USB7206T-I/KDX Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
USB7206T-I/KDX is a USB 3.1 Gen 2 6-port hub controller IC from Microchip Technology supporting data transfer rates up to 1,250 MBps. It features I2C, SPI, SMBus, and I2S interfaces alongside a 100-pin QFN package for compact system integration. Designed for docking stations, industrial hubs, embedded computing modules, and USB expansion peripherals.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 101
- Lifecycle
- OBSOLETE
- Datasheet
- USB7206T-I/KDX Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- USB 3.1 Gen 2 operation at up to 1,250 MBps for high-speed multi-port hub designs
- Multi-protocol interface support including I2C, SPI, SMBus, and I2S for flexible system integration
- Compact 100-pin QFN (LCC100) package with heat-sink slug for efficient thermal management
- Internal 25 MHz clock reference reduces external oscillator BOM requirements
- Introduced in 2019 with broad bus compatibility for industrial and consumer docking station applications
Applications
The USB7206T-I/KDX is tailored for USB 3.1 Gen 2 docking stations, laptop expansion hubs, and industrial multi-port USB controllers requiring high-speed 1,250 MBps throughput across 6 downstream ports. Its I2C and SPI interfaces allow firmware configuration and monitoring, making it suitable for embedded computing platforms, single-board computers, and smart peripherals. The compact 100-pin QFN package with heat-sink slug is well matched to thermally demanding designs such as NVMe storage enclosures and video capture hubs.
Specifications
| Date Of Intro | 2019-11-01 |
| YTEOL | 0 |
| Bus Compatibility | I2C; I2S; SMBUS; SPI; USB |
| Clock Frequency-Max | 25MHz |
| Data Transfer Rate-Max | 1250MBps |
| JESD-30 Code | S-PQCC-N100 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC100,.47SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Max | 1.21V |
| Supply Voltage-Min | 1.09V |
| Supply Voltage-Nom | 1.15V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for USB7206T-I/KDX:
Frequently Asked Questions
What maximum data transfer rate does the USB7206T-I/KDX support for downstream devices?
The USB7206T-I/KDX supports USB 3.1 Gen 2 with a maximum data transfer rate of 1,250 MBps (10 Gbps), enabling high-speed file transfers and low-latency streaming from connected NVMe drives, cameras, and audio interfaces in docking station and hub designs.
Which serial interfaces are available on the USB7206T-I/KDX for hub configuration and management?
The IC exposes I2C, SPI, SMBus, and I2S interfaces in addition to USB, allowing host systems to configure hub parameters, read status registers, and integrate audio streaming paths over the same 100-pin QFN footprint without additional bridge chips.
How does the 100-pin QFN package of the USB7206T-I/KDX benefit thermal management in high-speed USB hubs?
The S-PQCC-N100 QFN package includes an exposed thermal slug on the bottom, which improves heat dissipation to the PCB ground plane. This is critical for USB 3.1 Gen 2 operation at 1,250 MBps where power dissipation can exceed that of USB 2.0 hubs by several hundred milliwatts.
For an industrial embedded computing board needing 6 USB 3.1 Gen 2 ports, how does USB7206T-I/KDX compare to discrete hub chip combinations?
The USB7206T-I/KDX integrates 6-port USB 3.1 Gen 2 hub functionality with a 25 MHz internal clock and I2C/SPI management interfaces into a single 100-pin QFN package, reducing BOM complexity and board area compared to cascading multiple USB 3.0 or USB 3.1 Gen 1 hub controllers with external oscillators.
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