UCC27210DDARAlternatives & Equivalent Parts

About UCC27210DDAR

UCC27210DDAR is a Integrated Circuit component manufactured by Texas Instruments. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterUCC27210DDARSourceUCC27212DPRT1586041-41586042-4MCP2003-E/SN
ManufacturerTexas InstrumentsTexas InstrumentsTE ConnectivityTE ConnectivityMicrochip
Package TypeSmall Outline PackagesSmall Outline No-leadHeader, Shrouded - Right Angle PTH BoxHeader, Shrouded - Right Angle PTH BoxSmall Outline Packages
Pin Count811448
Temperature Range-40.0°C ~ 140.0°C-40.0°C ~ 150.0°C-40.0°C ~ 105.0°C-40.0°C ~ 105.0°C-40.0°C ~ 125.0°C
Price$1.1700$1.9155$0.3951$0.4493$0.8690
StockIn StockIn StockIn StockIn StockIn Stock
LifecycleACTIVEOBSOLETEACTIVEACTIVEOBSOLETE
Electrical Parameters
Pbfree CodeYes—YesYesYes
YTEOL150880
High Side DriverYESYES———
Input CharacteristicsSCHMITT TRIGGERSCHMITT TRIGGER———
Interface IC TypeHALF BRIDGE BASED MOSFET DRIVERHALF BRIDGE BASED IGBT/MOSFET DRIVER———
JESD-30 CodeR-PDSO-G8S-PDSO-N10——R-PDSO-G8
JESD-609 Codee4e4——e3
Number of Channels22———
Number of Functions11——1
Output CharacteristicsPUSH-PULLPUSH-PULL———
Output Current-Max4 A4 A———
Output Peak Current Limit-Nom4 A4.5 A———
Output PolarityTRUE————
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXY——PLASTIC/EPOXY
Package Equivalence CodeSOP8,.25SOLCC10,.16,32——SOP8,.25
Package ShapeRECTANGULARSQUARE——RECTANGULAR
Package StyleSMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILESMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE——SMALL OUTLINE
Peak Reflow Temperature (Cel)260260——260
Qualification StatusNot Qualified————
Supply Current-Max5.2 mA3 mA———
Supply Voltage-Max17 V17 V———
Supply Voltage-Min8 V5 V———
Supply Voltage-Nom12 V12 V——12 V
Supply Voltage1-Max122 V115 V———
Supply Voltage1-Min7 V7 V———
Supply Voltage1-Nom12 V12 V———
Surface MountYESYES——YES
Temperature GradeAUTOMOTIVEAUTOMOTIVE———
Terminal FinishNickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)Nickel/Palladium/Gold (Ni/Pd/Au)——Matte Tin (Sn)
Terminal FormGULL WINGNO LEAD——GULL WING
Terminal Pitch1.27 mm0.8 mm4.2 mm4.2 mm1.27 mm
Terminal PositionDUALDUAL——DUAL
Time@Peak Reflow Temperature-Max (s)3030——30
Turn-off Time0.4 µs0.03 µs———
Turn-on Time0.6 µs0.042 µs———
Date Of Intro—2017-07-10———
Factory Lead Time——15 Weeks, 5 Days15 Weeks, 5 Days6 Weeks
Additional Feature——VAL-U-LOKVAL-U-LOK—
Body Breadth——0.51 inch0.51 inch—
Body Depth——0.386 inch0.386 inch—
Body Length——0.378 inch0.378 inch—
Body/Shell Style——PLUGPLUG—
Connector Type——BOARD CONNECTORBOARD CONNECTOR—
Contact Finish Mating——NOT APPLICABLENOT APPLICABLE—
Contact Gender——MALEMALE—
Contact Material——NOT APPLICABLENOT APPLICABLE—
Contact Pattern——RECTANGULARRECTANGULAR—
Contact Style——SQ PIN-SKTSQ PIN-SKT—
DIN Conformance——NONO—
Durability——50 Cycles50 Cycles—
EMI Shielded——NONO—
Empty Shell——YESYES—
Filter Feature——NONO—
IEC Conformance——NONO—
Insertion Force-Max——6.672 N6.672 N—
Insulation Diameter-Min——2.39 inch2.39 inch—
Insulation Resistance——1000000000 Ω1000000000 Ω—
Insulator Color——NATURALNATURAL—
Insulator Material——POLYAMIDEPOLYAMIDE—
MIL Conformance——NONO—
Mains Connector Rating——9A9A—
Mating Contact Pitch——0.165 inch0.165 inch—
Mating Contact Row Spacing——0.165 inch0.165 inch—
Mixed Contacts——NONO—
Mounting Option 1——LOCKINGGUIDE SLOT—
Mounting Option 2——LATCHINGLATCHING—
Mounting Style——RIGHT ANGLERIGHT ANGLE—
Mounting Type——BOARDBOARD—
Number Of Connectors——ONEONE—
Number Of PCB Rows——22—
Number of Ports——11—
Number of Rows Loaded——22—
Option——GENERAL PURPOSEGENERAL PURPOSE—
PCB Contact Pattern——RECTANGULARRECTANGULAR—
PCB Contact Row Spacing——5.5118 mm5.5118 mm—
Panel Mount——NONO—
Plating Thickness——200u inch80u inch—
Polarization Key——POLARIZEDPOLARIZED—
Rated Current (Signal)——9 A9 A—
Reference Standard——CSA, ULCSA, UL—
Terminal Length——0.14 inch0.14 inch—
Termination Type——SOLDERSOLDER—
Total Number of Contacts——44—
UL Flammability Code——94V-294V-0—
Withdrawl Force-Min——.5004 N——
PCB Mount Orientation Right Angle——Number of Positions 4Number of Power Positions 4—
Contact Features: Contact Retention Within Housing Without——Contact Layout Matrix——
Contact Mating Area Plating Material Thickness 2.03 – 5.08 MICM——Contact Type Pin——
Contact Layout Inline——Contact Layout Square Grid——
Contact Resistance———10 mΩ—
Contact Features: PCB Contact Termination Area Plating Material Tin———Contact Type Pin—
Contact Mating Area Plating Material Thickness 2.03 MICM———Contact Layout Inline—
Contact Layout Square Grid———Contact Layout Matrix—
Manufacturer Package Code————SOIC-8
Number of Transceivers————1
Screening Level————TS 16949
Telecom IC Type————LIN TRANSCEIVER
## MCP2003-E/SN Alternates Showing results————Image

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

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Get one quote covering all 4 alternatives for UCC27210DDAR — response within 24 hours.

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Why Look for Alternatives?

Finding alternatives for UCC27210DDAR is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating UCC27210DDAR replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to UCC27210DDAR?

Known equivalents for UCC27210DDAR include UCC27212DPRT, 1586041-4, 1586042-4. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of UCC27210DDAR?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify UCC27210DDAR alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.