TST-130-03-G-D SAMTEC Connector (Other) In Stock
SAMTEC TST-130-03-G-D is a 60-position shrouded PCB header with 0.100 inch pitch, dual-row male connector featuring gold over nickel mating contacts and phosphor bronze construction for reliable board-to-board interconnection.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TST-130-03-G-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row shrouded PCB header with 0.100 inch (2.54 mm) pitch for standard density board connections
- Gold (10 microinch) over nickel (50 microinch) mating contacts for superior corrosion resistance and low contact resistance
- Phosphor bronze contact material with gold and nickel barrier termination for long-lasting solder joint reliability
Applications
The TST-130-03-G-D shrouded PCB header is commonly used in backplane systems, industrial control modules, and embedded computing platforms requiring robust 60-position dual-row connectivity. Its 0.100 inch pitch and shrouded design prevent misalignment during mating, making it ideal for rack-mounted equipment and server expansion cards. The gold over nickel contact finish ensures reliable signal integrity in demanding environments with repeated mating cycles.
Specifications
| YTEOL | 9.1 |
| Body Breadth | 0.365inch |
| Body Depth | 0.365inch |
| Body Length | 3.3inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Gold (Au) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | GLASS FILLED POLYESTER |
| JESD-609 Code | e4 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 2.54mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZATION NOTCH |
| Terminal Length | 0.565inch |
| Terminal Pitch | 2.54mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 60 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TST-130-03-G-D PCB header support?
The TST-130-03-G-D is a 60-position shrouded PCB header arranged in a dual-row configuration with 0.100 inch (2.54 mm) pitch. This standard pitch allows compatibility with a wide range of mating connectors and is suitable for high-density board-to-board interconnect applications.
What contact finish is used on the mating surfaces of the TST-130-03-G-D?
The TST-130-03-G-D features gold (10 microinch) over nickel (50 microinch) mating contact finish, which provides excellent corrosion resistance and low contact resistance. The termination side uses gold with a nickel barrier for reliable soldering, maintaining signal integrity across operating temperatures up to 125°C.
What design advantage does the shrouded housing of TST-130-03-G-D offer over unshrouded headers?
The shrouded housing of the TST-130-03-G-D with 3.3 inch body length and 0.365 inch depth guides the mating connector to prevent misalignment and accidental reverse insertion. This keying feature reduces assembly errors in high-density PCB environments with 60 pins, making it preferred for industrial backplanes and server expansion systems.
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