UC1707J883B Texas Instruments Integrated Circuit (Ceramic Dual-In-Line Packages) In Stock
UC1707J883B is a dual-channel MOSFET gate driver IC with 1.5 A totem-pole outputs in a 16-pin ceramic DIP package, supporting standard CMOS/TTL input logic. Available in stock worldwide with fast shipping.
- Manufacturer
- Texas Instruments
- Package
- Ceramic Dual-In-Line Packages
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- UC1707J883B Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-channel totem-pole gate driver with 1.5 A peak output current per channel for fast MOSFET switching
- Standard CMOS/TTL-compatible input thresholds enable direct interface to microcontroller PWM outputs
- 16-pin ceramic DIP (CDIP) package rated for military-grade temperature range per MIL-STD-883B qualification
Applications
UC1707J883B is used in power converter gate-drive stages where two independent MOSFET switches require fast, high-current turn-on and turn-off pulses. It suits DC-DC converters, motor driver bridges, and PWM inverter designs operating in harsh environments. The military-grade ceramic package makes it suitable for aerospace, defense, and high-reliability industrial control applications.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| High Side Driver | NO |
| Input Characteristics | STANDARD |
| Interface IC Type | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 Code | R-GDIP-T16 |
| JESD-609 Code | e0 |
| Number of Channels | 2 |
| Number of Functions | 2 |
| Output Characteristics | TOTEM-POLE |
| Output Current-Max | 1.5A |
| Output Peak Current Limit-Nom | 1.5A |
| Output Polarity | COMPLEMENTARY |
| Package Body Material | CERAMIC, GLASS-SEALED |
| Package Equivalence Code | DIP16,.3 |
| Package Shape | RECTANGULAR |
| Package Style | IN-LINE |
| Qualification Status | Not Qualified |
| Screening Level | MIL-STD-883 |
| Supply Current-Max | 15mA |
| Supply Voltage-Max | 40V |
| Supply Voltage-Min | 5V |
| Supply Voltage-Nom | 20V |
| Surface Mount | NO |
| Technology | BIPOLAR |
| Temperature Grade | MILITARY |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Terminal Form | THROUGH-HOLE |
| Terminal Pitch | 2.54mm |
| Terminal Position | DUAL |
| Turn-off Time | 0.05 µs |
| Turn-on Time | 0.05 µs |
| Package | Ceramic Dual-In-Line Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What peak output current can UC1707J883B deliver to drive power MOSFETs?
UC1707J883B provides up to 1.5 A peak totem-pole output current per channel, enabling fast charge and discharge of MOSFET gate capacitances in switching power supplies and motor drivers. This high drive capability reduces switching transition times and minimizes switching losses.
How many independent gate drive channels does UC1707J883B include, and how are inputs configured?
UC1707J883B includes 2 independent gate drive channels in a 16-pin CDIP package, each accepting standard CMOS/TTL-compatible input signals. The standard input characteristics allow direct connection to microcontroller PWM outputs operating at 3.3 V or 5 V logic levels without additional level-shifting circuitry.
In which high-reliability or military applications is UC1707J883B preferred over commercial-grade drivers?
UC1707J883B is qualified to MIL-STD-883B and housed in a ceramic DIP package, making it the preferred choice for aerospace power conditioning, military radar systems, and space-grade power electronics. The ceramic package withstands temperatures from -55°C to +125°C, far exceeding plastic-package commercial alternatives. Its JESD-609 code e0 confirms lead-bearing construction per the original military specification.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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