USB5744T/2GX01 Microchip Integrated Circuit (Quad Flat No-Lead) In Stock
The USB5744T/2GX01 is a Microchip 4-port SuperSpeed USB 3.1 Gen 1 hub controller in a VQFN-56 package, supporting data transfer rates up to 625 MBps with I2C/SPI configuration and a 25 MHz reference clock input. Enables multi-port USB expansion for embedded and industrial host designs. Available from stock with worldwide shipping.
- Manufacturer
- Microchip
- Package
- Quad Flat No-Lead
- Pin Count
- 56
- Lifecycle
- OBSOLETE
- Datasheet
- USB5744T/2GX01 Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $5.2700(MOQ 3000)
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 4-port USB 3.1 Gen 1 hub with up to 625 MBps per-port throughput allows simultaneous high-bandwidth connections to multiple peripherals from a single host downstream port
- I2C, SMBus, and SPI configuration interfaces enable OEM customisation of device descriptors, power management, and port control without external EEPROM in many configurations
- Compact VQFN-56 package with 0.4 mm pitch saves board space versus larger QFP alternatives in space-constrained embedded systems requiring multi-port USB expansion
Applications
The USB5744T/2GX01 is used to expand a single USB 3.1 Gen 1 host port into 4 independent downstream ports in applications such as industrial embedded computers, single-board computers, medical workstations, and USB docking stations. Its flexible I2C/SPI configuration bus allows system integrators to customise VID/PID strings, over-current thresholds, and port power management without modifying the hardware layout. The high 625 MBps per-port data rate supports simultaneous streaming from multiple USB cameras, storage devices, or high-speed data acquisition peripherals.
Specifications
| Manufacturer Package Code | VQFN-56 |
| Date Of Intro | 2018-06-12 |
| YTEOL | 0 |
| Bus Compatibility | I2C; SMBUS; SPI |
| Clock Frequency-Max | 25MHz |
| Data Transfer Rate-Max | 625MBps |
| JESD-30 Code | S-PQCC-N56 |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | LCC56,.27SQ,16 |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Supply Voltage-Max | 1.32V |
| Supply Voltage-Min | 1.08V |
| Supply Voltage-Nom | 1.2V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.4mm |
| Terminal Position | QUAD |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.31.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for USB5744T/2GX01:
Frequently Asked Questions
How many downstream USB ports does the USB5744T/2GX01 support, and at what maximum data rate per port?
The USB5744T/2GX01 supports 4 downstream USB 3.1 Gen 1 ports, each capable of up to 625 MBps (5 Gbps signalling rate) throughput. The total shared bandwidth from the single upstream port is also 625 MBps, so simultaneous transfers across all 4 ports are bandwidth-shared in proportion to each device's demand.
Which configuration interfaces does the USB5744T/2GX01 support, and how can a designer customise the USB descriptor strings?
The USB5744T/2GX01 supports I2C, SMBus, and SPI configuration interfaces, allowing a host microcontroller or an external EEPROM to program custom VID, PID, manufacturer strings, and power management settings at power-up. Designers can connect a 25 MHz crystal or oscillator to the reference clock input and use the SPI/I2C port during board bring-up to load and verify the configuration without hardware changes.
Is the USB5744T/2GX01 compatible with USB 2.0 peripherals connected to its downstream ports?
Yes, the USB5744T/2GX01 is backward compatible with USB 2.0 and USB 1.1 devices. Downstream ports automatically negotiate to the highest mutually supported speed — 480 Mbps for USB 2.0 High Speed, 12 Mbps for Full Speed — so legacy peripherals such as keyboards, HID devices, and older storage devices coexist on the same hub with SuperSpeed devices.
What are the package dimensions of the VQFN-56 variant, and what soldering precautions apply at reflow?
The VQFN-56 package has a 0.4 mm pin pitch in a square body with 56 leads arranged around the perimeter plus a central exposed pad for thermal dissipation. The exposed pad should be soldered to a ground plane via an array of 0.3 mm vias to minimise thermal resistance. Reflow peak temperature should not exceed 260°C, which is the standard lead-free SAC305 reflow profile maximum.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 3000+ | $5.2700 | $15810.00 |
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