TSV324IDAlternatives & Equivalent Parts
About TSV324ID
TSV324ID is a Integrated Circuit component manufactured by STMicroelectronics. It comes in a Small Outline Packages package. Below you'll find known alternative and equivalent parts that can serve as replacements in your design.
Specification Comparison
| Parameter | TSV324IDSource | TSV324IDT |
|---|---|---|
| Manufacturer | STMicroelectronics | STMicroelectronics |
| Package Type | Small Outline Packages | Small Outline Packages |
| Pin Count | 14 | 14 |
| Temperature Range | -40.0°C ~ 125.0°C | -40.0°C ~ 125.0°C |
| Price | $0.5960 | $0.5213 |
| Electrical Parameters | ||
| YTEOL | 0 | 8 |
| Amplifier Type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| Average Bias Current-Max (IIB) | 0.15 µA | 0.15 µA |
| Bias Current-Max (IIB) @25C | 0.13 µA | 0.13 µA |
| Common-mode Reject Ratio-Min | 65 dB | 60 dB |
| Common-mode Reject Ratio-Nom | 80 dB | 80 dB |
| Frequency Compensation | YES | YES |
| Input Offset Voltage-Max | 3000 µV | 3000 µV |
| JESD-30 Code | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609 Code | e4 | e3 |
| Low-Bias | NO | NO |
| Low-Offset | NO | NO |
| Micropower | YES | YES |
| Number of Functions | 14 | 14 |
| Package Body Material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package Equivalence Code | SOP14,.25 | SOP14,.25 |
| Package Shape | RECTANGULAR | RECTANGULAR |
| Package Style | SMALL OUTLINE | SMALL OUTLINE |
| Packing Method | TUBE | TR |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | NOT SPECIFIED |
| Power | NO | NO |
| Programmable Power | NO | NO |
| Qualification Status | Not Qualified | Not Qualified |
| Slew Rate-Min | 0.42 V/us | 0.42 V/us |
| Slew Rate-Nom | 0.6 V/us | 0.6 V/us |
| Supply Current-Max | 3.34 mA | 3.34 mA |
| Supply Voltage Limit-Max | 7 V | 7 V |
| Supply Voltage-Nom (Vsup) | 3 V | 3 V |
| Surface Mount | YES | YES |
| Technology | BICMOS | BICMOS |
| Temperature Grade | AUTOMOTIVE | AUTOMOTIVE |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) |
| Terminal Form | GULL WING | GULL WING |
| Terminal Pitch | 1.27 mm | 1.27 mm |
| Terminal Position | DUAL | DUAL |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | NOT SPECIFIED |
| Unity Gain BW-Nom | 1300 | 1300 |
| Voltage Gain-Min | 5000 | 5000 |
| Wideband | NO | NO |
| Factory Lead Time | — | 10 Weeks |
Cells highlighted in yellow indicate differing values across parts. Always verify with official datasheets before substitution.
Quick Links
Why Look for Alternatives?
Finding alternatives for TSV324ID is essential for supply chain resilience. Component shortages, long lead times, and end-of-life notices can disrupt production schedules. Having verified alternative parts ensures your designs remain manufacturable.
When evaluating TSV324ID replacements, consider key parameters such as package compatibility, electrical specifications, and operating temperature range. Our engineering team can help verify pin-to-pin compatibility for your specific application.
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Request Alternatives for TSV324IDFAQ
What is equivalent to TSV324ID?
Known equivalents for TSV324ID include TSV324IDT. Contact FindMyChip for a full compatibility analysis for your specific application.
Can I use a different manufacturer's part instead of TSV324ID?
In many cases, yes. Cross-manufacturer alternatives exist for most standard components. However, always verify pin compatibility, electrical specs, and package dimensions before substituting in production.
How do I verify TSV324ID alternatives?
Compare the datasheet specifications including pinout, voltage ratings, timing parameters, and package dimensions. FindMyChip's engineering team can help with compatibility verification — submit an RFQ to get started.