TSV632AIDTAlternatives & Equivalent Parts

About TSV632AIDT

TSV632AIDT is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.

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Specification Comparison

ParameterTSV632AIDTSourceTSV632AISTTSV632AIQ2T
ManufacturerSTMicroelectronicsSTMicroelectronicsSTMicroelectronics
Package TypeSmall Outline PackagesSmall Outline PackagesSmall Outline No-lead
Pin Count889
Temperature Range-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C-40.0°C ~ 125.0°C
Price$0.4027$0.7550$0.6868
StockIn StockIn StockIn Stock
LifecycleACTIVEACTIVEACTIVE
Electrical Parameters
Factory Lead Time12 Weeks12 Weeks18 Weeks
YTEOL888
Amplifier TypeOPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIEROPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACKVOLTAGE-FEEDBACKVOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)0.0001 µA0.0001 µA0.0001 µA
Bias Current-Max (IIB) @25C0.00001 µA0.00001 µA0.00001 µA
Common-mode Reject Ratio-Min53 dB53 dB53 dB
Common-mode Reject Ratio-Nom74 dB74 dB74 dB
Frequency CompensationYESYESYES
Input Offset Voltage-Max2200 µV2000 µV2000 µV
JESD-30 CodeR-PDSO-G8S-PDSO-G8R-PDSO-N8
JESD-609 Codee4e3e4
Low-BiasYESYESYES
Low-OffsetNONONO
MicropowerYESYESYES
Number of Functions888
Package Body MaterialPLASTIC/EPOXYPLASTIC/EPOXYPLASTIC/EPOXY
Package Equivalence CodeSOP8,.25TSSOP8,.19SOLCC8,.08,20
Package ShapeRECTANGULARSQUARERECTANGULAR
Package StyleSMALL OUTLINESMALL OUTLINE, THIN PROFILE, SHRINK PITCHSMALL OUTLINE
Packing MethodTRTRTR
Peak Reflow Temperature (Cel)260260260
PowerNONONO
Programmable PowerNONONO
Qualification StatusNot QualifiedNot QualifiedNot Qualified
Slew Rate-Min0.2 V/us0.2 V/us0.2 V/us
Slew Rate-Nom0.27 V/us0.27 V/us0.27 V/us
Supply Current-Max0.124 mA0.124 mA0.144 mA
Supply Voltage Limit-Max6 V6 V6 V
Supply Voltage-Nom (Vsup)1.8 V1.8 V1.8 V
Surface MountYESYESYES
TechnologyCMOSCMOSCMOS
Temperature GradeAUTOMOTIVEAUTOMOTIVEAUTOMOTIVE
Terminal FinishNickel/Palladium/Gold (Ni/Pd/Au)Matte Tin (Sn) - annealedNickel/Palladium/Gold (Ni/Pd/Au)
Terminal FormGULL WINGGULL WINGNO LEAD
Terminal Pitch1.27 mm0.65 mm0.5 mm
Terminal PositionDUALDUALDUAL
Time@Peak Reflow Temperature-Max (s)303030
Unity Gain BW-Nom790790830
Voltage Gain-Min100001000010000
WidebandNONONO

Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.

Need pricing on these alternatives?

Get one quote covering all 2 alternatives for TSV632AIDT — response within 24 hours.

Quick Links

TSV632AISTby STMicroelectronics

Operational Amplifier, 8 Func, 2000uV Offset-Max, CMOS, PDSO2

TSV632AIQ2Tby STMicroelectronics

Operational Amplifier, 8 Func, 2000uV Offset-Max, CMOS, PDSO2

Why Look for Alternatives?

Finding alternatives for TSV632AIDT is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.

When evaluating TSV632AIDT replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.

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FAQ

What is equivalent to TSV632AIDT?

Known equivalents for TSV632AIDT include TSV632AIST, TSV632AIQ2T. Contact FindMyChip for a full compatibility analysis for your specific application.

Can I use a different manufacturer's part instead of TSV632AIDT?

In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.

How do I verify TSV632AIDT alternatives?

Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.