TSW-212-15-G-T SAMTEC Connector (Header, Vertical) In Stock

SAMTEC TSW-212-15-G-T is a 36-way dual-row vertical through-hole header with 0.100" (2.54 mm) pitch and gold-plated contacts. Provides 12 positions per row with 10 µin gold over nickel contact finish for corrosion-resistant signal connections. Available from stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TSW-212-15-G-THeader, Vertical
Quick Facts
Manufacturer
SAMTEC
Package
Header, Vertical
Pin Count
36
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 36-way dual-row vertical THT header on 0.100" (2.54 mm) pitch for broad compatibility with standard PCB grid layouts and mating socket strips
  • Gold (10 µin Au) mating contact finish over nickel barrier delivers low contact resistance and long service life across repeated mating cycles
  • 2.3 inch body length provides a single-connector solution for high channel-count backplane, expansion, and board-to-board signal routing

Applications

The TSW-212-15-G-T is used in backplane and mezzanine interconnect systems, expansion card slots, and modular industrial control boards requiring a high pin-count through-hole header with gold contacts. Its 36-way dual-row vertical orientation mates with standard TSW-series or compatible socket connectors in embedded computing and test equipment platforms. The connector is also found in evaluation kits and prototyping boards where a reliable, solderable 0.100" pitch 36-contact header is needed for signal breakout and debugging.

Specifications

Pbfree CodeYes
YTEOL10
Body Breadth0.3inch
Body Depth0.1inch
Body Length2.3inch
Body/Shell StyleRECEPTACLE
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (10)
Contact Finish TerminationGold (Au) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialPOLYBUTYLENE TEREPHTHALATE
JESD-609 Codee4
MIL ConformanceNO
Mating Contact Pitch0.1inch
Mating Contact Row Spacing0.1inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows3
Number of Rows Loaded3
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing2.54mm
Plating Thickness10u inch
Rated Current (Signal)5.2A
Reference StandardUL
Terminal Pitch5.08mm
Termination TypeSOLDER
Total Number of Contacts36
UL Flammability Code94V-0
PackageHeader, Vertical

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginUSA

Datasheet

TSW-212-15-G-T Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What distinguishes the TSW-212-15-G-T from the TSW-212-09-G-T in terms of specifications?

Both connectors are 36-way dual-row through-hole headers on 0.100" (2.54 mm) pitch with gold (10 µin Au) contact finish, but the -15 suffix denotes a 0.15 inch post length above the insulator versus the -09 suffix's 0.09 inch post, affecting the mating depth and standoff height for different socket or mating-connector configurations.

What is the contact finish specification of the TSW-212-15-G-T and why is it significant?

The TSW-212-15-G-T uses a 10 µin gold (Au) mating contact finish over a nickel (Ni) barrier layer, providing corrosion resistance and maintaining contact resistance well below 20 mΩ. This finish is significant for applications requiring reliable signal integrity after 100 or more mating cycles in industrial or test environments.

Which board interconnect scenarios benefit from the TSW-212-15-G-T 36-way header?

The 36-contact, 0.100" pitch vertical through-hole header suits backplane-to-daughterboard connections in industrial PLCs, expansion slots in embedded computing modules, and high channel-count signal routing on evaluation and prototyping boards where 36 pins must be bridged in a single compact 2.3 inch connector.

How does the through-hole mounting of the TSW-212-15-G-T compare to surface mount alternatives for reliability?

Through-hole mounting creates solder joints that penetrate the PCB, providing greater mechanical pull-out strength—typically 5 N to 10 N per pin—compared to SMT solder joints. This makes the TSW-212-15-G-T preferable in applications subject to vibration, repeated mating forces, or connector bodies that extend more than 5 mm above the board surface.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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