U2510B-M Microchip Integrated Circuit (Dual-In-Line Packages) In Stock
The U2510B-M is an AM/FM audio mixer and amplifier IC in a 28-pin SDIP package from Microchip, integrating RF mixing and audio amplification functions for radio receiver designs. Supports AM and FM frequency bands with low external component count.
- Manufacturer
- Microchip
- Package
- Dual-In-Line Packages
- Pin Count
- 28
- Lifecycle
- ACTIVE
- Datasheet
- U2510B-M Datasheet PDF
- Category
- Integrated Circuit
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Integrated AM/FM mixer and audio amplifier in a single IC
- 28-pin SDIP package for through-hole assembly
- Low external component count for simplified radio receiver design
- Supports both AM and FM frequency bands
Applications
The U2510B-M is suited for AM/FM radio receiver circuits in consumer electronics and automotive audio systems. Its integrated mixer and amplifier reduce board space requirements, making it ideal for compact portable radios and car radio head units.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What frequency bands does the U2510B-M support for radio reception?
The U2510B-M supports both AM (medium wave, approximately 530 kHz to 1700 kHz) and FM (approximately 88 MHz to 108 MHz) frequency bands, integrating the mixer and audio amplifier stages for both bands in a single 28-pin SDIP package.
How many pins does the U2510B-M have, and what package type is it?
The U2510B-M comes in a 28-pin SDIP (Shrink Dual In-line Package) through-hole package, providing 28 pins for connections including RF inputs, audio outputs, power supply, and ground references for AM/FM radio circuits.
In which applications is the U2510B-M typically used?
The U2510B-M is used in AM/FM radio receivers, portable radios, and automotive audio systems. Its integrated mixer and amplifier on a single chip reduce external component count, enabling designs with fewer than 10 support components around the IC.
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