W25Q32FWSSIG Winbond Integrated Circuit (Small Outline Packages) In Stock
W25Q32FWSSIG from Winbond is a integrated circuit for production electronic assemblies, replacement sourcing, and design-in evaluation. Key known parameters include 104 MHz, -40°C to 85°C. It is supplied in Small Outline Packages packaging with 8 pins, supporting BOM review, PCB footprint checks, and purchasing qualification for industrial, embedded, and maintenance applications.
- Manufacturer
- Winbond
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- W25Q32FWSSIG Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of W25Q32FWSSIG?
- Integrated Circuit supplied by Winbond
- 8 pins for footprint and assembly planning
- Small Outline Packages package information for PCB layout review
- -40°C to 85°C operating temperature reference
- 104 MHz key rating from the supplied part data
- 33554432 bit key rating from the supplied part data
- 8 pins key rating from the supplied part data
- Suitable for RFQ-based sourcing, replacement checks, and production BOM qualification
What is W25Q32FWSSIG used for?
W25Q32FWSSIG is used in embedded control, industrial electronics, power management, signal conditioning, and maintenance replacement designs that require manufacturer-qualified component data. It supports BOM sourcing, lifecycle review, footprint validation, and alternate-part qualification before procurement.
What are the specifications of W25Q32FWSSIG?
| YTEOL | 0 |
| Clock Frequency-Max (fCLK) | 104MHz |
| Data Retention Time-Min | 20 |
| Endurance | 100000 Write/Erase Cycles |
| JESD-30 Code | S-PDSO-G8 |
| JESD-609 Code | e3 |
| Memory Density | 33554432bit |
| Memory IC Type | FLASH |
| Memory Width | 8 |
| Number of Functions | 1 |
| Number of Words | 4194304words |
| Number of Words Code | 4000000 |
| Operating Mode | SYNCHRONOUS |
| Organization | 4MX8 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.3 |
| Package Shape | SQUARE |
| Package Style | SMALL OUTLINE |
| Parallel/Serial | SERIAL |
| Programming Voltage | 1.8V |
| Qualification Status | Not Qualified |
| Serial Bus Type | QSPI |
| Standby Current-Max | 0.00002A |
| Supply Current-Max | 0.02mA |
| Supply Voltage-Max (Vsup) | 1.95V |
| Supply Voltage-Min (Vsup) | 1.65V |
| Supply Voltage-Nom (Vsup) | 1.8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | TIN |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Type | NOR TYPE |
| Write Protection | HARDWARE/SOFTWARE |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.32.00.51 |
Where can I find the W25Q32FWSSIG datasheet?
W25Q32FWSSIG Datasheet DownloadOfficial datasheet from Winbond
What are equivalent replacements for W25Q32FWSSIG?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Which designs are a good fit for W25Q32FWSSIG when 104 MHz is required?
W25Q32FWSSIG is a practical integrated circuit choice when the design requirements match 104 MHz. Engineers should compare the manufacturer data, Small Outline Packages package, and operating conditions against the schematic before approving it for a production BOM.
How should procurement teams qualify W25Q32FWSSIG before placing an RFQ?
Procurement should verify the Winbond ordering code, lifecycle status, RoHS or lead-free evidence, and traceable date-code availability. The known 104 MHz requirement helps screen alternates before requesting pricing for production quantities.
What footprint details matter most when replacing W25Q32FWSSIG on an existing board?
Check the Small Outline Packages package, land pattern, height constraints, and 8 pins against the original PCB files. Even when electrical ratings match, a mismatch in pins or package style can block assembly release.
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Why Buy from FindMyChip
About Winbond
Winbond is a leading electronic component manufacturer. FindMyChip sources Winbond ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
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