad counts above 64 pins.
For a battery-powered wearable tracking device, what Bluetooth range and current consumption should designers expect from WL1805MODGBMOCT?
The WL1805MODGBMOCT is a Bluetooth module designed for typical indoor ranges of 10–30 meters depending on antenna orientation and environmental obstructions. Bluetooth Low Energy (BLE) connection intervals can be configured from 7.5 ms to 4 seconds, allowing the module to reduce its average active current to below 1 mA during low-duty-cycle operation, which is compatible with coin-cell and small Li-Po battery power budgets for wearable devices.
How does the WL1805MODGBMOCT compare to a discrete CC2640 chipset approach for a 50,000-unit IoT sensor production run?
Using the WL1805MODGBMOCT module avoids the RF layout design, antenna matching, and balun component selection required for a discrete CC2640 chipset. For a 50,000-unit production run, the module approach saves approximately 3–5 engineering weeks of RF bring-up time and eliminates 4–8 external passive components (balun, decoupling capacitors, matching network). While the module unit cost is higher than a bare chipset, total BOM and NRE savings often favor the module for volumes below 100,000 units.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 10+ | $23.2280 | $232.28 |
| 25+ | $22.0536 | $551.34 |
| 100+ | $20.4434 | $2044.34 |
| 250+ | $19.0100 | $4752.50 |
| 500+ | $18.8011 | $9400.53 |
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