UC37133DG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The Texas Instruments UC37133DG4 is a 1-channel intelligent power switch in an 8-pin SOIC package. It features built-in overcurrent and transient protection with up to 0.4A source output current. Available from stock worldwide with competitive pricing.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 8
- Lifecycle
- OBSOLETE
- Datasheet
- UC37133DG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- ?°C to 70.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of UC37133DG4?
- 1-channel intelligent power switch with open-emitter output configuration for flexible load control
- Built-in transient and overcurrent protection for robust system reliability
- Compact 8-pin SOIC package with 0.4A maximum source output current
What is UC37133DG4 used for?
The UC37133DG4 is well-suited for industrial automation and automotive peripherals where reliable load switching is required. Its built-in protection features make it ideal for driving solenoids, relays, and other inductive loads. The device is commonly used in buffer or inverter-based peripheral driver circuits requiring source current output.
What are the specifications of UC37133DG4?
| YTEOL | 0 |
| Built-in Protections | TRANSIENT; OVER CURRENT |
| Driver Number of Bits | 1 |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 Code | R-PDSO-G8 |
| JESD-609 Code | e4 |
| Number of Functions | 1 |
| Output Characteristics | OPEN-EMITTER |
| Output Current Flow Direction | SOURCE |
| Output Current-Max | 0.4A |
| Output Peak Current Limit-Nom | 0.9A |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | SOP8,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 4mA |
| Supply Voltage-Max | 65V |
| Supply Voltage-Min | 8V |
| Supply Voltage-Nom | 25V |
| Surface Mount | YES |
| Technology | BIPOLAR |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | NICKEL PALLADIUM GOLD |
| Terminal Form | GULL WING |
| Terminal Pitch | 1.27mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Turn-off Time | 6 µs |
| Turn-on Time | 6 µs |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.60 |
Where can I find the UC37133DG4 datasheet?
UC37133DG4 Datasheet DownloadOfficial datasheet from Texas Instruments
What are equivalent replacements for UC37133DG4?
Compatible alternatives and drop-in replacements for UC37133DG4:
Frequently Asked Questions
What is the maximum output current of the UC37133DG4?
The UC37133DG4 supports a maximum output current of 0.4A in source configuration. This makes it suitable for driving small actuators, relays, and indicator loads within that current range.
What protection features does the UC37133DG4 include?
The UC37133DG4 includes built-in transient and overcurrent protection. These features help safeguard the device and system from voltage spikes and excessive current draw, improving overall reliability in harsh environments.
What package does the UC37133DG4 use and how many pins does it have?
The UC37133DG4 comes in an 8-pin SOIC (Small Outline IC) package, designated by JESD-30 code R-PDSO-G8. This compact SMD package is easy to handle and solder in standard PCB assembly processes.
Can the UC37133DG4 be used in automotive applications?
The UC37133DG4 is a general-purpose intelligent power switch from Texas Instruments that can be used in automotive peripheral driver designs. Verify specific AEC-Q100 qualification requirements for your application before use.
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Why Buy from FindMyChip
About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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