USB5807-I/KD Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
USB5807-I/KD is a 7-port USB 3.1 Gen 1 SuperSpeed hub controller from Microchip, supporting data transfer rates up to 5 Gbps with I2C/SPI configuration. Available in a compact VQFN-100 package with up to 625 MBps throughput. From $2.50 in stock worldwide shipping.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 101
- Lifecycle
- OBSOLETE
- Datasheet
- USB5807-I/KD Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 7-port USB 3.1 Gen 1 SuperSpeed hub controller supporting up to 5 Gbps per port data transfer
- Flexible host interface configuration via I2C, SMBus, or SPI at up to 25 MHz clock frequency
- Compact VQFN-100 package (100-pin, 0.47 inch square) enabling space-efficient PCB integration
- Integrated USB battery charging support with per-port power management for embedded applications
Applications
USB5807-I/KD is well suited for industrial embedded systems, USB docking stations, and multi-device USB expansion designs requiring reliable 7-port SuperSpeed connectivity. Its configurable I2C/SPI interface makes it ideal for custom firmware initialization in smart hubs, single-board computers, and medical diagnostic equipment. The compact VQFN-100 package allows deployment in space-constrained consumer electronics and portable test instruments.
Specifications
| Date Of Intro | 2016-10-03 |
| YTEOL | 0 |
| Bus Compatibility | I2C; SMBUS; SPI |
| Clock Frequency-Max | 25MHz |
| Data Transfer Rate-Max | 625MBps |
| JESD-30 Code | S-XQCC-N100 |
| JESD-609 Code | e3 |
| Package Body Material | UNSPECIFIED |
| Package Equivalence Code | LCC100,.47SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Screening Level | TS 16949 |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.08V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Matte Tin (Sn) - annealed |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for USB5807-I/KD:
Frequently Asked Questions
What is the maximum data transfer rate supported by USB5807-I/KD across all 7 downstream ports?
USB5807-I/KD supports USB 3.1 Gen 1 SuperSpeed operation with a maximum aggregate data transfer rate of 625 MBps, with each port capable of reaching 5 Gbps. This high bandwidth is shared across all 7 downstream USB ports, making it suitable for simultaneous multi-device data streaming in embedded and industrial designs.
Which configuration interfaces does USB5807-I/KD support, and what clock frequency do they operate at?
USB5807-I/KD supports I2C, SMBus, and SPI host configuration interfaces, all operating at a maximum clock frequency of 25 MHz. This flexibility allows system designers to choose the most convenient interface on their host microcontroller, simplifying firmware development for custom initialization and runtime control of all 7 USB ports.
How does the VQFN-100 package footprint of USB5807-I/KD benefit compact PCB designs compared to older QFP hub ICs?
The VQFN-100 package measures 0.47-inch square with 100 pins in a leadless configuration, offering significantly smaller board area than equivalent 100-pin QFP packages which require lead clearance around all 4 sides. This compact footprint enables tight-pitch PCB layouts in portable docking stations, USB expansion modules, and embedded computing boards with limited board space.
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