UCC27423DG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The UCC27423DG4 is a dual low-side MOSFET gate driver IC from Texas Instruments, delivering 4A peak output current with inverted output polarity and totem-pole output stage. It is housed in an 8-pin SOIC package and is optimized for driving power MOSFETs in switching power supplies. Available from stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- UCC27423DG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of UCC27423DG4?
- 4A peak totem-pole output current enabling fast switching of power MOSFETs and IGBTs with minimal gate charge losses
- Dual inverted output low-side driver configuration supporting complementary gate drive signals for half-bridge and synchronous rectification topologies
- Compact 8-pin SOIC package with standard input characteristics enabling drop-in integration with PWM controllers and digital gate drive signals
What is UCC27423DG4 used for?
The UCC27423DG4 is designed for driving power MOSFETs and IGBTs in switch-mode power supplies, DC-DC converters, and motor drive circuits where high-current gate drive with inverted output polarity is required. Its dual-channel configuration supports complementary gate drive in synchronous buck, half-bridge, and full-bridge power topologies. This device is also used in UPS systems, industrial motor controllers, and solar inverters requiring robust low-side gate drive with 4A peak current capability.
What are the specifications of UCC27423DG4?
| YTEOL | 0 |
| High Side Driver | NO |
| Input Characteristics | STANDARD |
| Interface IC Type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Number of Functions | 2 |
| Output Characteristics | TOTEM-POLE |
| Output Peak Current Limit-Nom | 4A |
| Output Polarity | INVERTED |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 1.35mA |
| Supply Voltage-Max | 15V |
| Supply Voltage-Min | 4.5V |
| Supply Voltage-Nom | 14V |
| Surface Mount | YES |
| Technology | BICMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Turn-off Time | 0.05 µs |
| Turn-on Time | 0.04 µs |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 1 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the UCC27423DG4 datasheet?
UCC27423DG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for UCC27423DG4?
Compatible alternatives and drop-in replacements for UCC27423DG4:
Frequently Asked Questions
Which power-switching stages can use UCC27423DG4?
The dual low-side driver supplies up to 4 A peak output current, supporting fast MOSFET switching in converters, motor controls, and power supplies.
How should gate-drive loading be checked during design review?
Engineers should compare MOSFET gate charge and switching frequency with the 4 A peak capability, then validate thermal behavior and timing margins.
For production qualification, which package and function details are essential?
Retain the 8-pin SOIC, dual inverted outputs, 4 A peak drive, totem-pole architecture, lead-free finish, and Texas Instruments traceability.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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