TSV324IPTAlternatives & Equivalent Parts
About TSV324IPT
TSV324IPT is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
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Specification Comparison
| Parameter | TSV324IPTSource | TSV324IYPT |
|---|---|---|
| Manufacturer | STMicroelectronics | STMicroelectronics |
| Package Type | Small Outline Packages | Small Outline Packages |
| Pin Count | 14 | 14 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $0.5184 | $0.8130 |
| Stock | In Stock | In Stock |
| Lifecycle | ACTIVE | ACTIVE |
| Electrical Parameters | ||
| Factory Lead Time | 20 Weeks | 20 Weeks |
| YTEOL | 8 | 8 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.15 µA | 0.15 µA |
| Bias Current-Max (IIB) @25C | 0.13 µA | 0.125 µA |
| Common-mode Reject Ratio-Min | 60 dB | 60 dB |
| Common-mode Reject Ratio-Nom | 80 dB | 80 dB |
| Frequency Compensation | YES | YES |
| Input Offset Voltage-Max | 3000 µV | 3000 µV |
| JESD-30 Code | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 Code | e4 | e4 |
| Low-Bias | NO | NO |
| Low-Offset | NO | NO |
| Micropower | YES | YES |
| Number of Functions | 14 | 14 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP14,.25 | TSSOP14,.25 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Packing Method | TR | TR |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED |
| Power | NO | NO |
| Programmable Power | NO | NO |
| Qualification Status | Not Qualified | Not Qualified |
| Slew Rate-Min | 0.42 V/us | 0.42 V/us |
| Slew Rate-Nom | 0.6 V/us | 0.6 V/us |
| Supply Current-Max | 3.34 mA | 3.5 mA |
| Supply Voltage Limit-Max | 7 V | 7 V |
| Supply Voltage-Nom (Vsup) | 3 V | 3 V |
| Surface Mount | YES | YES |
| Technology | BICMOS | BICMOS |
| Temperature Grade | AUTOMOTIVE | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING | GULL WING |
| Terminal Pitch | 0.65 mm | 0.65 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED |
| Unity Gain BW-Nom | 1300 | 1300 |
| Voltage Gain-Min | 5000 | 5011 |
| Wideband | NO | NO |
| Input Offset Current-Max (IIO) | — | 0.06 µA |
| Screening Level | — | AEC-Q100 |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
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Quick Links
Why Look for Alternatives?
Finding alternatives for TSV324IPT is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TSV324IPT replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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FAQ
What is equivalent to TSV324IPT?
Known equivalents for TSV324IPT include TSV324IYPT. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TSV324IPT?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TSV324IPT alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.