USB5926-I/KD Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
The USB5926-I/KD is a high-performance 7-port USB 3.1 Gen 1 hub controller IC supporting data transfer rates up to 625 MBps, with I2C, SPI, SMBUS, and UART configuration interfaces, housed in a 100-pin VQFN package. It provides enterprise-grade hub functionality for docking stations, industrial automation, and embedded multi-port USB designs.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 101
- Lifecycle
- OBSOLETE
- Datasheet
- USB5926-I/KD Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of USB5926-I/KD?
- 7-port USB 3.1 Gen 1 hub controller with up to 625 MBps total data throughput
- Multiple host configuration interfaces: I2C, SPI, SMBUS, and UART
- Maximum clock frequency of 25 MHz for internal control logic
- 100-pin VQFN package (0.47 mm pitch) for compact, high-density PCB placement
- RoHS-compliant lead-free construction (JESD-609 Code e3)
- Suitable for industrial-grade designs with programmable port configuration
- Supports simultaneous USB 3.1 SuperSpeed and USB 2.0 Hi-Speed on each downstream port
What is USB5926-I/KD used for?
USB5926-I/KD is designed for use in USB docking stations, industrial PCs, embedded computing platforms, and medical instrumentation systems requiring multiple USB 3.1 ports from a single host connection. The programmable I2C/SPI/UART interface allows OEMs to customize port configurations and power management for specific deployment environments. It is also employed in test and measurement equipment and ruggedized computing modules where high-bandwidth USB hub integration is critical.
What are the specifications of USB5926-I/KD?
| Date Of Intro | 2016-10-03 |
| YTEOL | 0 |
| Bus Compatibility | I2C; SMBUS; SPI; UART; USB |
| Clock Frequency-Max | 25MHz |
| Data Transfer Rate-Max | 625MBps |
| JESD-30 Code | S-PQCC-N100 |
| JESD-609 Code | e3 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC100,.47SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Screening Level | TS 16949 |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.08V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Where can I find the USB5926-I/KD datasheet?
USB5926-I/KD Datasheet DownloadOfficial datasheet from Microchip
What are equivalent replacements for USB5926-I/KD?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many USB ports does USB5926-I/KD support, and what is the maximum data transfer rate per port?
USB5926-I/KD is a 7-port USB 3.1 Gen 1 hub controller supporting SuperSpeed data transfer rates up to 5 Gbps per port, with a total system throughput of up to 625 MBps. This makes it suitable for high-bandwidth peripherals such as SSDs, cameras, and multi-gigabit USB network adapters in docking station designs.
How can the USB5926-I/KD be configured after assembly, and which interfaces are supported for runtime control?
USB5926-I/KD supports post-assembly configuration via I2C, SPI, SMBUS, and UART interfaces running at up to 25 MHz. This allows embedded firmware to customize port enabling, power management, and device descriptors without requiring a hardware redesign, which is valuable for industrial platforms serving multiple product variants.
What package does USB5926-I/KD use, and what PCB design considerations apply for the 100-pin VQFN?
USB5926-I/KD is supplied in a 100-pin VQFN (PQCC-N100) package with a 0.47 mm body and square profile, requiring fine-pitch SMT assembly. Designers should plan a thermal pad under the IC for heat dissipation and use a via array in the exposed pad area to manage thermal resistance on high-density PCBs.
What is the lifecycle status of USB5926-I/KD, and are there supply risks for long-term industrial projects?
USB5926-I/KD was introduced in October 2016 and currently shows a YTEOL of 0, which indicates it may be approaching end-of-life or transitioning to a newer revision. Procurement and engineering teams designing long-term industrial or embedded systems should confirm the current lifecycle status with Microchip and evaluate migration to a successor part if necessary.
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