VSC8522XJQ-02 Microchip Integrated Circuit (Other) In Stock
VSC8522XJQ-02 is a 12-port Gigabit Ethernet PHY with integrated QSGMII MAC interface, operating at a 1V core supply in a 302-pin FSTQFP package. It provides 12 independent 1000BASE-T ports for high-density switch and router line cards. Available from stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Other
- Pin Count
- 302
- Lifecycle
- OBSOLETE
- Datasheet
- VSC8522XJQ-02 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $17.3800(MOQ 1)
- Temp Range
- ?°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-port Gigabit Ethernet PHY consolidates 12 copper 1000BASE-T interfaces in a single 302-pin device, maximizing port density on switch line cards
- QSGMII MAC interface aggregates 4 GbE channels per quad-serial lane, reducing MAC-to-PHY routing congestion on high-density PCBs
- 1V core supply voltage minimizes power consumption per port for energy-efficient switch and router applications
- Integrated auto-negotiation and cable diagnostics on all 12 ports reduce system firmware complexity and field troubleshooting overhead
Applications
VSC8522XJQ-02 targets enterprise Ethernet switches, carrier access routers, and industrial managed switch platforms requiring 12 Gigabit copper PHY ports in a single IC. The QSGMII interface reduces the number of high-speed SerDes lanes between PHY and MAC, simplifying layer-2 switch ASIC board routing in dense 1U and 2U line cards. It is also suitable for data center top-of-rack switches and telecom access equipment where port count per watt and per square millimeter are critical design parameters.
Specifications
| Manufacturer Package Code | FSTQFP-302 |
| YTEOL | 0 |
| JESD-30 Code | S-PQFP-G302 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
| Supply Voltage-Nom | 1V |
| Surface Mount | YES |
| Telecom IC Type | ETHERNET TRANSCEIVER |
| Temperature Grade | OTHER |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | 5A991.C |
| HTS Code | 8542.39.00.01 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the QSGMII interface on VSC8522XJQ-02 reduce PCB routing complexity compared to individual SGMII per port?
QSGMII multiplexes 4 Gigabit Ethernet ports over a single 5 Gbit/s SerDes lane, so VSC8522XJQ-02's 12 PHY ports require only 3 QSGMII lanes to the MAC versus 12 individual SGMII lanes at 1.25 Gbit/s each. This 4× reduction in high-speed differential pairs shortens PCB trace length budgets, eliminates length-matching for 9 signal pairs, and lowers layer count requirements for the MAC-to-PHY signal routing.
What core supply voltage does VSC8522XJQ-02 require, and how does it affect power dissipation in a 24-port switch card?
VSC8522XJQ-02 operates from a 1V nominal core supply voltage. At typical Gigabit PHY power budgets of around 0.5W to 0.8W per active port, a pair of VSC8522XJQ-02 devices covering all 24 ports would dissipate roughly 12W to 19W total, compared to older 1.2V or 1.5V PHY devices that could draw 30% to 50% more for the same port count at higher supply rails.
Which enterprise or carrier applications benefit most from VSC8522XJQ-02's 12-port density?
Carrier Ethernet access aggregation nodes, enterprise core switches, and industrial managed ring switches benefit from VSC8522XJQ-02 because 12 ports per device allows a 48-port switch to use only 4 PHY ICs instead of 12 single-port or 24 dual-port alternatives. This reduces BOM cost, board area, and power supply rail count while the 1000BASE-T auto-negotiation on all 12 ports ensures seamless interoperability with existing Cat5e and Cat6 cabling infrastructure.
What are the main challenges of PCB layout for the 302-pin FSTQFP package of VSC8522XJQ-02, and how should designers plan for them?
The 302-pin FSTQFP package has a fine 0.5 mm pin pitch, requiring at least 8 PCB layers to route differential pairs and power planes beneath the device. Designers should allocate a 25 mm × 25 mm keepout zone for the exposed thermal slug, plan a grid of 64 thermal vias under the heat-sink slug to achieve a junction-to-board thermal resistance below 5°C/W, and apply controlled-impedance routing for the QSGMII 100 Ω differential traces to avoid signal reflections on the 5 Gbit/s lanes.
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| Qty. | Unit Price | Ext. Price |
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